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    • 1. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
    • 半导体器件和半导体器件的制造方法
    • US20090102017A1
    • 2009-04-23
    • US12247315
    • 2008-10-08
    • Yong-kug BAESi-hyeung LEETae-hyuk AHNSeok-hwan OH
    • Yong-kug BAESi-hyeung LEETae-hyuk AHNSeok-hwan OH
    • H01L27/108
    • H01L27/10894H01L27/10852H01L28/91
    • A semiconductor device and a method of fabricating a semiconductor device provide high quality cylindrical capacitors. The semiconductor device includes a substrate defining a cell region and a peripheral circuit region, a plurality of capacitors in the cell region, and supports for supporting lower electrodes of the capacitors. The lower electrodes are disposed in a plurality of rows each extending in a first direction. A dielectric layer is disposed on the lower electrodes, and an upper electrode is disposed on the dielectric layer. The supports are in the form of stripes extending longitudinally in the first direction and spaced from each other along a second direction. Each of the supports engages the lower electrodes of a respective plurality of adjacent rows of the lower electrodes. Each one of the supports is also disposed at a different level in the device from the support that is adjacent thereto in the second direction.
    • 半导体器件和制造半导体器件的方法提供高质量的圆柱形电容器。 半导体器件包括限定单元区域和外围电路区域的基板,单元区域中的多个电容器以及用于支撑电容器的下部电极的支撑。 下电极配置成沿着第一方向延伸的多列。 电介质层设置在下电极上,上电极设置在电介质层上。 支撑体是沿着第一方向纵向延伸并且沿着第二方向彼此间隔开的条纹的形式。 每个支撑件接合下电极的相应多个相邻行的下电极。 每个支撑件还设置在与第二方向相邻的支撑件处于装置中的不同水平处。
    • 6. 发明申请
    • INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE WITH OVERLAY KEY AND ALIGNMENT KEY AND METHOD OF FABRICATING THE SAME
    • 具有覆盖键和对准的集成电路半导体器件及其制造方法
    • US20080203590A1
    • 2008-08-28
    • US12111651
    • 2008-04-29
    • Chang-Jin KANGMyeong-Cheol KIMMan-Hyoung RYOOSi-Hyeung LEEDoo-Youl LEE
    • Chang-Jin KANGMyeong-Cheol KIMMan-Hyoung RYOOSi-Hyeung LEEDoo-Youl LEE
    • H01L23/544
    • H01L23/544G03F7/70633G03F9/7076G03F9/708G03F9/7084H01L2223/54453H01L2924/0002H01L2924/00
    • An integrated circuit semiconductor device including a cell region formed in a first portion of a silicon substrate, the cell region including a first trench formed in the silicon substrate, a first buried insulating layer filled in the first trench, a first insulating pattern formed over the silicon substrate, and a first conductive pattern formed over the first insulating pattern. An overlay key region is formed in a second portion of the silicon substrate and includes a second trench formed in the silicon substrate, a second insulating pattern formed over the silicon substrate and used as an overlay key, and a second conductive pattern formed over the second insulating pattern and formed by correcting overlay and alignment errors using the second insulating pattern. An alignment key region is formed in a third portion of the silicon substrate and includes a third trench formed in the silicon substrate and used as an alignment key, a second buried insulating layer formed in the third trench, and a third conductive pattern formed over the second buried insulating layer and the third trench.
    • 一种集成电路半导体器件,包括形成在硅衬底的第一部分中的单元区域,所述单元区域包括形成在所述硅衬底中的第一沟槽,填充在所述第一沟槽中的第一掩埋绝缘层,形成在所述第一沟槽上的第一绝缘图案 硅衬底和形成在第一绝缘图案上的第一导电图案。 覆盖键区域形成在硅衬底的第二部分中,并且包括在硅衬底中形成的第二沟槽,形成在硅衬底上并用作覆盖键的第二绝缘图案,以及形成在第二衬底上的第二导电图案 绝缘图案,并且通过使用第二绝缘图案校正覆盖和对准误差而形成。 对准键区域形成在硅衬底的第三部分中,并且包括形成在硅衬底中并用作对准键的第三沟槽,形成在第三沟槽中的第二掩埋绝缘层和形成在第三沟槽上的第三导电图案 第二掩埋绝缘层和第三沟槽。
    • 7. 发明申请
    • Method of forming trench in semiconductor device
    • 在半导体器件中形成沟槽的方法
    • US20050266646A1
    • 2005-12-01
    • US11080891
    • 2005-03-16
    • Doo-hoon GooSi-hyeung LeeHan-ku ChoSang-gyun WooGi-sung Yeo
    • Doo-hoon GooSi-hyeung LeeHan-ku ChoSang-gyun WooGi-sung Yeo
    • H01L21/76H01L21/00H01L21/308H01L21/8242H01L27/02
    • H01L27/10876H01L21/3083H01L27/0207
    • There are provided a method of forming a trench for a recessed channel of a transistor and a layout for the same. A layout for the recessed channel according to one aspect of the present invention is formed such that an open region is extended across at least one of a first active region in a lateral direction, and also across another second active region in parallel with the first active region in a diagonal direction, and the extension is cut not to reach an isolation region between two third active regions that are in parallel with the second active region in a diagonal direction, and have noses facing each other in a longitudinal direction, and the layout includes an alignment of a plurality of open regions, which are discontinuously aligned. An etch mask is formed using the layout, and a semiconductor substrate is etched using the etch mask, and a trench for a recessed channel is formed on the active region.
    • 提供了一种形成用于晶体管的凹槽的沟槽的方法及其布局。 根据本发明的一个方面的凹陷通道的布局被形成为使得开放区域跨越横向方向上的第一有源区域中的至少一个延伸,并且还跨越与第一活性物体平行的另一个第二有源区域 区域,并且延伸部被切割成不能在对角线方向上到达与第二有源区域平行的两个第三有源区域之间的隔离区域,并且在纵向方向上具有彼此面对的鼻子,并且布局 包括不连续对准的多个开放区域的对准。 使用布局形成蚀刻掩模,并且使用蚀刻掩模蚀刻半导体衬底,并且在有源区上形成用于凹陷沟道的沟槽。
    • 9. 发明授权
    • Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same
    • 具有覆盖键和对准键的集成电路半导体器件及其制造方法
    • US08080886B2
    • 2011-12-20
    • US12111651
    • 2008-04-29
    • Chang-Jin KangMyeong-Cheol KimMan-Hyoung RyooSi-Hyeung LeeDoo-Youl Lee
    • Chang-Jin KangMyeong-Cheol KimMan-Hyoung RyooSi-Hyeung LeeDoo-Youl Lee
    • H01L23/544
    • H01L23/544G03F7/70633G03F9/7076G03F9/708G03F9/7084H01L2223/54453H01L2924/0002H01L2924/00
    • An integrated circuit semiconductor device including a cell region formed in a first portion of a silicon substrate, the cell region including a first trench formed in the silicon substrate, a first buried insulating layer filled in the first trench, a first insulating pattern formed over the silicon substrate, and a first conductive pattern formed over the first insulating pattern. An overlay key region is formed in a second portion of the silicon substrate and includes a second trench formed in the silicon substrate, a second insulating pattern formed over the silicon substrate and used as an overlay key, and a second conductive pattern formed over the second insulating pattern and formed by correcting overlay and alignment errors using the second insulating pattern. An alignment key region is formed in a third portion of the silicon substrate and includes a third trench formed in the silicon substrate and used as an alignment key, a second buried insulating layer formed in the third trench, and a third conductive pattern formed over the second buried insulating layer and the third trench.
    • 一种集成电路半导体器件,包括形成在硅衬底的第一部分中的单元区域,所述单元区域包括形成在所述硅衬底中的第一沟槽,填充在所述第一沟槽中的第一掩埋绝缘层,形成在所述第一沟槽上的第一绝缘图案 硅衬底和形成在第一绝缘图案上的第一导电图案。 覆盖键区域形成在硅衬底的第二部分中,并且包括在硅衬底中形成的第二沟槽,形成在硅衬底上并用作覆盖键的第二绝缘图案,以及形成在第二衬底上的第二导电图案 绝缘图案,并且通过使用第二绝缘图案校正覆盖和对准误差而形成。 对准键区域形成在硅衬底的第三部分中,并且包括形成在硅衬底中并用作对准键的第三沟槽,形成在第三沟槽中的第二掩埋绝缘层和形成在第三沟槽上的第三导电图案 第二掩埋绝缘层和第三沟槽。
    • 10. 发明授权
    • Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same
    • 具有覆盖键和对准键的集成电路半导体器件及其制造方法
    • US07381508B2
    • 2008-06-03
    • US10867468
    • 2004-06-14
    • Chang-Jin KangMyeong-Cheol KimMan-Hyoung RyooSi-Hyeung LeeDoo-Youl Lee
    • Chang-Jin KangMyeong-Cheol KimMan-Hyoung RyooSi-Hyeung LeeDoo-Youl Lee
    • G03F9/00G03F7/20
    • H01L23/544G03F7/70633G03F9/7076G03F9/708G03F9/7084H01L2223/54453H01L2924/0002H01L2924/00
    • An integrated circuit semiconductor device including a cell region formed in a first portion of a silicon substrate, the cell region including a first trench formed in the silicon substrate, a first buried insulating layer filled in the first trench, a first insulating pattern formed over the silicon substrate, and a first conductive pattern formed over the first insulating pattern. An overlay key region is formed in a second portion of the silicon substrate and includes a second trench formed in the silicon substrate, a second insulating pattern formed over the silicon substrate and used as an overlay key, and a second conductive pattern formed over the second insulating pattern and formed by correcting overlay and alignment errors using the second insulating pattern. An alignment key region is formed in a third portion of the silicon substrate and includes a third trench formed in the silicon substrate and used as an alignment key, a second buried insulating layer formed in the third trench, and a third conductive pattern formed over the second buried insulating layer and the third trench.
    • 一种集成电路半导体器件,包括形成在硅衬底的第一部分中的单元区域,所述单元区域包括形成在所述硅衬底中的第一沟槽,填充在所述第一沟槽中的第一掩埋绝缘层,形成在所述第一沟槽上的第一绝缘图案 硅衬底和形成在第一绝缘图案上的第一导电图案。 覆盖键区域形成在硅衬底的第二部分中,并且包括在硅衬底中形成的第二沟槽,形成在硅衬底上并用作覆盖键的第二绝缘图案,以及形成在第二衬底上的第二导电图案 绝缘图案,并且通过使用第二绝缘图案校正覆盖和对准误差而形成。 对准键区域形成在硅衬底的第三部分中,并且包括形成在硅衬底中并用作对准键的第三沟槽,形成在第三沟槽中的第二掩埋绝缘层和形成在第三沟槽上的第三导电图案 第二掩埋绝缘层和第三沟槽。