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31. 发明授权

US07576362B2 Semiconductor device having EL element, integrated circuit and adhesive layer therebetween 有权
标题翻译：具有EL元件，集成电路和其间的粘合剂层的半导体器件
公开(公告)号：US07576362B2
公开(公告)日：2009-08-18
申请号：US10795445
申请日：2004-03-09
申请人： Toru Takayama , Junya Maruyama , Yumiko Ohno
发明人： Toru Takayama , Junya Maruyama , Yumiko Ohno
IPC分类号： H01L27/15 , H01L29/26 , H01L31/12 , H01L33/00
CPC分类号： H01L51/5246 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L27/3244 , H01L27/3276 , H01L29/78672 , H01L51/0097 , H01L51/5237 , H01L51/5243 , H01L51/5253 , H01L51/56 , H01L2221/68368 , H01L2227/326 , H01L2251/5323
摘要： To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration can be achieved. Further, in this case, the separated layer including the CPU serves also as a sealing layer of the light-emitting element.
摘要翻译：实现使用塑料膜的高性能液晶显示装置或发光元件。 CPU形成在第一玻璃基板上，然后与第一基板分离。具有发光元件的像素部分形成在第二玻璃基板上，然后与第二基板分离。两者相互结合。因此，可以实现高集成度。此外，在这种情况下，包括CPU的分离层也用作发光元件的密封层。

32. 发明授权

US07518692B2 IC card and booking account system using the IC card 有权
标题翻译： IC卡和预订账号系统使用IC卡
公开(公告)号：US07518692B2
公开(公告)日：2009-04-14
申请号：US10739084
申请日：2003-12-19
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Mai Akiba
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Mai Akiba
IPC分类号： G02F1/1339 , G02F1/1345
CPC分类号： G06K19/07749 , G06K19/077 , G06K19/07703 , G06Q20/341 , G06Q20/40145 , G07F7/1008
摘要： It is an object of the present invention to provide a highly sophisticated functional card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. A card comprising a display device and a thin film integrated circuit; wherein driving of the display device is controlled by the thin film integrated circuit; a semiconductor element used for the thin film integrated circuit and the display device is formed by using a polycrystalline semiconductor film; the thin film integrated circuit and the display device are sealed with a resin between a first substrate and a second substrate of the card; and the first substrate and the second substrate are plastic substrates.
摘要翻译：本发明的目的是提供一种高度复杂的功能卡，其可以通过防止诸如改变脸部照片的伪造，以及显示其他图像以及脸部照片来确保安全性。一种包括显示装置和薄膜集成电路的卡; 其中所述显示装置的驱动由所述薄膜集成电路控制; 通过使用多晶半导体膜形成用于薄膜集成电路的半导体元件和显示装置; 薄膜集成电路和显示装置用卡在第一基板和第二基板之间的树脂密封; 并且第一基板和第二基板是塑料基板。

33. 发明申请

US20090091014A1 Semiconductor Device Having a Flexible Printed Circuit 有权
标题翻译：具有柔性印刷电路的半导体器件
公开(公告)号：US20090091014A1
公开(公告)日：2009-04-09
申请号：US12249523
申请日：2008-10-10
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Yasuyuki Arai , Noriko Shibata
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Yasuyuki Arai , Noriko Shibata
IPC分类号： G09G3/36
CPC分类号： H01L27/1266 , H01L21/6835 , H01L27/1214 , H01L2221/68368 , H01L2224/05172 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/07811 , H01L2924/00 , H01L2224/05624 , H01L2924/00014 , H01L2224/05639 , H01L2224/05647 , H01L2224/05664 , H01L2224/05681 , H01L2224/05684 , H01L2224/05124 , H01L2224/05147 , H01L2224/05184
摘要： To provide a thin film device which becomes possible to be formed in the portion which has been considered impossible to be provided with such device by the conventional technique, and to provide a semiconductor device which occupies small space and which has high shock resistance and flexibility, a device formation layer with a thickness of at most 50 μm which was peeled from a substrate by a transfer technique is transferred to another substrate, hence, a thin film device can be formed over various substrates. For instance, a semiconductor device can be formed so as to occupy small space by pasting a thin film device which is transferred to a flexible substrate onto a rear surface of a substrate of a panel, by pasting directly a thin film device onto a rear surface of a substrate of a panel, or by transferring a thin film device to an FPC which is pasted onto a substrate of a panel.
摘要翻译：为了提供可以在通过常规技术被认为不可能设置这种器件的部分中形成的薄膜器件，并且提供占据小空间并且具有高抗冲击性和柔性的半导体器件，通过转印技术将从基板剥离的厚度最多为50μm的元件形成层转移到另一基板，因此可以在各种基板上形成薄膜器件。例如，可以通过将薄膜器件直接粘贴到背面上来形成半导体器件，以便占据较小的空间，该薄膜器件被传送到柔性衬底到面板的衬底的背面上或者通过将薄膜器件转移到贴在面板的基板上的FPC上。

34. 发明授权

US07511380B2 Semiconductor chip and method manufacturing the same 有权
标题翻译：半导体芯片和制造方法相同
公开(公告)号：US07511380B2
公开(公告)日：2009-03-31
申请号：US11420390
申请日：2006-05-25
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
IPC分类号： H01L23/48
CPC分类号： H01L27/1266 , H01L21/6835 , H01L24/29 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L27/1214 , H01L2221/68359 , H01L2221/68368 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/83205 , H01L2224/838 , H01L2224/83805 , H01L2224/83851 , H01L2224/92247 , H01L2225/0651 , H01L2225/06541 , H01L2225/06586 , H01L2225/06589 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/30105 , H01L2924/00012 , H01L2924/00 , H01L2924/01014 , H01L2924/01003 , H01L2924/01007 , H01L2924/01012 , H01L2924/01022 , H01L2224/05541 , H01L2224/05005 , H01L2224/05599
摘要： A semiconductor chip having a plurality of device formative layers that are formed into an integrated thin film is provided by a technique for transferring. According to the present invention, a semiconductor chip that is formed into a thin film and that is highly integrated can be manufactured by transferring a device formative layer with a thickness of at most 50 μm which is separated from a substrate into another substrate by a technique for transferring, and transferring another device formative layer with a thickness of at most 50 μm which is separated from another substrate to the above device formative layer, and, repeating such transferring process.
摘要翻译：通过转印技术提供具有形成为集成薄膜的多个器件形成层的半导体芯片。根据本发明，可以通过转移厚度最多为50um的器件形成层，通过技术将其从衬底分离成另一衬底而制成形成薄膜并且高度集成的半导体芯片用于转移和转移厚度至多为50um的另一器件形成层，其从另一衬底分离到上述器件形成层，并且重复该转印过程。

35. 发明申请

US20090074022A1 DUAL-WAVELENGTH SEMICONDUCTOR LASER DEVICE AND METHOD FOR FABRICATING THE SAME 失效
标题翻译：双波长半导体激光器件及其制造方法
公开(公告)号：US20090074022A1
公开(公告)日：2009-03-19
申请号：US12166703
申请日：2008-07-02
申请人： Masahiro Kume , Toru Takayama , Shouichi Takasuka , Isao Kidoguchi
发明人： Masahiro Kume , Toru Takayama , Shouichi Takasuka , Isao Kidoguchi
IPC分类号： H01S5/026
CPC分类号： H01S5/4031 , H01S5/162 , H01S5/209 , H01S5/22 , H01S5/4087
摘要： In a dual-wavelength semiconductor laser in which a first semiconductor laser element and a second semiconductor laser element are integrated onto a substrate made of a compound semiconductor, a constituent material of an etching stopper of the first semiconductor laser element is a material which allows diffusion of impurities less easily than a constituent material of an etching stopper of the second semiconductor laser element.
摘要翻译：在其中将第一半导体激光元件和第二半导体激光元件集成到由化合物半导体制成的基板上的双波长半导体激光器中，第一半导体激光元件的蚀刻阻挡层的构成材料是允许扩散的材料的杂质比第二半导体激光元件的蚀刻停止体的构成材料容易。

36. 发明授权

US07492012B2 Light emitting device and method of manufacturing the same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US07492012B2
公开(公告)日：2009-02-17
申请号：US11276651
申请日：2006-03-09
申请人： Satoshi Murakami , Toru Takayama , Kengo Akimoto
发明人： Satoshi Murakami , Toru Takayama , Kengo Akimoto
IPC分类号： H01L23/62
CPC分类号： H01L27/124 , H01L27/3248 , H01L27/3258 , H01L51/5253
摘要： A light emitting device is provided which has a structure for preventing degradation of a light emitting element due to water and oxygen contained in an interlayer insulating film formed between a TFT and the light emitting element. A TFT is formed on a substrate, an inorganic insulating film is formed on the TFT from an inorganic material and serves as a first insulating film, an organic insulating film is formed on the first insulating film from an organic material and serves as a second insulating film, and an inorganic insulating film is formed on the second insulating film from an inorganic material and serves as a third insulating film. Thus obtained is a structure for preventing the second insulating film from releasing moisture and oxygen. In order to avoid defect in forming the film, a portion of the third insulating film where a contact hole is formed is removed alone. Then, a light emitting element composed of an anode, an organic compound layer, and a cathode is formed on the third insulating film. A TFT and a light emitting element in a light emitting device of this application are connected to each other through a wire formed in a contact hole.
摘要翻译：提供了一种发光器件，其具有用于防止由TFT和发光元件之间形成的层间绝缘膜中包含的水和氧引起的发光元件劣化的结构。在基板上形成TFT，在TFT上由无机材料形成无机绝缘膜，作为第一绝缘膜，在有机绝缘膜上形成有机绝缘膜，作为第二绝缘膜膜和无机绝缘膜由无机材料形成在第二绝缘膜上并用作第三绝缘膜。由此获得的是用于防止第二绝缘膜释放水分和氧气的结构。为了避免形成膜的缺陷，单独除去形成有接触孔的第三绝缘膜的一部分。然后，在第三绝缘膜上形成由阳极，有机化合物层和阴极构成的发光元件。本申请的发光器件中的TFT和发光元件通过形成在接触孔中的线彼此连接。

37. 发明授权

US07465647B2 Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device 有权
公开(公告)号：US07465647B2
公开(公告)日：2008-12-16
申请号：US11896509
申请日：2007-09-04
申请人： Shunpei Yamazaki , Toru Takayama , Yohei Kanno
发明人： Shunpei Yamazaki , Toru Takayama , Yohei Kanno
IPC分类号： H01L21/46 , H01L21/30 , H01L21/762
CPC分类号： H01L21/6835 , G06K19/0704 , G06K19/0723 , G06K19/07703 , G06K19/07718 , G06K19/07745 , G06K19/07749 , G06K19/0775 , G06K19/07758 , G06K19/07779 , G06K19/07781 , G06K19/07783 , H01L23/49855 , H01L2221/68318 , H01L2221/68359 , H01L2221/68368 , H01L2224/45147 , H01L2224/49171 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/12044 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/00 , H01L2224/48 , H01L2924/00011
摘要： With non-contact and contact IC chips becoming common, it is necessary to mass-produce enormous amount of IC chips, which are utilizable for human beings, animals and plants, commercial products, banknotes, and the like, at low cost. For example, it is necessary to manufacture IC chips to be applied to commercial products, banknotes, and the like at a cost of 1 to several yen per IC chip, preferably, at a cost less than 1 yen, and it is desired to realize a structure of an IC chip that can be mass-produced at low cost and a manufacturing process of the IC chip.A method of manufacturing a thin film integrated circuit device according to the present invention includes steps of forming a peel-off layer over a thermally oxidized silicon substrate, forming a plurality of thin film integrated circuit devices over the peel-off layer with a base film interposed therebetween, forming a groove between the plurality of thin film integrated circuit devices, and separating the plurality of thin film integrated circuit devices by introducing one of a gas and a liquid including halogen fluoride into the groove to remove the peel-off layer.

38. 发明授权

US07446339B2 Display device having a curved surface 有权
标题翻译：具有曲面的显示装置
公开(公告)号：US07446339B2
公开(公告)日：2008-11-04
申请号：US11422980
申请日：2006-06-08
申请人： Shunpei Yamazaki , Masakazu Murakami , Toru Takayama , Junya Maruyama
发明人： Shunpei Yamazaki , Masakazu Murakami , Toru Takayama , Junya Maruyama
IPC分类号： H01L29/06
CPC分类号： H01L27/1218 , G02F1/133305 , G02F1/1339 , G02F1/13394 , G02F1/1341 , G02F1/1368 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/76251 , H01L27/1214 , H01L27/124 , H01L27/1259 , H01L27/1262 , H01L27/1266 , H01L27/156 , H01L27/3244 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L29/66757 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/6835 , H01L2221/68363 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/30105 , H01L2924/3025 , Y02E10/549
摘要： The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object original having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
摘要翻译：本发明的目的是提供一种用于制造半导体器件的方法，该半导体器件具有以曲率结合到基底材料上的剥离层。特别地，本发明的目的是提供一种用于制造具有曲率的显示器的方法，更具体地说，提供一种发光器件，该发光器件具有键合到具有曲率的基底材料的OLED。对原来具有曲率和弹性的支撑件施加外力，并且将支撑件结合到形成在基板上的剥离层。然后，当基板被剥离时，支撑件通过恢复力返回到原始形状，并且剥离层也沿着支撑件的形状弯曲。最后，将具有曲率的转印体原件粘合到剥离层，然后完成具有所需曲率的装置。

39. 发明授权

US07436050B2 Semiconductor device having a flexible printed circuit 有权
标题翻译：具有柔性印刷电路的半导体器件
公开(公告)号：US07436050B2
公开(公告)日：2008-10-14
申请号：US10760723
申请日：2004-01-21
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Yasuyuki Arai , Noriko Shibata
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Yasuyuki Arai , Noriko Shibata
IPC分类号： G09G3/36
CPC分类号： H01L27/1266 , H01L21/6835 , H01L27/1214 , H01L2221/68368 , H01L2224/05172 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/07811 , H01L2924/00 , H01L2224/05624 , H01L2924/00014 , H01L2224/05639 , H01L2224/05647 , H01L2224/05664 , H01L2224/05681 , H01L2224/05684 , H01L2224/05124 , H01L2224/05147 , H01L2224/05184
摘要： To provide a thin film device which becomes possible to be formed in the portion which has been considered impossible to be provided with such device by the conventional technique, and to provide a semiconductor device which occupies small space and which has high shock resistance and flexibility, a device formation layer with a thickness of at most 50 μm which was peeled from a substrate by a transfer technique is transferred to another substrate, hence, a thin film device can be formed over various substrates. For instance, a semiconductor device can be formed so as to occupy small space by pasting a thin film device which is transferred to a flexible substrate onto a rear surface of a substrate of a panel, by pasting directly a thin film device onto a rear surface of a substrate of a panel, or by transferring a thin film device to an FPC which is pasted onto a substrate of a panel.
摘要翻译：为了提供可以在通过常规技术被认为不可能设置这种器件的部分中形成的薄膜器件，并且提供占据小空间并且具有高抗冲击性和柔性的半导体器件，通过转印技术将从基板剥离的厚度最多为50μm的元件形成层转移到另一基板，因此可以在各种基板上形成薄膜器件。例如，可以通过将薄膜器件直接粘贴到背面上来形成半导体器件，以便占据较小的空间，该薄膜器件被传送到柔性衬底到面板的衬底的背面上或者通过将薄膜器件转移到贴在面板的基板上的FPC上。

40. 发明授权

US07423293B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US07423293B2
公开(公告)日：2008-09-09
申请号：US10810675
申请日：2004-03-29
申请人： Hirokazu Yamagata , Shunpei Yamazaki , Toru Takayama
发明人： Hirokazu Yamagata , Shunpei Yamazaki , Toru Takayama
IPC分类号： H01L29/04 , H01L31/036 , H01L31/20
CPC分类号： H01L27/3246 , H01L27/3258 , H01L51/50 , H01L51/5206 , H01L51/524 , H01L51/56 , H01L2251/55
摘要： A method of manufacturing a high quality light emitting device is provided, in which light emitting elements having long life are manufactured by using light emitting elements having a structure that deteriorates less easily than conventional structures. After forming a bank, an exposed anode surface is wiped using a PVA (polyvinyl alcohol)-based porous medium, performing leveling and removal of debris. An insulating film is formed covering the bank and the anode, unevenness on the anode surface is covered, and the balance between the amount of holes and electrons injected into an organic compound layer can be regulated.
摘要翻译：提供了一种制造高质量发光器件的方法，其中通过使用具有比常规结构更不易劣化的结构的发光元件来制造具有长寿命的发光元件。在形成堤之后，使用基于PVA（聚乙烯醇）的多孔介质擦拭暴露的阳极表面，进行平整和去除碎屑。形成覆盖堤和阳极的绝缘膜，阳极表面上的凹凸被覆盖，并且可以调节注入到有机化合物层中的空穴和电子的量之间的平衡。

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