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31. 发明专利

JPH0135847B2 失效
公开(公告)号：JPH0135847B2
公开(公告)日：1989-07-27
申请号：JP10569281
申请日：1981-07-08
申请人： HITACHI LTD
发明人： OGATA MASAJI , ISHII TAKEO , WAJIMA MOTOYO , NISHIKAWA AKIO
IPC分类号： C08L33/00 , C08F2/44 , C08F20/52 , C08F222/00 , C08F222/40 , C08F290/00 , C08F299/02 , C08L33/24 , C08L35/00 , C08L61/04 , C08L61/06

32. 发明专利

JPS61265847A RESIN SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61265847A
公开(公告)日：1986-11-25
申请号：JP10702585
申请日：1985-05-21
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , ISHII TAKEO , OGATA MASAJI , KANESHIRO TOKUYUKI , NARAHARA TOSHIKAZU , ABE HIDETOSHI , SEGAWA MASANORI
IPC分类号： C08G59/00 , C08G59/06 , C08G59/20 , C08G59/32 , C08G59/40 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain a resin sealed type semiconductor device, which can perform highly reliable operation, even at a high temperature and high humidity, by sealing the semiconductor with a resin composition including a multifunctional epoxy compound. CONSTITUTION:In a resin composition, which seals this resin sealing type semiconductor device, a multifunctional epoxy compound expressed by a general formula I ((m) represents the numbers of zero, 1 or 2) and the following materials are used together. Namely, a novolak type phenol resin, poly-p- hydroxystyrene, glycerol tris trimellitate expressed by a general formula II, a mixture of a trimer and a tetramer of phenoxyphosphagen expressed by a general formula III (R represents hydrogen or bromine), fulorocarbon polymer including nitrogen, isocyanate compound having an uretedione ring, maleimide compound, a hardening agent, and a material including at least one kind of component, which is selected out of a group comprising a rubber component having a functional group that can react with an epoxy group. Therefore, the resin composition has excellent moisture resistance and heat resistance. Thus intrusion of water is prevented.

33. 发明专利

JPS5949225A Heat-resistant flame-retardant resin composition 失效
标题翻译：耐热阻燃树脂组合物
公开(公告)号：JPS5949225A
公开(公告)日：1984-03-21
申请号：JP15960082
申请日：1982-09-16
申请人： Hitachi Chem Co Ltd , Hitachi Ltd
发明人： OGATA MASAJI , ISHII TAKEO , WAJIMA MOTOYO
IPC分类号： C08G59/00 , C08G59/18 , C08G59/40 , C08G59/62 , C08G59/68 , C08K5/06 , C08K5/13 , C08K7/02 , C08L63/00
CPC分类号： C08K5/06 , C08G59/621 , C08G59/686 , C08L63/00 , C08L25/00 , C08L2666/04
摘要： PURPOSE: To provide titled composition of good storage stability, capable of readily converting to high-performance product on heating, comprising an epoxy resin, alkenyl phenol-based polymer, potential curing accelerator, and specific halogen compound.
CONSTITUTION: The objective composition comprising (A) an epoxy resin (e.g., of bisphenol type), (B) an alkenylphenol-based polymer (with a polymerization degree of ca. 20W80, e.g., vinylphenol), (C) a potential curing accelerator (e.g., quaternary ammonium salt), and (D) a helogenated diphenyl compound of formula I or II [X
1 and X
10 are each H, Cl, or Br; among X
1 WX
5 and X
6 WX
10 , at least three of them being Cl or Br, respectively; R is (hydroxy-substituted) alkylene] (e.g., 2,2',3,3',4,4',5,5'-oxtabromodiphenyl ether), and further, if required, (E) modifier, filler, reinforcer, etc.
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：提供具有良好储存稳定性的标题组合物，其能够容易地转化为加热时的高性能产品，其包含环氧树脂，烯基酚类聚合物，潜在的固化促进剂和特定的卤素化合物。构成：包含（A）环氧树脂（例如，双酚型），（B）烯基酚基聚合物（聚合度为约20-80，例如乙烯基苯酚）的目标组合物，（C）固化促进剂（例如季铵盐）和（D）式I或II的己二烯二苯化合物[X1和X10各自为H，Cl或Br; 在X1-X5和X6-X10中，其中至少三个分别为Cl或Br; R为（羟基取代的）亚烷基]（例如，2,2'，3,3'，4,4'，5,5'-氧十溴二苯醚），此外，如果需要，（E）改性剂，填料，增强剂等等

34. 发明专利

JPS5747335A Resin composition for low-shrinking molding 失效
标题翻译：用于低收缩成型的树脂组合物
公开(公告)号：JPS5747335A
公开(公告)日：1982-03-18
申请号：JP12237680
申请日：1980-09-05
申请人： Hitachi Ltd
发明人： ISHII TAKEO , OGATA MASAJI
IPC分类号： C08F20/00 , C08F20/52 , C08F26/00 , C08F220/52 , C08F226/06 , C08F299/00 , C08J9/04
摘要： PURPOSE: The titled composition that comprises a specific maleimide, a triarylisocyanurate, a polymerization initiator, a foaming agent and a filler, thus showing high heat resistance, mechanical properties and electrical properties.
CONSTITUTION: To a mixture consisting of (A) 100pts.wt. of at least one of maleimides selected from N-substituted maleimides of formula I (R
1 is monovalent organic group) such as N-phenylmaleimide, N,N'-bismaleimides of formula II (R
2 is divalent organic group) such as N,N'-4,4-diphenylmethanebismaleimide and polyphenylmethylene)polymaleimides of formula III (n is 1W5) and of, (B) preferably 30W300pts. of, a triarylisocyanurate, are added (C) 0.1W5wt% of a polymerization initiator such as dicumylperoxide, (D) 0.5W10wt% of a foaming agent such as azodicarbonamide, (E) 10W75vol% of a filler such as calcium carbonate and, when necessary, (F) other additives.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：包含特定的马来酰亚胺，三芳基异氰脲酸酯，聚合引发剂，发泡剂和填料的标题组合物，因此具有高耐热性，机械性能和电性能。构成：对（A）100pts.wt。的选自式I的N-取代的马来酰亚胺（R1是一价有机基团）的马来酰亚胺中的至少一种，例如N-苯基马来酰亚胺，式II的N，N'-双马来酰亚胺（R2是二价有机基团）如N，N' -4,4-二苯基甲烷双马来酰亚胺和聚苯亚甲基）聚马来酰亚胺（n为1-5），（B）优选为30-300pts。（C）0.1-5重量％的聚合引发剂如二枯基过氧化物，（D）0.5-10重量％的发泡剂如偶氮二酰胺，（E）10-75体积％的填料如钙碳酸盐和必要时（F）其他添加剂。

35. 发明专利

JPS56127614A THERMOSETTING RESIN COMPOSITION 失效
公开(公告)号：JPS56127614A
公开(公告)日：1981-10-06
申请号：JP3035580
申请日：1980-03-12
申请人： HITACHI LTD
发明人： OGATA MASAJI , ISHII TAKEO , NARAHARA TOSHIKAZU
IPC分类号： C08F18/00 , C08F18/18 , C08F218/18 , C08F290/00 , C08F299/00 , C08F299/02
摘要： PURPOSE:A thermosetting resin composition, having an operational rate and a strength suitable for molding and casting material of mechanical parts, etc., and containing a maleimide compound, triallyl isocyanurate, an unsaturated polyester, etc. and a radical polymerization initiator. CONSTITUTION:A composition containing (A) a maleimide compound, preferably poly(phenylmethylene)polymaleimide expressed by the formula (0.5

36. 发明专利

JPS5486596A POLYAMIDE HAVING ALKYL SULFONAMIDE GROUP SIDE CHAIN 失效
公开(公告)号：JPS5486596A
公开(公告)日：1979-07-10
申请号：JP15451177
申请日：1977-12-23
申请人： HITACHI LTD
发明人： KANESHIRO TOKUYUKI , ISHII TAKEO , YOKONO ATARU , MIYADERA YASUO
IPC分类号： C08G69/00 , B01D71/56 , C08G69/32 , C08G69/42
摘要： PURPOSE:To provide a new polyamide having alkyl sulfonamide group side chains useful as semipermeable membranes and having excellent mechanical strength, heat resistance and solubility in organic solvents, and improved water permeability, consisting of specific recurrent structural unit. CONSTITUTION:A polyamide having the recurrent unit I (Ar is divalent aromatic nucleus: Q is divalent aromatic or aliphatic residual group; R and R' are H or lower alkyl, provided that at least one of R and R' is lower alkyl; n is 1 or 2; SO2NRR' is bonded with a C atom of an unsubstituted Ar group wherein said C atom is not adjacent to NH group; II is preferably or IV) and having a reduced viscosity (dimethylacetamide solvent, 0.1 g/dl concentration, 30 deg.C) of >= 0.5 l/g. The polyamide is prepared, e.g. by the polycondensation of an aromatic diaminoalkyl sulfonamide V with a dibasic acid halide in an inert solvent at

37. 发明专利

JPS542279A REVERSE OSMOTIC MEMBRANE AND PREPARATION THEREOF 失效
公开(公告)号：JPS542279A
公开(公告)日：1979-01-09
申请号：JP6666177
申请日：1977-06-08
申请人： HITACHI LTD
发明人： KANESHIRO TOKUYUKI , ISHII TAKEO , MIYADERA YASUO , YOKONO ATARU
IPC分类号： B01D61/08 , B01D65/00 , B01D71/52 , B01D71/56 , B01D71/82
摘要： PURPOSE:To prepare reverse osmotic membrane, which is highly resistant to compaction, which makes possible separation of components of a soln. e.g. sea water having high osmotic press., and which can be used for a long period of time, by use of polyamide having CONH2 group at the side chain as a base.

38. 发明专利

JPS534097A POLYAMIDE HAVING SULFONAMIDE AT SIDE CHAIN 失效
公开(公告)号：JPS534097A
公开(公告)日：1978-01-14
申请号：JP7773276
申请日：1976-07-02
申请人： HITACHI LTD
发明人： KANESHIRO TOKUYUKI , MIYATERA YASUO , ISHII TAKEO , YOKONO ATARU
IPC分类号： C08G69/00 , C08G69/32 , C08G69/42
摘要： PURPOSE:The reaction of a specific aromatic diamino-sulfonamide with a dibasic acid halide provideda novel polyamide sulfonamide which has excellent physical and mechanical properties and futher excellent film-forming properties from an organic solution thereof and can be used as semipermeable membranes because of its good water permeability.

39. 发明专利

JP2003140894A RELATING METHOD OF SOFTWARE DEVELOPMENT RESOURCES, AND PROGRAM THEREFOR 审中-公开
公开(公告)号：JP2003140894A
公开(公告)日：2003-05-16
申请号：JP2001338965
申请日：2001-11-05
申请人： HITACHI LTD
发明人： SHIMIZU SHIYOUGO , OGOSHI MINORU , CHIBA TOSHIYA , ISHII TAKEO , FUJII KEIJI
IPC分类号： G06F9/44
摘要： PROBLEM TO BE SOLVED: To specify a specification created in a downstream process relating to constitutional elements when the description of some constitutional elements in a program function relation drawing created in an upstream process is changed. SOLUTION: A specification creating part 102 creates various specifications 103 from a program function relation drawing 101. Then, a relational information creating part 107 creates relational information between each constitutional element of the program function relation drawing 101 and the corresponding specification 103, and between specifications, in which data input and output relationship exists, and stores the information in affected relational information 108. When some constitutional elements of the program function relation drawing 101 or the specification 103 is changed, a change affected analysis part 109 refers to the affected relation information 108, and specifies the specification or the constitutional elements to be changed and affected.

40. 发明专利

JPS62187752A HEAT-RESISTANT RESIN COMPOSITION AND RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62187752A
公开(公告)日：1987-08-17
申请号：JP2888386
申请日：1986-02-14
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , KOYAMA TORU , SUGANO SHU , ISHII TAKEO , WAJIMA MOTOYO
IPC分类号： C08L61/12 , C08G8/04 , C08G8/20 , C08L61/04
摘要： PURPOSE:To provide a heat-resistant resin compsn. which has excellent resistance to heat and moisture, can impart low stress and is suitable for use ass a sealing resin for semiconductor devices, containing a bisphenol/novolak type resin having a specified unit as a main component. CONSTITUTION:Bisphenol A, Bisphenol F, etc. are condensed with formalin in the presence of an acid catalyst (e.g., hydrochloric acid), IF desired, the resulting resin is reacted with epichlorohydrin or cyanogen chloride in the presence of an alkali to obtain a bisphenol/novolak type resin having a unit of the formula (wherein R1 and R2 are each H, methyl or trifluoromethyl; X is H or glycidyl; Y is H, glycidyl or cyano; and n/0). The resin is blended with a curing agent (e.g., a novolak type phenolic resin, N,N'-4,4'-diphenylmethane bis-maleimide), etc., to form the desired heat-resistant resin compsn.

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