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31. 发明专利

JP2011026607A Thermosetting resin composition, prepreg, laminated sheet, and printed wiring board 审中-公开
标题翻译：热固性树脂组合物，PREPREG，层压板和印刷线路板
公开(公告)号：JP2011026607A
公开(公告)日：2011-02-10
申请号：JP2010201130
申请日：2010-09-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAKAMURA YUKIO , MURAI AKIRA , ISHIGAMI FUMIO
IPC分类号： C08L101/00 , C08J5/24 , C08K5/138 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that has a black appearance and is suitable for producing a laminated sheet which has no reduction in insulation properties and reliability when made into a printed wiring board, and to provide a prepreg etc.
SOLUTION: The thermosetting resin composition comprises black dye such as chromic acid (1-), [1-[(2-hydroxy-4-nitrophenyl)azo]-2-naphthalenolato (2-)][1-[(2-hydroxy-5-nitrophenyl)azo]-2-naphthalenolato (2-)], wherein the total inorganic ion concentration in the black dye is ≤200 ppm.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有黑色外观的热固性树脂组合物，并且适用于生产当制成印刷线路板时绝缘性能和可靠性不降低的层叠片材，并提供预浸料等解决方案：热固性树脂组合物包含黑色染料如铬酸（1-），[1 - [（2-羟基-4-硝基苯基）偶氮] -2-萘酚酸酯（2 - ）] [1- [ （2-羟基-5-硝基苯基）偶氮] -2-萘酚（2-）]，其中黑色染料中的总无机离子浓度≤200ppm。版权所有（C）2011，JPO＆INPIT

32. 发明专利

JP2010248473A Thermosetting resin composition, and prepreg, laminate and multi-layered printed wiring board using same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和多层印刷线路板使用相同
公开(公告)号：JP2010248473A
公开(公告)日：2010-11-04
申请号：JP2010012543
申请日：2010-01-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , MIYATAKE MASATO , TSUCHIKAWA SHINJI , TAKANEZAWA SHIN , IZUMI HIROYUKI , MURAI AKIRA
IPC分类号： C08L79/00 , B32B27/34 , C08G73/10 , C08J5/24 , C08K3/00 , C08K3/10 , C08K5/18 , C08K5/3445 , C08K5/49 , C08L101/00 , C08L101/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which has excellent setting characteristics i.e. does not require a high temperature and long treatment, gives excellent curability and storage stability, and is excellent in chemical resistance, heat resistance, and adhesion, and a vanish or a prepreg, laminate and multi-layered printed wiring board using the resin composition. SOLUTION: The thermosetting resin composition (A) resin composition having an unsaturated maleimide group produced by reacting (a) maleimide compound having at least two N-substituted maleimide groups in the molecule with (b) amine compound having at least two primary amine groups in the molecule in an organic solvent, (B) thermosetting resin, and (C) modified imidazole compound such as isocyanate-masked imidazole and epoxy-masked imidazole. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：待解决的问题：为了提供具有优异的凝固特性即不需要高温和长时间处理的树脂组合物，具有优异的固化性和储存稳定性，并且具有优异的耐化学性，耐热性和粘附性，以及使用树脂组合物的消泡剂或预浸料，层压板和多层印刷线路板。解决方案：具有不饱和马来酰亚胺基团的热固性树脂组合物（A）通过使（a）在分子中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物与（b）具有至少两个伯分子中的胺基在有机溶剂中，（B）热固性树脂和（C）改性的咪唑化合物如异氰酸酯掩蔽的咪唑和环氧屏蔽的咪唑。版权所有（C）2011，JPO＆INPIT

33. 发明专利

JP2010222569A Resin composition, and prepreg, laminated board and wiring board using the same 审中-公开
标题翻译：树脂组合物和PREPREG，层压板和使用它的接线板
公开(公告)号：JP2010222569A
公开(公告)日：2010-10-07
申请号：JP2010037253
申请日：2010-02-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MORITA KOJI , MURAI AKIRA , TAKANEZAWA SHIN , INOUE YASUO
IPC分类号： C08J9/12 , B32B5/28 , C08G59/06 , C08J5/04 , C08J5/24 , C08K3/10 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition having high flame retardancy, and a prepreg, a laminated board and a wiring board, using the composition.
SOLUTION: The composition includes a resin having a polycyclic structure, and a foaming agent, wherein the content of the foaming agent is 0.50-10 pts.mass over 100 pts.mass of the resin. The prepreg, laminated board and wiring board, using the composition are also provided.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：使用该组合物提供具有高阻燃性的树脂组合物和预浸料，层压板和布线板。解决方案：该组合物包括具有多环结构的树脂和发泡剂，其中发泡剂的含量为超过100重量份树脂的0.50-10重量份。还提供了使用该组合物的预浸料，层压板和布线板。版权所有（C）2011，JPO＆INPIT

34. 发明专利

JP2009149742A Method for manufacturing polyimide compound, thermosetting resin composition, and prepreg and laminated sheet using the same 有权
标题翻译：制造聚酰亚胺化合物的方法，热固性树脂组合物，以及使用它们的制备和层压片材
公开(公告)号：JP2009149742A
公开(公告)日：2009-07-09
申请号：JP2007327720
申请日：2007-12-19
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , KOTAKE TOMOHIKO , AKIYAMA MASANORI , IZUMI HIROYUKI , MURAI AKIRA
IPC分类号： C08G73/12 , C08J5/24 , C08K3/00 , C08L63/00 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a method for efficiently and easily manufacturing a polyimide compound that is a thermosetting resin having low toxicity, excellent in safeness and a working environment, and suitably used for electronic components or the like, to provide a thermosetting resin composition showing an excellent balance in all of metal foil adhesiveness, heat resistance, moisture resistance, flame retardancy, heat resistance with metal, dielectric constant and dielectric tangent, and to provide a prepreg and a laminated sheet using the composition.
SOLUTION: The method for manufacturing a polyimide compound having a 2,4-diaminotriazine group and an unsaturated N-substituted maleimide group in a polyimide structure comprises: allowing a 6-substituted guanamine compound (a) having an unsaturated double bond hydrocarbon group expressed by general formula (I) to react with an amine compound (b) having at least two primary amino groups in the molecular structure, excluding the above 6-substituted guanamine compound (a); and subsequently allowing the reaction product to react with a malemide compound (c) having at least two unsaturated N-substituted maleimide groups in the molecule structure. The thermosetting resin composition contains the polyimide compound manufactured by the above method. The prepreg and the laminated sheet use the thermosetting resin composition.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种有效且容易地制造作为低毒性，优异的安全性和工作环境的热固性树脂的聚酰亚胺化合物的方法，并且适合用于电子部件等，以提供一种热固性树脂组合物在金属箔的粘合性，耐热性，耐湿性，阻燃性，金属耐热性，介电常数和介电切线方面均显示出优异的平衡性，并提供使用该组合物的预浸料和层压片。解决方案：聚酰亚胺结构中具有2,4-二氨基三嗪基和不饱和N-取代马来酰亚胺基团的聚酰亚胺化合物的制造方法包括：使具有不饱和双键烃的6-取代胍胺化合物（a）除了上述6-取代胍胺化合物（a）外，通式（I）表示的基团与分子结构中具有至少两个伯氨基的胺化合物（b）反应; 并随后使反应产物与分子结构中具有至少两个不饱和N-取代的马来酰亚胺基团的马来酰胺化合物（c）反应。热固性树脂组合物含有通过上述方法制造的聚酰亚胺化合物。预浸料和层压片使用热固性树脂组合物。版权所有（C）2009，JPO＆INPIT

35. 发明专利

JP2008291214A Method for producing resin varnish containing thermosetting resin of semi-ipn-type compound material, resin varnish for printed wiring board, prepreg, and metal-clad laminated board 有权
标题翻译：用于生产含有SEMI-IPN型复合材料的热固性树脂的树脂变性方法，印刷线路板，PREPREG和金属层压板的树脂变性
公开(公告)号：JP2008291214A
公开(公告)日：2008-12-04
申请号：JP2008061282
申请日：2008-03-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIZUNO YASUYUKI , FUJIMOTO DAISUKE , DANSEIGEN KAZUTOSHI , MURAI AKIRA
IPC分类号： C08C19/28 , C08J5/24 , C08K3/00 , C08L15/00 , C08L71/12 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a thermosetting resin varnish which can be used for the production of a printed wiring board having good dielectric properties in a high frequency region, capable of significantly reducing a propagation loss, having excellent moisture absorption thermal resistance and thermal expansion properties, and satisfying peeling strength between the printed wiring board and a metal foil. SOLUTION: The method for producing the thermosetting resin varnish containing a thermosetting resin composition being an uncured semi-IPN-type compound material includes a process for obtaining the uncured semi-IPN-type compound material by preliminarily reacting a butadiene polymer containing a 1,2-butadiene unit having a 1,2-vinyl group in a side chain in an amount of ≥40% and being chemically unmodified (B) and a cross-linking agent (C) in the presence of a polyphenylene ether (A) in an organic solvent (D), wherein the organic solvent (D) contains one or more kinds of aromatic hydrocarbons. The thermosetting resin varnish obtained by the method, a prepreg, and a metal clad laminated board are also provided. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种热固性树脂清漆的制造方法，其可用于制造在高频区域具有良好介电性能的印刷线路板，能够显着降低传播损耗，具有优异的吸湿热阻和热膨胀性能，并且满足印刷线路板和金属箔之间的剥离强度。解决方案：含有未固化的半IPN型复合材料的热固性树脂组合物的热固性树脂清漆的制备方法包括通过使含丁烯的聚合物的丁二烯聚合物预先反应来获得未固化的半IPN型复合材料的方法在聚苯醚（A）的存在下，在侧链中具有≥40％1,2-乙烯基和化学未改性（B）和交联剂（C）的1,2-丁二烯单元）在有机溶剂（D）中，其中有机溶剂（D）含有一种或多种芳族烃。还提供了通过该方法获得的热固性树脂清漆，预浸料和金属包覆层压板。版权所有（C）2009，JPO＆INPIT

36. 发明专利

JP2008133454A Resin composition for printed circuit board and resin varnish using the same, prepreg and metal-clad laminate 审中-公开
标题翻译：印刷电路板的树脂组合物和使用该印刷电路板的树脂组合物，PREPREG和金属层压板
公开(公告)号：JP2008133454A
公开(公告)日：2008-06-12
申请号：JP2007276188
申请日：2007-10-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIZUNO YASUYUKI , FUJIMOTO DAISUKE , DANSEIGEN KAZUTOSHI , MURAI AKIRA
IPC分类号： C08L47/00 , C08F279/02 , C08J5/24 , C08K3/00 , C08K5/3415 , C08K5/49 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for printed circuit boards, which is good in dielectric characteristics in high frequency bands, is excellent in low moisture absorbability and thermal expansion characteristics, and satisfies a high peeling strength from metal foils and good moldability, to provide a resin varnish, a prepreg, and a metal-clad laminate which use the same. SOLUTION: This thermosetting resin composition for the printed circuit boards comprises (A) a chemically non-modified butadiene polymer which contains 1,2-butadiene units each having a 1,2-vinyl group on a side chain in an amount of ≥40% in the molecule, and (B) a maleimide compound, or a prepolymer comprising the component (A) and the component (B) as components, wherein the component (B) comprises a compound represented by general formula (2). And the resin varnish, the prepreg, and the metal-clad laminate which use the same. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：为了提供高频带介电特性好的用于印刷电路板的热固性树脂组合物，具有优异的低吸湿性和热膨胀特性，并且满足从金属箔的高剥离强度和良好的成型性，以提供使用其的树脂清漆，预浸料和覆金属层压板。解决方案：该印刷电路板用热固性树脂组合物包含（A）化学式未改性丁二烯聚合物，其含有在侧链上具有1,2-乙烯基的1,2-丁二烯单元， ≥40％，和（B）马来酰亚胺化合物或包含组分（A）和组分（B）的预聚物作为组分，其中组分（B）包含通式（2）表示的化合物。和树脂清漆，预浸料和使用它们的覆金属层压板。版权所有（C）2008，JPO＆INPIT

37. 发明专利

JP2008050517A Method for producing epoxy-modified guanamine compound solution, thermosetting resin composition, and prepreg and laminated board by using the same 有权
标题翻译：用于生产环氧改性的胍胺化合物溶液，热固性树脂组合物的方法，以及使用它们的制备和层压板
公开(公告)号：JP2008050517A
公开(公告)日：2008-03-06
申请号：JP2006230343
申请日：2006-08-28
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , AKIYAMA MASANORI , MURAI AKIRA
IPC分类号： C08G59/50 , B32B15/092 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a guanamine compound solution which gives a thermosetting resin composition having a low toxicity and a good solubility with safe organic solvents, and excellent in all of metal foil-bonding property, heat resistance, moisture resistance, flame retardance, heat resistance with copper, a low dielectric characteristic and a low dielectric tangent, the thermosetting resin composition, and a prepreg and laminated board by using the same.
SOLUTION: This method for producing the epoxy-modified guanamine compound is provided by adding (d) a resin or monomer having an epoxy group in its molecular structure into the uniform solution consisting of (a) a 6-substituted guanamine compound, (b) a carboxyl group-containing acidic compound having ≥4.05 acid dissociation constant (pKa) in an infinite dilution aqueous solution at 25°C and (c) a ketone-based organic solvent without having a nitrogen atom in its molecular structure, and reacting at ≥70°C temperature. The thermosetting resin composition, and the prepreg and laminated board obtained by using the same are also provided.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：待解决的问题：提供一种制备胍胺化合物溶液的方法，该方法得到具有低毒性和与安全有机溶剂的良好溶解性的热固性树脂组合物，并且所有金属箔粘合性，耐热性均优异耐热性，阻燃性，铜的耐热性，低介电特性和低介电切线，热固性树脂组合物，以及通过使用它们的预浸料和层压板。＆lt;解决方案＆gt;该环氧改性胍胺化合物的制造方法是将（d）分子结构中具有环氧基的树脂或单体添加到由（a）6-取代胍胺化合物，（b）在25℃的无限稀释水溶液中具有≥4.05酸解离常数（pKa）的含羧基酸性化合物和（c）在其分子结构中不具有氮原子的酮类有机溶剂，以及在≥70°C的温度下反应。还提供了热固性树脂组合物，以及通过使用它们得到的预浸料和层压板。版权所有（C）2008，JPO＆INPIT

38. 发明专利

JPH11279298A Resin sheet and multilayered printed wiring board using the same 失效
标题翻译：树脂板和多层印刷线路板使用相同
公开(公告)号：JPH11279298A
公开(公告)日：1999-10-12
申请号：JP8763298
申请日：1998-03-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ISHIGAMI FUMIO , SAKAI HIROSHI , MURAI AKIRA
IPC分类号： H05K1/03 , B32B27/38 , C08J5/12 , C08J5/24 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a resin sheet especially suitable for producing a thin-form multilayered printed wiring board having low dielectric characteristics and to provide the mutilayered printed wiring board having the low dielectric characteristics. SOLUTION: This multilayered printed wiring board is obtained by using a resin sheet containing particles of an epoxy resin composition consisting essentially of (a) an epoxy resin prepared by epoxidizing a condensate of phenols with hydroxybenzaldehydes and (b) an adduct of phenols to polybutadiene dispersed therein and laminating and integrating constituent materials between inorganic fibers formed into a nonwoven fabric shape with a curable binder resin.
摘要翻译：要解决的问题：为了获得特别适用于制造具有低介电特性的薄型多层印刷线路板并提供具有低介电特性的多层印刷线路板的树脂片。解决方案：该多层印刷线路板是通过使用含有环氧树脂组合物的树脂片而获得的，所述树脂片基本上由以下组成：（a）通过将酚的缩合物与羟基苯甲醛环氧化制备的环氧树脂，和（b）分散于聚丁二烯中的酚加合物并且将形成无纺布形状的无机纤维之间的组成材料与可固化粘合剂树脂层压并整合。

39. 发明专利

JPH11274342A Package for mounting semiconductor element 失效
标题翻译：安装半导体元件的封装
公开(公告)号：JPH11274342A
公开(公告)日：1999-10-08
申请号：JP7998198
申请日：1998-03-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： IIJIMA TOSHIYUKI , MURAI AKIRA , TAKADA KOSUKE
IPC分类号： H01L23/04
摘要： PROBLEM TO BE SOLVED: To provide a package for mounting semiconductor element, wherein flowing of a resin into a cavity is suppressed.
SOLUTION: A base substrate 11 and a perforated substrate 13, in which a cavity hole 12 is provided, are stacked with an adhesive sheet 15 with a cavity hole 14 in between for heating and pressurizing, while a dam 16 of a copper plate formed at the periphery of the cavity bottom face of the base substrate. The dam 16 is formed by etching the copper foil.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：提供一种用于安装半导体元件的封装，其中树脂流入空腔被抑制。解决方案：设置有空腔12的基底基板11和多孔基板13与其间具有空腔孔14的粘合片15层叠以进行加热和加压，同时形成铜板的坝16 基底基板的腔底面的周边。坝16通过蚀刻铜箔形成。

40. 发明专利

JP2012031341A Thermosetting resin composition, prepreg and laminated board 有权
标题翻译：热固性树脂组合物，PREPREG和层压板
公开(公告)号：JP2012031341A
公开(公告)日：2012-02-16
申请号：JP2010173958
申请日：2010-08-02
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , IZUMI HIROYUKI , MURAI AKIRA
IPC分类号： C08L79/00 , C08G59/40 , C08G73/12 , C08J5/24 , C08K3/22 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, a prepreg and laminated boards, especially having low thermal expansion, a high glass transition temperature and low dielectricity, excellent in all of copper foil adhesion, soldering heat resistance, heat resistance with copper, flame retardancy and drillability with good balance, low in toxicity and excellent in safety and work environment.SOLUTION: There is provided a thermoplastic resin composition containing a maleimide compound (A), an amino compound (B) and an aldehyde compound (C) each represented by a specific chemical formula, a metal hydrate (D) having ≥300°C thermal decomposition temperature as a flame retardant, and, if necessary, further containing a curing promotor (E), an epoxy resin (F) and an inorganic filler (G), and a prepreg and laminated boards using the same are also provided.
摘要翻译：要解决的问题：提供热固性树脂组合物，预浸料和层压板，特别是具有低热膨胀，高玻璃化转变温度和低介电性，所有铜箔粘合性，焊接耐热性，耐热性都优异具有铜，阻燃性和可钻性，平衡性好，毒性低，安全性和工作环境优良。解决方案：提供一种含有马来酰亚胺化合物（A），氨基化合物（B）和醛化合物（C）的热塑性树脂组合物，它们各自由具体化学式表示，金属水合物（D）具有≥300 °C的热分解温度作为阻燃剂，并且如果需要，还提供含有固化促进剂（E），环氧树脂（F）和无机填料（G）以及使用其的预浸料和层压板。版权所有（C）2012，JPO＆INPIT

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