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31. 发明专利

JPS6144616B2 失效
公开(公告)号：JPS6144616B2
公开(公告)日：1986-10-03
申请号：JP6776178
申请日：1978-06-07
申请人： HITACHI LTD
发明人： BABA MASAICHI , TAKAHASHI MICHIRO , UNO MASATO
IPC分类号： F04D17/04 , B23P21/00 , F04D29/28

32. 发明专利

JPS54159706A APPARATUS FOR MANUFACTURING AXIAL FAN 失效
公开(公告)号：JPS54159706A
公开(公告)日：1979-12-17
申请号：JP6776178
申请日：1978-06-07
申请人： HITACHI LTD
发明人： BABA MASAICHI , TAKAHASHI MICHIROU , UNO MASATO
IPC分类号： F04D17/04 , B23P21/00 , F04D29/28
摘要： PURPOSE:To permit discs carrying blades inserted therein to be separated and positioned while being held aginast inclination by providing a chuck for holding the discs. CONSTITUTION:Discs 4a to 4d are stacked on a chuck 1 and positioned with positioning pins 2, and then a number of blades 5 are inserted through grooves formed in the discs 4a to 4e and secured thereto. Subsequently, a stepped shaft 3 is raised, whereby pulling shafts 6 are raised. As a result, the disc 4a is separated by the first shoulder of the stepped shaft 3, and at the same time support arms 10a of a lift block 7a being raised by the pull-up shafts 6 are forced out toward the axis of the stepped shaft 3 by cams 9, thus bringing a plate spring mounted on the underside of the support arms 10a into contact with the upper surface of the disc 4a. Thus, even if fluctuations of the frictional force between the grooves of the disc 4a and the blades 5 are produced, the disc 4a can be separated without being inclined since the support arms 10a are in contact with the upper surface of the disc 4a.

33. 发明专利

JPS5354307A RETAINING PROCESS OF PARTS POSITIONED ON CIRCLE 失效
公开(公告)号：JPS5354307A
公开(公告)日：1978-05-17
申请号：JP12830976
申请日：1976-10-27
申请人： HITACHI LTD
发明人： BABA MASAICHI , ODAJIMA HITOSHI , SATOU MASAYUKI , UNO MASATO
IPC分类号： B23Q3/06 , B25B5/14 , F04D29/30 , F04D29/62
摘要： PURPOSE:To make it retainable by dint of practical constant retaining force regardless of variations in its work shape by means of retaining the work positioned on a circle on notches in use of blades formed upon a gear.

34. 发明专利

JPH061537B2 失效
公开(公告)号：JPH061537B2
公开(公告)日：1994-01-05
申请号：JP22699885
申请日：1985-10-14
申请人： HITACHI LTD
发明人： BABA MASAICHI , ODAJIMA HITOSHI , TSUTSUI YOSHITAKA
IPC分类号： G11B5/455 , G11B5/53 , G11B5/56

35. 发明专利

JPH04181509A MANUFACTURE OF MAGNETIC HEAD AND POLISHING METHOD THEREOF AND MAGNETIC HEAD 失效
公开(公告)号：JPH04181509A
公开(公告)日：1992-06-29
申请号：JP30888590
申请日：1990-11-16
申请人： HITACHI LTD
发明人： HAJIKI NOBUHIKO , BABA MASAICHI , SAKAGUCHI HIROSHI , FURUICHI HIROO , YAMAMURA SHIGEKI , SATO YOJI
IPC分类号： G11B5/187 , G11B5/127 , G11B5/23
摘要： PURPOSE:To easily and highly accurately polish a magnetic head member to a desired height by adjusting the height and the inclination of the top of a W groove of the magnetic head member to a sample stage as a reference in a pretreatment of the polishing process. CONSTITUTION:A wax 2 is applied as an adhesive to a movable tool. A magnetic head member 3 in three layers is attached to the movable tool. A plurality of W-shaped grooves are formed in a substrate 3a, and a magnetic film 3b is formed on the substrate 3a along the configuration of the grooves. A glass 3c is filled in the upper part of the W-shaped grooves 3b. The height Z and the inclination thetay of the member 3 attached to the movable tool are adjusted in an adjusting process 7. When the process 7 is completed, a surface finishing process 8 is executed. Then, after the preparatory work, polishing is performed at 9 by a lapping treatment.

36. 发明专利

JPH04107088A PERFORMANCE INSPECTING DEVICE FOR INTEGRATED TYPE CAMERA 失效
公开(公告)号：JPH04107088A
公开(公告)日：1992-04-08
申请号：JP22437290
申请日：1990-08-28
申请人： HITACHI LTD
发明人： ISHII TAKATOSHI , SASAKI HIROYASU , BABA MASAICHI
IPC分类号： H04N5/232 , H04N5/76 , H04N17/00
摘要： PURPOSE:To execute an automatic inspection integrating inspection items for the performance inspection of a integrated type camera by quantizing the output signal of the integrated type camera, and processing data as well as outputting and storing the discriminated result of the inspection. CONSTITUTION:A signal outputted from the integrated type camera adjusting a specified viewing angle to a test chart for the inspection is separated into a luminance signal and a color signal by an output signal measuring part 1, quantized and stored. The stored data are read out by a data processing part 2, and the inspection data of the inspection items are calculated. And a sound signal outputted from an auxiliary michrophone is quantized and stored in the measuring part 1. The inspection data of the stored data are calculated in the data processing part 2. In a control part 3, the inspection data are compared with a result discriminating reference value and the discriminated result is displayed in a display part 4. A total amount by the discriminated result up to the present is read out of a storage part 5, and this time discriminated result is added and stored in the storage part 5.

37. 发明专利

JPH0469154A WIRE SAW 失效
公开(公告)号：JPH0469154A
公开(公告)日：1992-03-04
申请号：JP17899990
申请日：1990-07-06
申请人： HITACHI LTD
发明人： EGUCHI EIMI , BABA MASAICHI , MIYOSHI KAORU , FURUICHI HIROO , FUJISAWA MASAYASU , TANIGUCHI MOTOYA , YAMAMURA SHIGEKI , SATO YOJI
IPC分类号： B24B27/06 , B24B41/06 , B28D5/04
摘要： PURPOSE:To cut the body to be worked in a high accuracy, by providing a position adjusting base for adjusting position in the direction parallel to the rotary center line of a roller at least at the inside of wire. CONSTITUTION:The body to be worked(bonding block) 4 is cut with the wire 1 wound on plural rollers 2, 3 being travelled and the body to be worked being pressed to the wire 1. In this case, a position adjusting base(20) for adjusting position in the direction( y direction) parallel to the rotary center line of rollers 2, 3 at least, is provided at the inside of the wire 1. Consequently, the position of the body 4 to be worked provided at the inside of the wire 1 can be adjusted. In this case, a jig 5 to which the body 4 to be worked is fitted is arranged on this position adjusting base 20.

38. 发明专利

JPH03277467A POLISHING METHOD AND POLISHING DEVICE 失效
公开(公告)号：JPH03277467A
公开(公告)日：1991-12-09
申请号：JP18139490
申请日：1990-07-11
申请人： HITACHI LTD
发明人： HAJIKI NOBUHIKO , BABA MASAICHI , FURUICHI HIROO , SAKAGUCHI HIROSHI , YAMAMURA SHIGEKI , SATO YOJI
IPC分类号： B24B37/07
摘要： PURPOSE:To polish the polishing target layer of a member to be polished of laminated structure easily with high accuracy by providing a sample base with mechanism for adjusting either one of the fitting position and fitting attitude of the member to be polished in the preceding process in a polishing process. CONSTITUTION:The adhesive sticking of a member to be polished 3 to a movable jig 1 is performed by heating a sample base to approximately 120 deg.C to adhere the member to be polished 3 after a wax applying process 4, then applying pressure to the member to be polished 3 and cooling it forcibly. The height 2 and inclination thetay of the member to be polished 3 stuck to the movable jig 1 on the sample base are adjusted in an adjusting process 7. This adjustment is performed to make a polishing target layer 3b in the member to be polished 3 horizontal to the specified horizontal face. After terminating the adjusting process 7, planing 8 is performed by a rotary polishing grinder.

39. 发明专利

JPH03119740A STRUCTURE OF SEMICONDUCTOR DEVICE AND ITS MANUFACTURING APPARATUS 失效
公开(公告)号：JPH03119740A
公开(公告)日：1991-05-22
申请号：JP25530289
申请日：1989-10-02
申请人： HITACHI LTD
发明人： MITA TORU , SAKATA TOMOAKI , BABA MASAICHI , SERIZAWA INJI , KOMARU TAKESHI
IPC分类号： H01L21/603 , H01L21/60
摘要： PURPOSE:To disperse a load of a heat block for thermocompression bonding use and to uniformly bond leads to electrode pads by a method wherein a plurality of bonding parts are arranged on the surface of a semiconductor chip and, when the leads are connected respectively to the bonding parts, the center of overall gravity of a figure of the dispersively arranged bonding parts is made to correspond to the center of gravity of a surface figure of the chip. CONSTITUTION:A device hole 6 is opened in a tape carrier 5; a semiconductor chip 1 is fitted to the device hole. A plurality of electrode pads 2 and dummy electrode pads 4 are arranged each around the surface of the chip 1; leads 7 having interconnection parts 9 are connected to the pads 2; dummy leads 8 having interconnection parts 10 are connected to the pads 4. In this manner, the center of overall gravity of the chip 1 is made to coincide with that of the pads 2, 4; the chip 1 is placed on a bonding stage 11; it is pressed by using a heat block 12 for thermocompression bonding use; a profiling shake by using a point C in the middle as the center is caused; a unform load is exerted on the pads 2 and the leads 7 as well as the pads 4 and the leads 8.

40. 发明专利

JPH0379240A PARTS BUILDING-IN DEVICE 失效
公开(公告)号：JPH0379240A
公开(公告)日：1991-04-04
申请号：JP21009689
申请日：1989-08-16
申请人： HITACHI LTD
发明人： MIYOSHI KAORU , EGUCHI EIMI , BABA MASAICHI
IPC分类号： B23P19/00 , B23P19/04 , B23P21/00
摘要： PURPOSE:To securely build in a piece of block-like parts in a specified position on a base so as to sandwich a very small coil spring by forming a parts-guide hole so as to be slightly greater than the projected plane shape of the parts, and by providing vibrating devices for providing vertical vibration to parts-guide members. CONSTITUTION:If the end position of a coil spring 2 is not in line with the hole 5 in a piece of parts 1 which has been inserted through a parts-guide hole 40, the part 1 is brought into an unstable condition in which it is in contact with the wall surface of the parts-guide hole 40 while riding on the coil spring 2. In this condition, when parts-guide members 15, 15', and 15'' are vibrated in the up-and-down direction through vibrating devices 23, 23', the unstable part 1 moves round freely in the parts-guide hole 40, and soon the end part of the coil spring 2 enters the hole 5 in the part 1, so that the building-in of parts can be executed.

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