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    • 35. 发明专利
    • RESIST COATER
    • JPS6097351A
    • 1985-05-31
    • JP20481983
    • 1983-11-02
    • HITACHI LTD
    • KANEKO TADAOYANAGISAWA HIROSHIKOBASHI TAKAHIRO
    • G03C1/74G03F7/16
    • PURPOSE:To improve the wettability between a metallic surface and resist as well as the adhesion between the photoresist and a sample by subjecting a thin sheet-like article to an oxidation treatment and surface treatment then coating the photoresist thereon. CONSTITUTION:UV rays are irradiated from a low pressure mercury lamp 1 under an oxygen-contg. atmosphere to a thin sheet-like article conveyed from an object ejecting part 11 to an oxidation treating part 12, by which the article is oxidized. Such article is then placed on the sample base 2 in a surface treating part 13 where the lower part 3 and upper part 5 of a reaction chamber are brought into tight contact with each other to form a hermetic reaction chamber and thereafter the article is heated by a heating jig 4 and is rested in a bubbler 6 by opening solenoid valves 111-113. The vapor of an org. compd. (e.g.; hexamethyl disilazane) is introduced into the chamber to perform surface treatment, then the object is conveyed to a coating machine part 14 where a photoresist is coated thereon.
    • 38. 发明专利
    • Micropattern formation method
    • 微波炉形成方法
    • JPS5730829A
    • 1982-02-19
    • JP10499080
    • 1980-08-01
    • Hitachi Ltd
    • MATSUZAWA TOSHIHARUDOUDA KIKUOIWAYAGI TAKAOYANAGISAWA HIROSHI
    • C23F1/00G03F7/012G03F7/038G03F7/26H01L21/306
    • G03F7/038G03F7/0125
    • PURPOSE: To obtain a high precision micropattern by once development through a lift-off method, by forming a photoresist having a benzene ring or that further containing a specified aromatic azide compound, irradiating it with short wavelength ultraviolet rays, and removing nonirradiated parts.
      CONSTITUTION: A solution of polyvinylphenol, its bromide, polyvinyl hydroxybenzoate, or a condensation product of phenol, cresol, or the like and formaldehyde is coated on a substrate 1 of a silicon wafer or the like for use in an integrated circuit. Alternatively, it is coated with a solution obtained by dissolving a compound represented by the formula in which A is O, S, CH
      2 , SO
      2 , S
      2 , or the like; X is H or N
      3 ; and Z is N
      3 when X is H, and Z is H or Cl, when X is N
      3 in the above condensate solution. This photoresist 5 is patternwise irradiated with short wavelength ultraviolet rays, freed of the unexposed parts with an aqueous solution of N(CH
      3 )
      4 OH or the like containing no alkali metal to form a resist pattern having a section of reversely tapered form. Then, aluminum 4 is vapor deposited to form an aluminum pattern 4 on the substrate 1, the resist 5 and the aluminum layer 4 on this are removed by a lift-off method, and a micropattern 4 of high density to be obtained.
      COPYRIGHT: (C)1982,JPO&Japio
    • 目的:通过一次剥离法得到高精度的微图案,通过形成具有苯环的光致抗蚀剂,或进一步含有特定的芳族叠氮化合物,用短波紫外线照射,除去非照射部。 构成:将聚乙烯基苯酚,其溴化物,聚羟基苯甲酸酯或苯酚,甲酚等的缩合产物和甲醛的溶液涂布在硅晶片等的基板1上,用于集成电路。 或者,将其溶解由A为O,S,CH2,SO2,S2等的由式表示的化合物所得到的溶液; X为H或N 3; 当X为H时Z为N3,Z为H或Cl时,X为上述缩合溶液中的N 3。 使用不含碱金属的N(CH 3)4 OH等的水溶液除去未曝光部分的短波长紫外线图案照射光致抗蚀剂5,形成具有倒锥形部分的抗蚀剂图案。 然后,在基板1上气相沉积铝4以形成铝图案4,通过剥离法去除抗蚀剂5和其上的铝层4,并获得高密度的微图案4。