专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US08314441B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US08314441B2
公开(公告)日：2012-11-20
申请号：US13084149
申请日：2011-04-11
申请人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
发明人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.
摘要翻译：具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。

32. 发明授权

US08246232B2 Optical waveguide and optical apparatus 有权
标题翻译：光波导和光学仪器
公开(公告)号：US08246232B2
公开(公告)日：2012-08-21
申请号：US12442592
申请日：2007-09-21
申请人： Josef Hüttner , Julius Muschaweck , Georg Bogner
发明人： Josef Hüttner , Julius Muschaweck , Georg Bogner
IPC分类号： F21V7/04
CPC分类号： G02B6/002
摘要： Described is an optical waveguide having a main direction of extension, at least one radiation entrance face, and a radiation exit face that extends longitudinally to the main direction of extension, wherein at least one radiation entrance face extends transversely to the main direction of extension, and the at least one radiation entrance face has two convexly curved subregions that are connected to each other by a kink-like or concavely shaped indentation. An optical device formed with such a waveguide is also described, as is a display device.
摘要翻译：描述了具有主延伸方向的光波导，至少一个辐射入射面和沿着主延伸方向纵向延伸的辐射出射面，其中至少一个辐射入射面横向延伸到主延伸方向，并且所述至少一个辐射入射面具有通过扭结或凹形形状的凹陷彼此连接的两个凸形弯曲的子区域。还描述了由这种波导形成的光学装置，以及显示装置。

33. 发明授权

US08237192B2 Light emitting diode chip with overvoltage protection 有权
标题翻译：具有过压保护功能的发光二极管芯片
公开(公告)号：US08237192B2
公开(公告)日：2012-08-07
申请号：US12742064
申请日：2008-12-09
申请人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
发明人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
IPC分类号： H01L28/74 , H01L31/111
CPC分类号： H01L25/167 , H01L23/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
摘要翻译：发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

34. 发明申请

US20120032362A1 Housing for an Optoelectronic Component, Optoelectronic Component, and Method for Producing a Housing for an Optoelectronic Component 有权
标题翻译：用于光电子部件的壳体，光电子部件以及用于制造光电元件的壳体的方法
公开(公告)号：US20120032362A1
公开(公告)日：2012-02-09
申请号：US13275980
申请日：2011-10-18
申请人： Georg Bogner
发明人： Georg Bogner
IPC分类号： B29D11/00
CPC分类号： H01L31/0203 , H01L31/0232 , H01L33/44 , H01L33/486 , H01L33/60 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： A method for making a housing for an optoelectronic component is disclosed. The housing has a plastic base body that has a front side with an assembly region for at least one radiation emitting or radiation detecting body. The plastic base body is formed from at least one first plastic component and at least one second plastic component. The second plastic component is disposed on the front side of the plastic base body, and is formed from a material that differs from the first plastic component in at least one optical property, and forms an optically functional region of the plastic base body.
摘要翻译：公开了一种用于制造用于光电子部件的壳体的方法。壳体具有塑料基体，其具有用于至少一个辐射发射或辐射检测体的前侧和组装区域。塑料基体由至少一个第一塑料部件和至少一个第二塑料部件形成。第二塑料部件设置在塑料基体的前侧，并且由与第一塑料部件不同的至少一种光学性质的材料形成，并形成塑料基体的光学功能区域。

35. 发明授权

US08071987B2 Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component 有权
标题翻译：用于光电子部件的壳体，光电子部件以及用于制造用于光电子部件的壳体的方法
公开(公告)号：US08071987B2
公开(公告)日：2011-12-06
申请号：US12443160
申请日：2007-09-27
申请人： Georg Bogner
发明人： Georg Bogner
IPC分类号： H01L33/00
CPC分类号： H01L31/0203 , H01L31/0232 , H01L33/44 , H01L33/486 , H01L33/60 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： A housing for an optoelectronic component is disclosed, having a plastic base body that has a front side with an assembly region for at least one radiation emitting or radiation detecting body, wherein the plastic base body is formed from at least one first plastic component and at least one second plastic component. The second plastic component is disposed on the front side of the plastic base body, and is formed from a material that differs from the first plastic component in at least one optical property, and forms an optically functional region of the plastic base body. Further, a method for producing a housing for an optoelectronic component and a light emitting diode component is disclosed.
摘要翻译：公开了一种用于光电子部件的壳体，其具有塑料基体，其具有用于至少一个辐射发射或辐射检测体的组装区域的前侧，其中塑料基体由至少一个第一塑料部件形成，至少一秒钟的塑料部件。第二塑料部件设置在塑料基体的前侧，并且由与第一塑料部件不同的至少一种光学性质的材料形成，并形成塑料基体的光学功能区域。此外，公开了一种用于制造用于光电子部件和发光二极管部件的壳体的方法。

36. 发明申请

US20110002587A1 Housing for an Optoelectronic Component and Arrangement of an Optoelectronic Component in a Housing 有权
标题翻译：光电元件住房和房屋中光电元件的布置
公开(公告)号：US20110002587A1
公开(公告)日：2011-01-06
申请号：US12521352
申请日：2008-01-09
申请人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
发明人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
IPC分类号： G02B6/36
CPC分类号： H01L33/483 , H01L25/0753 , H01L25/167 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014
摘要： A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.
摘要翻译：塑料外壳设置在载体元件上，并设置有凹部，光电元件布置在该凹部中。在背离载体元件的一侧上，该凹部具有可以设置有透明盖的外部开口。可以在塑料壳体上提供一个或多个结构，以便相对于光电子部件定向盖和/或光学部件。

37. 发明申请

US20100103696A1 OPTICAL WAVEGUIDE AND OPTICAL APPARATUS 有权
标题翻译：光学波导和光学设备
公开(公告)号：US20100103696A1
公开(公告)日：2010-04-29
申请号：US12442592
申请日：2007-09-21
申请人： Josef Huttner , Julius Muschaweck , Georg Bogner
发明人： Josef Huttner , Julius Muschaweck , Georg Bogner
IPC分类号： F21V7/04 , G02B6/10 , G02B6/26 , F21V3/00
CPC分类号： G02B6/002
摘要： Described is an optical waveguide having a main direction of extension, at least one radiation entrance face, and a radiation exit face that extends longitudinally to the main direction of extension, wherein at least one radiation entrance face extends transversely to the main direction of extension, and the at least one radiation entrance face has two convexly curved subregions that are connected to each other by a kink-like or concavely shaped indentation. An optical device formed with such a waveguide is also described, as is a display device.
摘要翻译：描述了具有主延伸方向的光波导，至少一个辐射入射面和沿着主延伸方向纵向延伸的辐射出射面，其中至少一个辐射入射面横向延伸到主延伸方向，并且所述至少一个辐射入射面具有通过扭结或凹形形状的凹陷彼此连接的两个凸形弯曲的子区域。还描述了由这种波导形成的光学装置，以及显示装置。

38. 发明申请

US20100084964A1 Arrangement and Method for Generating Mixed Light 有权
标题翻译：产生混合光的布置和方法
公开(公告)号：US20100084964A1
公开(公告)日：2010-04-08
申请号：US12524890
申请日：2008-01-30
申请人： Stefan Groetsch , Georg Bogner , Berthold Hahn , Volker Haerle , Kirstin Petersen
发明人： Stefan Groetsch , Georg Bogner , Berthold Hahn , Volker Haerle , Kirstin Petersen
IPC分类号： H01J1/62
CPC分类号： H01L33/508 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
摘要： At least two semiconductor components emit electromagnetic radiation in different wavelength ranges. The superimposition of these electromagnetic radiations of all semiconductor components has at least one fraction in the visible wavelength range. At least one of the semiconductor components has a luminescence conversion element in the beam path.
摘要翻译：至少两个半导体部件发射不同波长范围的电磁辐射。所有半导体组件的这些电磁辐射的叠加在可见波长范围内至少有一个分数。至少一个半导体部件在光束路径中具有发光转换元件。

39. 发明申请

US20080315227A1 Light-Emitting Diode Arrangement 有权
标题翻译：发光二极管布置
公开(公告)号：US20080315227A1
公开(公告)日：2008-12-25
申请号：US11631058
申请日：2005-05-18
申请人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
发明人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/58 , H01L33/60 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.
摘要翻译：公开了一种发光二极管装置，其包括具有辐射去耦表面的至少一个发光二极管（LED）芯片，通过该发光二极管芯片，在LED芯片中产生的大部分电磁辐射沿主要发射方向排出; 横向围绕LED芯片的壳体; 以及设置在主发射方向上的辐射去耦表面之后的反射光学器件。 LED布置特别适用于诸如配备相机的手机，数码相机或摄像机等设备。

40. 发明申请

US20080251900A1 Conductor Frame For an Electronic Component and Method For the Production Thereof 有权
标题翻译：电子元件导体框架及其制造方法
公开(公告)号：US20080251900A1
公开(公告)日：2008-10-16
申请号：US11576054
申请日：2005-08-08
申请人： Karlheinz Arndt , Huey Ling Rena Lim , Georg Bogner , Stefan Gruber , Markus Schneider
发明人： Karlheinz Arndt , Huey Ling Rena Lim , Georg Bogner , Stefan Gruber , Markus Schneider
IPC分类号： H05K13/00 , H01L23/495
CPC分类号： H01L23/49541 , H01L23/495 , H01L23/49562 , H01L2924/0002 , Y10T29/49174 , H01L2924/00
摘要： Disclosed is a leadframe for at least one electronic component, comprising at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining a parallel offset between the retention tab and the adjacent region of lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.
摘要翻译：公开了一种用于至少一个电子部件的引线框架，包括至少两个电引线元件，每个电引线元件包括至少一个电引线接线片和至少一个保持接线片。提供在所述至少一个保持突片和所述引线元件之间的刻痕是限定所述保持突片和所述引线元件的相邻区域之间的平行偏移的刻痕。在引线元件和电引线接线片之间限定了额外的平行偏移，使得保持接线片和电引线接头位于共同的平面内。该分数使得能够容易地移除保持片，而不需要在引线元件和保持片之间存在不利的冲压间隙。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式