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    • 37. 发明授权
    • High-density dual-cell flash memory structure
    • 高密度双单元闪存结构
    • US06541815B1
    • 2003-04-01
    • US09974968
    • 2001-10-11
    • Jack A. MandelmanLouis L. HsuChung H. LamCarl J. Radens
    • Jack A. MandelmanLouis L. HsuChung H. LamCarl J. Radens
    • H01L29788
    • H01L29/66825H01L21/28273H01L27/115H01L27/11556H01L29/7885
    • A 2F2 flash memory cell structure and a method of fabricating the same are provided. The 2F2 flash memory cell structure includes a Si-containing substrate having a plurality of trenches formed therein. Each trench has sidewalls that extend to a bottom wall, a length and individual segments that include two memory cell elements per segment. Each memory cell element comprises (i) a floating gate region having L-shaped gates formed on a portion of each trench sidewall; (ii) a program line overlapping one side of the L-shaped gates present at the bottom wall of each trench and extending along the entire length of the plurality of trenches; and (iii) a control gate region overlying the floating gate region. The control gate region includes gates formed on portions of the sidewalls of the trenches that are coupled to the floating gate regions. The memory cell structure further includes bitline diffusion regions formed in the Si-containing semiconductor substrate abutting each trench segment; and wordlines that lay orthogonal to the trenches. The wordlines are in contact with a top surface of each control gate region.
    • 提供了一种2F2闪存单元结构及其制造方法。 2F2闪存单元结构包括其中形成有多个沟槽的含Si衬底。 每个沟槽具有延伸到底壁,长度和包括每个段的两个存储单元元件的单独段的侧壁。 每个存储单元元件包括(i)具有形成在每个沟槽侧壁的一部分上的L形栅极的浮栅区域; (ii)重叠在每个沟槽的底壁处的L形门的一侧并沿多个沟槽的整个长度延伸的程序线; 和(iii)覆盖浮栅区域的控制栅极区域。 控制栅极区域包括形成在沟槽的侧壁的与浮动栅极区域耦合的部分上的栅极。 所述存储单元结构还包括形成在所述含Si半导体衬底中的位线邻接每个沟槽段的位线扩散区; 和与沟槽正交的字线。 字线与每个控制栅极区域的顶表面接触。