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    • 32. 发明授权
    • Lithography contrast enhancement technique by varying focus with wavelength modulation
    • 通过波长调制改变焦点的平版印刷对比度增强技术
    • US06829040B1
    • 2004-12-07
    • US10703643
    • 2003-11-07
    • Jongwook KyeIvan LalovicChristopher F. LyonsRamkumar Subramanian
    • Jongwook KyeIvan LalovicChristopher F. LyonsRamkumar Subramanian
    • G03B2742
    • G03F7/70575G03F7/703G03F7/70333
    • A projection lithography system exposes a photo sensitive material on a surface of a semiconductor substrate that includes surface height variations between a high level and a low level. The system comprises an illumination source projecting illumination within a narrow wavelength band centered about a nominal wavelength on an optic path towards the substrate during an exposure period. A wavelength modulation system within the optic path comprises means for chromatically separating the narrow wavelength band into at least two sub-bands, the first sub-band being smaller than the narrow wavelength band and centered about a first sub-band wavelength and the second sub-band being smaller than the narrow wavelength band and centered about a second sub-band wavelength and means for passing each of the first sub-band and the second sub-band during distinct time periods within the exposure period.
    • 投影光刻系统在半导体衬底的表面上曝光感光材料,其包括高电平和低电平之间的表面高度变化。 该系统包括照射源,其在曝光期间内以在光路上朝着衬底的标称波长为中心的窄波长带内投射照明。 光路内的波长调制系统包括用于将窄波段色带分离成至少两个子带的装置,第一子带小于窄波段并以第一子带波长为中心,第二子带 带窄于窄波长带并以第二子带波长为中心,以及用于在曝光周期内的不同时间段内通过第一子带和第二子带中的每一个的装置。
    • 34. 发明授权
    • Dark field image reversal for gate or line patterning
    • 用于门或线图案的暗场图像反转
    • US06448164B1
    • 2002-09-10
    • US09716216
    • 2000-11-21
    • Christopher F. LyonsRamkumar SubramanianMarina V. PlatTodd P. Lukanc
    • Christopher F. LyonsRamkumar SubramanianMarina V. PlatTodd P. Lukanc
    • H01L213205
    • H01L21/0274H01L21/28123
    • A method of forming either a gate pattern or a line pattern in a resist by using a dark field mask and a combination of a negative photoresist and a positive photoresist. The dark field mask is used to create a hole within the positive photoresist, by exposing only a portion of the positive photoresist to light, and then by subjecting the positive photoresist to a developer. The negative photoresist is formed within the hole of the positive photoresist, and etched or polished so that it is only disposed within the hole. The negative photoresist and the positive photoresist are subjected to a flood light exposure, and then to a developer. This causes the positive photoresist to dissolve, leaving the negative photoresist, thereby providing a very-small-dimension resist pattern that can be used to form either a gate or a line for a semiconductor device.
    • 通过使用暗场掩模和负光致抗蚀剂和正性光致抗蚀剂的组合在抗蚀剂中形成栅极图案或线图案的方法。 暗场掩模用于在正性光致抗蚀剂中产生孔,通过仅将一部分正性光致抗蚀剂暴露于光,然后通过使正性光致抗蚀剂经受显影剂。 负光致抗蚀剂形成在正性光致抗蚀剂的孔内,并被蚀刻或抛光,使得其仅设置在孔内。 对负性光致抗蚀剂和正性光致抗蚀剂进行泛光曝光,然后进行显影。 这导致正性光致抗蚀剂溶解,留下负性光致抗蚀剂,从而提供可用于形成半导体器件的栅极或线的非常小的抗蚀剂图案。
    • 37. 发明授权
    • Metal bridging monitor for etch and CMP endpoint detection
    • 用于蚀刻和CMP端点检测的金属桥接监视器
    • US07011762B1
    • 2006-03-14
    • US10419534
    • 2003-04-21
    • Christopher F. LyonsRamkumar SubramanianSteven C. Avanzino
    • Christopher F. LyonsRamkumar SubramanianSteven C. Avanzino
    • C23F1/00G01R31/00
    • H01L21/3212H01L21/32051H01L21/32136H01L22/26H01L2924/0002H01L2924/00
    • One aspect of the present invention relates to a wafer containing a semiconductor substrate, at least one metal layer formed over the semiconductor substrate, and at least one electrical sensor embedded at least one of on and in the wafer to facilitate real time monitoring of the metal layer as it progresses through a subtractive metallization process. Another aspect of the present relates to a system and method for monitoring a subtractive metallization process in real time in order to effectuate an immediate response in the on-going process. The system contains a wafer comprising at least one metal layer formed on a semiconductor substrate, at least one electrical sensor in contact with the wafer and operable to detect and transmit electrical activity associated with the wafer, and an electrical measurement station operable to process electrical activity detected and received from the electrical sensor for monitoring a subtractive metallization process in real-time.
    • 本发明的一个方面涉及包含半导体衬底的晶片,在半导体衬底上形成的至少一个金属层和至少一个嵌入在晶片内和晶片中的至少一个的电传感器,以便于金属的实时监测 当它通过减色金属化过程进行时。 本发明的另一方面涉及一种用于实时监测减色金属化过程以便在持续过程中实现立即响应的系统和方法。 该系统包含晶片,该晶片包括形成在半导体衬底上的至少一个金属层,与晶片接触的至少一个电传感器,其可操作以检测和传输与晶片相关的电活动;以及电测量站,可操作以处理电活动 从电传感器检测和接收,用于实时监测减色金属化处理。