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    • 35. 发明授权
    • Method and apparatus for performing target-image-based optical proximity correction
    • 用于执行基于目标图像的光学邻近校正的方法和装置
    • US07382912B2
    • 2008-06-03
    • US11325211
    • 2006-01-03
    • Youping Zhang
    • Youping Zhang
    • G03F9/00G06F17/50G06K9/00
    • G03F9/00G03F1/30G03F1/36G03F1/70
    • A system that performs target-image-based optical proximity correction on masks that are used to generate an integrated circuit is presented. The system operates by first receiving a plurality of masks that are used to expose features on the integrated circuit. Next, the system computes a target image for a target feature defined by the plurality of masks, wherein mask features from different masks define the target image. The system dissects the feature into a plurality of segments, wherein dissecting the mask feature involves using dissection parameters associated with geometric characteristics of the target image, instead of using dissection parameters associated with geometric characteristics of the mask feature. The system then performs an optical proximity correction (OPC) operation on the plurality of masks, wherein the OPC operation uses parameters associated with geometric characteristics of the target image to perform optical proximity correction on the mask features that define the target image.
    • 提出了一种在用于生成集成电路的掩模上执行基于目标图像的光学邻近校正的系统。 该系统首先接收用于暴露集成电路上的特征的多个掩模来操作。 接下来,系统计算由多个掩模定义的目标特征的目标图像,其中来自不同掩模的掩模特征定义目标图像。 该系统将特征解剖成多个段,其中解剖掩模特征涉及使用与目标图像的几何特征相关联的解剖参数,而不是使用与掩模特征的几何特征相关联的解剖参数。 然后,系统对多个掩模执行光学邻近校正(OPC)操作,其中OPC操作使用与目标图像的几何特征相关联的参数来对限定目标图像的掩模特征进行光学邻近校正。
    • 36. 发明申请
    • Photolithographic mask correction
    • 光刻掩模校正
    • US20070113216A1
    • 2007-05-17
    • US11273685
    • 2005-11-14
    • Youping Zhang
    • Youping Zhang
    • G06F17/50
    • G06F17/5068
    • An exemplary method for modifying at least part of an integrated circuit layout comprises obtaining an integrated circuit device layout, the integrated circuit device being designed using a library of cells, obtaining a modified library of cells, and replacing at least one cell in the integrated circuit device layout with a corresponding modified cell of the modified library to obtain a modified integrated circuit device layout. The modified library includes modified cells corresponding to cells in the library and candidate areas of each modified cell indicating portions of the cell for further processing. At least some of the modified cells have been modified to at least partially compensate for a manufacturing effect.
    • 用于修改集成电路布局的至少一部分的示例性方法包括获得集成电路器件布局,使用单元库设计的集成电路器件,获得修改的单元库,以及替换集成电路中的至少一个单元 设备布局与修改库的相应修改单元获得修改后的集成电路设备布局。 修饰的文库包括对应于文库中的细胞的修饰细胞和每个修饰的细胞的候选区域,指示细胞的部分用于进一步处理。 修饰的细胞中的至少一些已被修饰以至少部分补偿制造效果。
    • 40. 发明授权
    • Methods and systems for pattern design with tailored response to wavefront aberration
    • 用于图案设计的方法和系统,具有针对波前像差的定制响应
    • US08918742B2
    • 2014-12-23
    • US13542625
    • 2012-07-05
    • Hanying FengYu CaoJun YeYouping Zhang
    • Hanying FengYu CaoJun YeYouping Zhang
    • G06F17/50G03B27/54G03F7/20
    • G03F7/706G03F7/70683
    • The present invention relates to methods and systems for designing gauge patterns that are extremely sensitive to parameter variation, and thus robust against random and repetitive measurement errors in calibration of a lithographic process utilized to image a target design having a plurality of features. The method may include identifying most sensitive line width/pitch combination with optimal assist feature placement which leads to most sensitive CD (or other lithography response parameter) changes against lithography process parameter variations, such as wavefront aberration parameter variation. The method may also include designing gauges which have more than one test patterns, such that a combined response of the gauge can be tailored to generate a certain response to wavefront-related or other lithographic process parameters. The sensitivity against parameter variation leads to robust performance against random measurement error and/or any other measurement error.
    • 本发明涉及用于设计对参数变化非常敏感的规格图案的方法和系统,因此对于用于对具有多个特征进行成像的目标设计的光刻工艺的校准中的随机和重复的测量误差是鲁棒的。 该方法可以包括以最佳辅助特征放置来识别最敏感的线宽/间距组合,其导致针对光刻过程参数变化(例如波前像差参数变化)的最敏感的CD(或其他光刻响应参数)变化。 该方法还可以包括设计具有多于一个测试图案的计量器,使得量规的组合响应可以被调整以产生对波前相关或其它光刻工艺参数的特定响应。 对参数变化的敏感性导致对随机测量误差和/或任何其他测量误差的鲁棒性能。