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31. 发明授权

US07502702B1 Method and apparatus for dynamic adjustment of sensor and/or metrology sensitivities 有权
标题翻译：用于动态调节传感器和/或计量灵敏度的方法和装置
公开(公告)号：US07502702B1
公开(公告)日：2009-03-10
申请号：US11221078
申请日：2005-09-07
申请人： Richard J. Markle , Christopher A. Bode , Kevin R. Lensing
发明人： Richard J. Markle , Christopher A. Bode , Kevin R. Lensing
IPC分类号： G01D18/00
CPC分类号： G01D18/00
摘要： The present invention provides a method and apparatus for dynamic adjustment of sensor and/or metrology sensitivities. The method includes accessing measurement information provided by a first measurement device and modifying a sensitivity of a second measurement device based on the measurement information provided by the first measurement device.
摘要翻译：本发明提供一种用于动态调节传感器和/或计量灵敏度的方法和装置。该方法包括访问由第一测量装置提供的测量信息，并且基于由第一测量装置提供的测量信息来修改第二测量装置的灵敏度。

32. 发明授权

US07120514B1 Method and apparatus for performing field-to-field compensation 有权
标题翻译：用于执行现场补偿的方法和装置
公开(公告)号：US07120514B1
公开(公告)日：2006-10-10
申请号：US09815446
申请日：2001-03-22
申请人： Christopher A. Bode , Joyce S. Oey Hewett
发明人： Christopher A. Bode , Joyce S. Oey Hewett
IPC分类号： G06F19/00 , G06F7/48
CPC分类号： G03F9/7034 , G03F7/70633
摘要： The present invention provides for a method and an apparatus for performing field-to-field compensation during semiconductor manufacturing. At least one semiconductor device is processed. Metrology data is collected from the processed semiconductor device. A field-to-field metrology analysis is performed based upon the metrology data. Residual-error analysis is performed based upon the field-to-field analysis.
摘要翻译：本发明提供一种用于在半导体制造期间执行场到场补偿的方法和装置。至少一个半导体器件被处理。从被处理的半导体器件收集测量数据。基于测量数据进行现场测量分析。基于现场分析进行残差分析。

33. 发明授权

US07069103B1 Controlling cumulative wafer effects 有权
标题翻译：控制累积晶圆效应
公开(公告)号：US07069103B1
公开(公告)日：2006-06-27
申请号：US10184814
申请日：2002-06-28
申请人： Christopher A. Bode , Matthew A. Purdy
发明人： Christopher A. Bode , Matthew A. Purdy
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32198 , G05B2219/32201 , G05B2219/45031 , Y02P90/22
摘要： A method and apparatus provided for controlling cumulative wafer effects. The method comprises processing a workpiece, determining a cumulative effect of the processing on the workpiece and comparing the determined cumulative effect to a reference target value. The method further comprises adjusting a downstream process of the workpiece based on comparing the determined cumulative effect to the reference target value.
摘要翻译：提供用于控制累积晶片效应的方法和装置。该方法包括处理工件，确定处理对工件的累积效应，并将确定的累积效应与参考目标值进行比较。该方法还包括基于将确定的累积效应与参考目标值进行比较来调整工件的下游过程。

34. 发明授权

US07020535B1 Method and apparatus for providing excitation for a process controller 失效
标题翻译：为过程控制器提供激励的方法和装置
公开(公告)号：US07020535B1
公开(公告)日：2006-03-28
申请号：US10702877
申请日：2003-11-06
申请人： Christopher A. Bode , J. Broc Stirton , Robert J. Chong
发明人： Christopher A. Bode , J. Broc Stirton , Robert J. Chong
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32097 , G05B2219/37538 , G05B2219/45031 , Y02P90/22 , Y02P90/265
摘要： A method includes defining a design window for a manufacturing process performed by a tool and a process window within the design window. A workpiece likely to have a characteristic outside the process window is identified. The characteristic of the identified workpiece is measured. A control model for controlling the tool is updated using the measured characteristic. A system includes a tool, a process controller, a metrology tool, and a sampling controller. The tool is adapted to process workpieces in accordance with a manufacturing process. The manufacturing process has an associated design window and a process window defined within the design window. The process controller is adapted to control the tool using a control model. The sampling controller is adapted to identify a workpiece likely to have a characteristic outside the process window and direct the metrology tool to measure the characteristic of the identified workpiece. The process controller is further adapted to update the control model using the measured characteristic.
摘要翻译：一种方法包括定义由设计窗口内的工具和处理窗口执行的制造过程的设计窗口。识别出可能具有处理窗口外的特征的工件。测量所识别的工件的特性。使用测量特性更新用于控制刀具的控制模型。系统包括工具，过程控制器，计量工具和采样控制器。该工具适于根据制造过程处理工件。制造过程具有关联的设计窗口和在设计窗口内定义的过程窗口。过程控制器适用于使用控制模型来控制工具。采样控制器适于识别可能具有处理窗口外的特征的工件，并引导计量工具测量所识别的工件的特性。过程控制器还适于使用所测量的特征来更新控制模型。

35. 发明授权

US06871114B1 Updating process controller based upon fault detection analysis 失效
标题翻译：基于故障检测分析更新过程控制器
公开(公告)号：US06871114B1
公开(公告)日：2005-03-22
申请号：US10231713
申请日：2002-08-30
申请人： Eric O. Green , Matthew A. Purdy , Elfido Coss, Jr. , Christopher A. Bode , Robert J. Chong , Gregory A. Cherry
发明人： Eric O. Green , Matthew A. Purdy , Elfido Coss, Jr. , Christopher A. Bode , Robert J. Chong , Gregory A. Cherry
IPC分类号： G05B19/404 , G06F19/00
CPC分类号： G05B19/404 , G05B2219/37252 , G05B2219/37345 , G05B2219/45031
摘要： A method and an apparatus for adjusting a process controller based upon a fault detection analysis. A process step upon a workpiece is performed using a processing tool. Manufacturing data relating to processing of the workpiece is acquired. The manufacturing data may include metrology data relating to the processed workpiece and/or tool state data relating to the tool state of a processing tool. A metrology/tool state data integration process is performed based upon the acquired manufacturing data. The metrology/tool state data integration process includes performing an assessment of a tool health related to the processing tool and adjusting an emphasis of the metrology data based upon the assessment of the tool health.
摘要翻译：一种基于故障检测分析调整过程控制器的方法和装置。使用加工工具进行工件的加工步骤。获取与工件的加工有关的制造数据。制造数据可以包括与处理工具有关的计量学数据和/或与加工工具的工具状态有关的刀具状态数据。基于获取的制造数据执行计量/工具状态数据集成处理。计量/工具状态数据集成过程包括对与处理工具相关的工具健康进行评估，并且基于对工具健康的评估来调整计量数据的重点。

36. 发明授权

US06745086B1 Method and apparatus for determining control actions incorporating defectivity effects 有权
标题翻译：用于确定包含缺陷效应的控制动作的方法和装置
公开(公告)号：US06745086B1
公开(公告)日：2004-06-01
申请号：US10114785
申请日：2002-04-03
申请人： Alexander J. Pasadyn , Thomas J. Sonderman , Christopher A. Bode
发明人： Alexander J. Pasadyn , Thomas J. Sonderman , Christopher A. Bode
IPC分类号： G06F1300
CPC分类号： H01L22/20
摘要： A method includes processing workpieces in accordance with an operating recipe. Metrology data associated with at least one of the workpieces is received. A proposed control action is generated based on the metrology data. A defectivity metric is generated based on the proposed control action. The proposed control action is modified based on the defectivity metric. A manufacturing system includes a process tool, a metrology tool, and a process controller. The process tool is configured to process workpieces in accordance with an operating recipe. The metrology tool is configured to provide metrology data associated with at least one of the workpieces. The process controller is configured to generate a proposed control action based on the metrology data, generate a defectivity metric based on the proposed control action, and modify the proposed control action based on the defectivity metric.
摘要翻译：一种方法包括根据操作配方处理工件。接收与至少一个工件相关联的计量数据。基于测量数据生成提出的控制动作。基于所提出的控制动作产生缺陷度量。所提出的控制动作根据缺陷度量进行修改。制造系统包括处理工具，计量工具和过程控制器。过程工具被配置为根据操作配方处理工件。计量工具被配置为提供与至少一个工件相关联的度量数据。过程控制器被配置为基于测量数据生成提出的控制动作，基于所提出的控制动作生成缺陷度量，并且基于缺陷度量度修改所提出的控制动作。

37. 发明授权

US06732007B1 Method and apparatus for implementing dynamic qualification recipes 有权
标题翻译：用于实施动态鉴定食谱的方法和装置
公开(公告)号：US06732007B1
公开(公告)日：2004-05-04
申请号：US10164133
申请日：2002-06-05
申请人： Alexander J. Pasadyn , Christopher A. Bode
发明人： Alexander J. Pasadyn , Christopher A. Bode
IPC分类号： G06F1900
CPC分类号： H01L21/67276
摘要： A method includes retrieving current state information associated with a process tool. A dynamic qualification recipe is generated based on the current state information. The dynamic qualification recipe is provided to the process tool for subsequent processing of at least one test workpiece. A system includes a process tool and a qualification recipe controller. The qualification recipe controller is configured to retrieve current state information associated with the process tool, generate a dynamic qualification recipe based on the current state information, and provide the dynamic qualification recipe to the process tool for subsequent processing of at least one test workpiece.
摘要翻译：一种方法包括检索与处理工具相关联的当前状态信息。基于当前状态信息生成动态限定条件。将动态鉴定配方提供给处理工具用于随后处理至少一个测试工件。系统包括处理工具和资格配方控制器。鉴定配方控制器被配置为检索与处理工具相关联的当前状态信息，基于当前状态信息生成动态鉴定配方，并且向处理工具提供动态鉴定配方以用于随后处理至少一个测试工件。

38. 发明授权

US06687561B1 Method and apparatus for determining a sampling plan based on defectivity 有权
标题翻译：基于缺陷确定抽样方案的方法和装置
公开(公告)号：US06687561B1
公开(公告)日：2004-02-03
申请号：US10115432
申请日：2002-04-03
申请人： Alexander J. Pasadyn , Christopher A. Bode
发明人： Alexander J. Pasadyn , Christopher A. Bode
IPC分类号： G06F1900
CPC分类号： G05B19/41875 , G05B23/0243 , G05B2219/32191 , G05B2219/32199 , G05B2219/45031 , Y02P90/20 , Y02P90/22
摘要： A method includes processing a plurality of workpieces in accordance with an operating recipe. A defectivity metric is determined based on the operating recipe. A sampling plan for measuring a characteristic of selected workpieces processed using the operating recipe is determined based on the defectivity metric. A manufacturing system includes a process tool and a sampling controller. The process tool is configured to process a plurality of workpieces in accordance with an operating recipe. The sampling controller is configured to determine a defectivity metric based on the operating recipe and determine a sampling plan for measuring a characteristic of selected workpieces processed using the operating recipe based on the defectivity metric.
摘要翻译：一种方法包括根据操作配方处理多个工件。基于操作配方确定缺陷度量。基于缺陷率度量确定用于测量使用操作配方处理的所选择的工件的特性的采样计划。制造系统包括处理工具和采样控制器。处理工具被配置为根据操作配方处理多个工件。采样控制器被配置为基于操作配方来确定缺陷度量，并且基于缺陷率度量确定用于测量使用操作配方处理的所选择的工件的特性的采样计划。

39. 发明授权

US06610550B1 Method and apparatus for correlating error model with defect data 有权
标题翻译：将误差模型与缺陷数据相关的方法和装置
公开(公告)号：US06610550B1
公开(公告)日：2003-08-26
申请号：US10114782
申请日：2002-04-03
申请人： Alexander J. Pasadyn , Christopher A. Bode
发明人： Alexander J. Pasadyn , Christopher A. Bode
IPC分类号： H01L2166
CPC分类号： H01L22/20 , H01L2223/54453
摘要： A method and an apparatus for correlating error data with detect data. A semiconductor wafer in a first lot is processed. Defect data based upon analysis of the processed semiconductor wafer is acquired. Electrical test data based upon analysis of the processed semiconductor wafer is acquired. The electrical test data is acquired by performing a wafer electrical testing process on the processed semiconductor wafer. The electrical test data is correlated with the defect data to produce correlated data. At least one of the following is performed: a yield prediction or the performance prediction of a second lot based upon the correlated data. The yield prediction comprises predicting a percentage yield of acceptable semiconductor wafers in the second lot. The performance prediction comprises predicting the performance of the acceptable semiconductor wafers.
摘要翻译：一种用于将错误数据与检测数据相关的方法和装置。处理第一批中的半导体晶片。获取基于处理的半导体晶片的分析的缺陷数据。获取基于处理的半导体晶片的分析的电气测试数据。通过在经处理的半导体晶片上进行晶片电气测试处理来获得电测试数据。电气测试数据与缺陷数据相关，以产生相关数据。执行以下中的至少一个：基于相关数据的产量预测或第二批次的性能预测。产量预测包括预测第二批中可接受的半导体晶片的百分比产率。性能预测包括预测可接受的半导体晶片的性能。

40. 发明授权

US08321048B1 Associating data with workpieces and correlating the data with yield data 有权
标题翻译：将数据与工件相关联并将数据与收益数据相关联
公开(公告)号：US08321048B1
公开(公告)日：2012-11-27
申请号：US10185468
申请日：2002-06-28
申请人： Elfido Coss, Jr. , Anastasia O. Peterson , Christopher A. Bode
发明人： Elfido Coss, Jr. , Anastasia O. Peterson , Christopher A. Bode
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/37224 , Y02P90/22
摘要： A method and apparatus is provided for associating operational data with workpieces and correlating the operational data with yield data. The method comprises processing a workpiece using a processing tool, associating the operational data with the workpiece during the processing of the workpiece and measuring the yield data associated with the processed workpiece. The method further comprises correlating the operational data with the yield data to make one or more determinations.
摘要翻译：提供了一种用于将操作数据与工件相关联并将操作数据与产量数据相关联的方法和装置。该方法包括使用处理工具处理工件，在工件加工期间将操作数据与工件相关联，并测量与加工的工件相关的屈服数据。该方法还包括将操作数据与产量数据相关联以进行一个或多个确定。

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