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    • 32. 发明授权
    • Burst EDO memory device
    • Burst EDO存储设备
    • US5696732A
    • 1997-12-09
    • US754780
    • 1996-11-21
    • Paul S. ZagarBrett L. Williams
    • Paul S. ZagarBrett L. Williams
    • G06F12/06G11C7/10G11C11/407G11C8/00
    • G11C7/109G06F12/0638G11C11/407G11C7/1018G11C7/1021G11C7/1024G11C7/1039G11C7/1045G11C7/1078G11C7/1096G06F2212/2022
    • An integrated circuit memory device is designed for high speed data access and for compatibility with existing memory systems. An address strobe signal is used to latch a first address. During a burst access cycle the address is incremented internal to the device with additional address strobe transitions. A new memory address is only required at the beginning of each burst access. Read/Write commands are issued once per burst access eliminating the need to toggle the Read/Write control line at the device cycle frequency. Transitions of the Read/Write control line during a burst access will terminate the burst access, reset the burst length counter and initialize the device for another burst access. The device is compatible with existing Extended Data Out DRAM device pinouts, Fast Page Mode and Extended Data Out Single In-Line Memory Module pinouts, and other memory circuit designs.
    • 集成电路存储器件被设计用于高速数据访问和与现有存储器系统的兼容性。 地址选通信号用于锁存第一个地址。 在突发访问周期期间,地址在设备内部增加,并具有额外的地址选通转换。 只有在每次突发访问开始时才需要新的内存地址。 读/写命令每次突发存取发出一次,无需在器件周期频率下切换读/写控制线。 突发访问期间读/写控制线的转换将终止突发访问,重置突发长度计数器并初始化设备以进行另一个突发访问。 该器件与现有的扩展数据输出DRAM器件引脚排列,快速页面模式和扩展数据输出单列直插存储器模块引脚排列以及其他存储器电路设计兼容。
    • 33. 发明授权
    • Synchronous NAND DRAM architecture
    • 同步NAND DRAM架构
    • US5666323A
    • 1997-09-09
    • US615527
    • 1996-03-11
    • Paul S. Zagar
    • Paul S. Zagar
    • G11C11/407G11C7/10G11C11/401G11C11/404G11C11/4076G11C11/4096G11C8/00
    • G11C11/4076G11C11/404G11C11/4045G11C11/4096G11C7/1039G11C7/1042G11C7/1072
    • An integrated circuit memory device has two banks of NAND structured memory cells and a clock input for synchronously latching control, address and data signals. Time delays of sequentially accessing and restoring memory bits in the NAND structure are masked through the use of the dual bank architecture and synchronous timing. The NAND structured memory cells provide an extremely dense memory array for a high capacity memory device. The input clock signal driving a synchronous word line generator provides a simplified high speed access to the array. A set of random access storage registers temporarily store data from the array and provide high speed page access to an entire page of data from each bank of the memory. The ability to access one bank while simultaneously opening or closing a row in the other bank allows for an unlimited number of high speed sequential data accesses.
    • 集成电路存储器件具有两组NAND结构的存储器单元和用于同步地锁存控制,地址和数据信号的时钟输入。 通过使用双存储体架构和同步定时,对NAND结构中的顺序访问和恢复存储器位的时间延迟进行掩蔽。 NAND结构化存储器单元为高容量存储器件提供非常密集的存储器阵列。 驱动同步字线发生器的输入时钟信号提供对阵列的简化的高速访问。 一组随机访问存储寄存器临时存储阵列中的数据,并提供从存储器的每个存储体的整个数据页面的高速页面访问。 在同时打开或关闭另一个行中的一行时访问一个存储体的能力允许无限数量的高速顺序数据访问。
    • 35. 发明授权
    • CMOS logic cell for high-speed, zero-power programmable array logic
devices
    • CMOS逻辑单元,用于高速,零功率可编程阵列逻辑器件
    • US5270587A
    • 1993-12-14
    • US817167
    • 1992-01-06
    • Paul S. Zagar
    • Paul S. Zagar
    • H03K19/173H03K19/177H03K19/094G06F7/38
    • H03K19/1736H03K19/17712
    • A CMOS logic cell, which may be readily arrayed to construct fast, zero-power programmable array logic (PAL) devices or field-programmable logic array (FPLAs) is disclosed. The cell is constructed from first and second pairs of P-channel insulated-gate field effect transistors (IGFETs), and first and second pairs of N-channel IGFETs. Each pair of P-channel IGFETS is connected in series between an output node and V.sub.cc, while each pair of N-channel IGFETS is connected in series between the output node and V.sub.ss. The gate of one transistor of the first. P-channel IGFET pair is connected to the output of a first memory cell, while the gate of the other transistor of the same pair is connected to an input signal I; the gate of one transistor of the second P-channel IGFET pair is connected to the output of a second memory cell, while the gate of the other transistor of the same pair is connected to signal I* (the complement of input signal I). Likewise, the gate of one transistor of the first N-channel IGFET pair is connected to the output of the first memory cell, while the gate of the other transistor of the same pair is connected to signal I*; the gate of one transistor of the second N-channel IGFET pair is connected to the output of the second memory cell, while the gate of the other transistor of the same pair is connected to signal I. Each of the memory cells may be programmed to provide either a CMOS logical 1 or 0 output, and may be either nonvolatile or volatile.
    • 公开了可以容易地排列以构建快速零功率可编程阵列逻辑(PAL)器件或现场可编程逻辑阵列(FPGA)的CMOS逻辑单元。 该单元由第一和第二对P沟道绝缘栅场效应晶体管(IGFET)以及第一和第二对N沟道IGFET构成。 每对P沟道IGFETS串联连接在输出节点和Vcc之间,而每对N沟道IGFETS串联连接在输出节点和Vss之间。 第一个晶体管的栅极。 P沟道IGFET对连接到第一存储单元的输出,同一对的另一晶体管的栅极连接到输入信号I; 第二P沟道IGFET对的一个晶体管的栅极连接到第二存储单元的输出,而同一对的另一个晶体管的栅极连接到信号I *(输入信号I的补码)。 类似地,第一N沟道IGFET对的一个晶体管的栅极连接到第一存储单元的输出,同一对的另一个晶体管的栅极连接到信号I *; 第二N沟道IGFET对的一个晶体管的栅极连接到第二存储单元的输出,而同一对的另一个晶体管的栅极连接到信号I.每个存储单元可被编程为 提供CMOS逻辑1或0输出,并且可以是非易失性的或易失性的。
    • 38. 发明授权
    • Circuit for cancelling and replacing redundant elements
    • 用于取消和更换冗余元件的电路
    • US06208568B1
    • 2001-03-27
    • US09133714
    • 1998-08-13
    • Paul S. ZagarAdrian E. Ong
    • Paul S. ZagarAdrian E. Ong
    • G11C1300
    • G11C29/785G11C29/838
    • In an integrated circuit having addressable primary elements and redundant elements which can be programmed to replace primary elements, a circuit and method are provided for cancelling and replacing redundant elements. A circuit is described which can be used in a memory such as a dynamic random access memory (DRAM) which uses a selectively blowable anti-fuse to disable a redundant element which was previously programmed to replace a defective primary element. The disclosure describes a method for permanently cancelling the defective redundant element and replacing the defective redundant element with another redundant element.
    • 在具有可寻址主要元件的集成电路和可编程为替代主要元件的冗余元件中,提供了用于取消和替换冗余元件的电路和方法。 描述了可以用于存储器中的电路,例如动态随机存取存储器(DRAM),其使用可选择地可吹出的反熔丝来禁用先前被编程为替换有缺陷的主要元件的冗余元件。 本公开描述了一种用于永久地消除有缺陷的冗余元件并用另一个冗余元件替换有缺陷的冗余元件的方法。