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31. 发明申请

US20100051466A1 Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings 审中-公开
标题翻译：使用薄介电涂层形成电隔离结构的方法
公开(公告)号：US20100051466A1
公开(公告)日：2010-03-04
申请号：US12506547
申请日：2009-07-21
申请人： Dennis R. Smalley , Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard
发明人： Dennis R. Smalley , Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard
IPC分类号： C25D1/20 , C25D5/10
CPC分类号： A61N1/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/20 , C25D5/022 , G01R1/0483 , G01R1/06716 , G01R1/07357 , G01R31/2886 , H05K3/467 , H05K3/4682
摘要： Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.
摘要翻译：用于生产多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层，包括用于提供将第一导电材料的至少一部分与（1）第一导电材料的其它部分，（2）第二导电材料或（3）另一种电介质材料，并且其中电介质涂层的厚度与用于形成结构的层的厚度相比较薄。在一些优选实施例中，每个单独层的部分被电介质材料包封，而在其它实施例中，材料的不同区域之间的边界通过电介质屏障彼此隔离。

32. 发明申请

US20100010525A1 Miniature Shredding Tool for Use in Medical Applications and Methods for Making 有权
标题翻译：用于医疗应用和制造方法的微型粉碎工具
公开(公告)号：US20100010525A1
公开(公告)日：2010-01-14
申请号：US12490295
申请日：2009-06-23
申请人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen
发明人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen
IPC分类号： A61B17/32
CPC分类号： A61B17/32002 , A61B10/02 , A61B17/14 , A61B17/1659 , A61B17/1671 , A61B17/221 , A61B17/320725 , A61B17/320758 , A61B90/361 , A61B2017/00261 , A61B2017/003 , A61B2017/00327 , A61B2017/00526 , A61B2017/00539 , A61B2017/00553 , A61B2017/2212 , A61B2017/2215 , A61B2017/320048 , A61B2017/320064 , A61B2017/320775 , B33Y80/00 , F16H55/06 , F16H55/18 , Y10T74/19623
摘要： The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.
摘要翻译：本发明一般涉及微尺度或毫米级装置的领域，以及使用多层多材料电化学制造方法来制造这种装置，具体实施方案涉及粉碎装置，更具体地说涉及用于医疗应用。在一些实施例中，在去除脊髓组织的过程中使用组织去除装置，并且在其他实施例中，类似的装置用于从血管中去除血栓。

33. 发明申请

US20090301893A1 Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks 审中-公开
标题翻译：使用粘附掩模形成多层结构的方法和装置
公开(公告)号：US20090301893A1
公开(公告)日：2009-12-10
申请号：US12479638
申请日：2009-06-05
申请人： Adam L. Cohen , Jill R. Thomassian , Michael S. Lockard , Marvin M. Kilgo, III , Uri Frodis , Dennis R. Smalley
发明人： Adam L. Cohen , Jill R. Thomassian , Michael S. Lockard , Marvin M. Kilgo, III , Uri Frodis , Dennis R. Smalley
IPC分类号： C25D5/02 , C25F5/00
CPC分类号： C25D1/003 , C25D1/00 , C25D1/20 , C25D5/02 , C25D5/022 , C25D5/10 , C25D5/14 , C25D5/48 , C25D5/50
摘要： Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.
摘要翻译：提供了多种电化学制造方法和装置，用于使用粘附的掩模（例如由液体光致抗蚀剂或干膜形成）从多层沉积材料制备多层结构（例如具有中尺度或微尺度特征），其中两个或者可以在每层中提供更多的材料，其中至少一种材料是结构材料，并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。材料可以包括以无电解方式电沉积或沉积的导电材料。在一些实施例中，特别注意确保在连续层上形成的图案之间的对准。

34. 发明授权

US07588674B2 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures 有权
标题翻译：在结构的电化学制造期间保持层的平行度和/或实现所需厚度的层的方法和装置
公开(公告)号：US07588674B2
公开(公告)日：2009-09-15
申请号：US11028944
申请日：2005-01-03
申请人： Uri Frodis , Adam L. Cohen , Michael S. Lockard
发明人： Uri Frodis , Adam L. Cohen , Michael S. Lockard
IPC分类号： C25D5/52
CPC分类号： C25D5/48 , B33Y10/00 , B81C1/00492 , B81C99/0065 , B81C2201/0104 , B81C2201/0197 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/10 , C25D21/12 , H01L21/2885 , H01L21/76885 , Y10T156/1052
摘要： Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.
摘要翻译：本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。

35. 发明申请

US20090015903A1 Complex Microdevices and Apparatus and Methods for Fabricating Such Devices 审中-公开
标题翻译：用于制造这种装置的复杂微型装置和装置及方法
公开(公告)号：US20090015903A1
公开(公告)日：2009-01-15
申请号：US12099976
申请日：2008-04-09
申请人： Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , John D. Evans
发明人： Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , John D. Evans
IPC分类号： G02B26/00 , C25D5/02
CPC分类号： H02N1/008 , B33Y10/00 , B81C1/0019 , C25D1/003
摘要： Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB®).
摘要翻译：本发明的各种实施例涉及包括传感器，致动器，阀，扫描反射镜，加速度计，开关等的各种微型装置。在一些实施例中，通过电化学制造（EFAB）形成器件。

36. 发明申请

US20080142369A1 Integrated Circuit Packaging Using Electrochemically Fabricated Structures 审中-公开
标题翻译：使用电化学结构的集成电路封装
公开(公告)号：US20080142369A1
公开(公告)日：2008-06-19
申请号：US11943536
申请日：2007-11-20
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard
IPC分类号： C25D5/02
CPC分类号： C25D1/003 , C23C18/16 , C23C18/1605 , C23C18/1651 , C25D5/02 , C25D5/022 , C25D5/10 , H01L21/48 , H01L21/4857 , H01L21/50 , H01L24/16 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/1461 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2224/0401 , H01L2924/014
摘要： Embodiments of the invention provide a package for holding an integrated circuit or other electronic component and/or a packaged integrated circuit or electronic component which is formed at least in part via an electrochemical fabrication process from a plurality of adhered layers of conductive and dielectric materials.
摘要翻译：本发明的实施例提供一种用于保持集成电路或其它电子部件和/或封装的集成电路或电子部件的封装，所述集成电路或电子部件至少部分地通过电化学制造工艺从多个粘附的导电和介电材料层形成。

37. 发明授权

US07363705B2 Method of making a contact 有权
标题翻译：联系方式
公开(公告)号：US07363705B2
公开(公告)日：2008-04-29
申请号：US11028962
申请日：2005-01-03
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
IPC分类号： H01R9/00
CPC分类号： G01R3/00 , G01R1/06744 , Y10T29/49147 , Y10T29/49204 , Y10T29/49222
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

38. 发明授权

US07185542B2 Complex microdevices and apparatus and methods for fabricating such devices 有权
标题翻译：复杂的微型装置以及用于制造这种装置的装置和方法
公开(公告)号：US07185542B2
公开(公告)日：2007-03-06
申请号：US10313795
申请日：2002-12-06
申请人： Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , John D. Evans
发明人： Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , John D. Evans
IPC分类号： G01P15/10 , G01P15/125
CPC分类号： B81C1/0019 , B33Y10/00
摘要： Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB™)
摘要翻译：本发明的各种实施例涉及包括传感器，致动器，阀，扫描反射镜，加速度计，开关等的各种微型装置。在一些实施例中，通过电化学制造（EFAB TM）形成器件，

39. 发明授权

US09244101B2 Electrochemical fabrication process for forming multilayer multimaterial microprobe structures 有权
公开(公告)号：US09244101B2
公开(公告)日：2016-01-26
申请号：US12431680
申请日：2009-04-28
申请人： Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02 , C25D5/48 , C23C28/02 , G01R3/00 , G01R1/067 , H01L21/48 , C25D1/00 , C23C18/16
CPC分类号： G01R3/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D5/02 , C25D5/10 , G01R1/06716 , G01R1/06744 , G01R1/06755 , H01L21/4853
摘要： Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

40. 发明申请

US20150368820A9 Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures 有权
公开(公告)号：US20150368820A9
公开(公告)日：2015-12-24
申请号：US12431680
申请日：2009-04-28
申请人： Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02 , C25D5/10 , B32B38/10
CPC分类号： G01R3/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D5/02 , C25D5/10 , G01R1/06716 , G01R1/06744 , G01R1/06755 , H01L21/4853
摘要： Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

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