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    • 34. 发明授权
    • Method and apparatus for quantitative evaluation of wall zeta-potential, and method and apparatus for quantitative visualization of surface modification pattern
    • 壁ζ电位定量评估方法和装置,以及表面修饰图案定量可视化的方法和装置
    • US08592781B2
    • 2013-11-26
    • US13120041
    • 2009-09-25
    • Yohei SatoYutaka KazoeShu Miyakawa
    • Yohei SatoYutaka KazoeShu Miyakawa
    • G01N21/64
    • G01N21/648G01K11/20G01K2213/00G01N2021/6421
    • A first and a second fluorescent dye are mixed into a solution, the first dye being positively ionized in the solution and the second dye being negatively ionized in the solution and having different fluorescence wavelengths from the first dye. The solution is flown onto a measured surface, and the surface is excited with an evanescent wave to produce a fluorescence intensity distribution of two colors. A fluorescence intensity of the surface is measured using a two-dimensional imaging element, the element providing a fluorescence intensity of each color separated from the other colors, thereby calculating a ratio of the fluorescence intensities of the colors. Using an equation expressing a relationship between the ratio of fluorescence intensities and a wall zeta potential, the ratio is converted to a two-dimensional distribution of wall zeta potentials. This achieves visualizing in real time and quantitatively evaluating the two-dimensional distribution of wall zeta potentials, and surface modifications.
    • 将第一和第二荧光染料混合到溶液中,第一染料在溶液中被正离子化,第二染料在溶液中被负电离并具有与第一染料不同的荧光波长。 将溶液流到测量的表面上,并用ev逝波激发表面以产生两种颜色的荧光强度分布。 使用二维成像元件测量表面的荧光强度,所述二维成像元件提供与其它颜色分离的每种颜色的荧光强度,由此计算颜色的荧光强度的比率。 使用表示荧光强度比和壁ζ电位之间关系的方程,将该比率转化为壁ζ电位的二维分布。 这实现了实时可视化,并定量评估了壁ζ电位的二维分布和表面修饰。
    • 39. 发明申请
    • SUPERCRITICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE
    • 用于半导体基板的超临界干燥方法
    • US20120118332A1
    • 2012-05-17
    • US13052232
    • 2011-03-21
    • Yohei SATOHisashi OkuchiHiroshi TomitaHidekazu HayashiYukiko Kitajima
    • Yohei SATOHisashi OkuchiHiroshi TomitaHidekazu HayashiYukiko Kitajima
    • B08B3/10B08B7/00
    • H01L21/67034
    • In one embodiment, after rinsing a semiconductor substrate having a fine pattern formed thereon with pure water, the pure water staying on the semiconductor substrate is substituted with a water soluble organic solvent, and then, the semiconductor substrate is introduced into a chamber in a state wet with the water soluble organic solvent. Then, the water soluble organic solvent is turned into a supercritical state by increasing a temperature inside of the chamber. Thereafter, the inside of the chamber is reduced in pressure while keeping the inside of the chamber at a temperature enough not to liquefy the pure water (i.e., rinsing pure water mixed into the water soluble organic solvent), and further, the water soluble organic solvent in the supercritical state is changed into a gaseous state, to be discharged from the chamber, so that the semiconductor substrate is dried.
    • 在一个实施方案中,在用纯水冲洗其上形成有精细图案的半导体衬底之后,将残留在半导体衬底上的纯水用水溶性有机溶剂代替,然后将半导体衬底引入到室中 用水溶性有机溶剂润湿。 然后,水溶性有机溶剂通过增加室内的温度而变成超临界状态。 此后,室内压力降低,同时保持室内不足液化纯水的温度(即冲洗混入水溶性有机溶剂中的纯水),此外,水溶性有机溶剂 处于超临界状态的溶剂变成气态,从室排出,使得半导体基板干燥。
    • 40. 发明申请
    • Test Unit and Test System
    • 测试单元和测试系统
    • US20120074974A1
    • 2012-03-29
    • US13375588
    • 2010-05-27
    • Yohei SatoKenichi Kataoka
    • Yohei SatoKenichi Kataoka
    • G01R1/04G01R1/067
    • G01R31/2887G01R31/3025H01L2924/0002H01L2924/00
    • A test unit to be used with a tester that tests an electrical characteristic of a circuit formed in a wafer includes a tester a board electrically connected to the tester; a first wireless port mounted on a lower surface of the tester board and electrically connected to the tester; a probe board that includes a probe to be in contact with an electrode pad of the electronic circuit, and is configured so that the probe board may be transferred along with the wafer into the system box while the probe and the electrode pad are in contact with each other; a second wireless port that is mounted on an upper surface of the probe board and electrically connected to the probe, and carries out contactless transmission/reception with the first wireless port; a chuck plate that is away from the tester board, and holds the probe board and the wafer; and a flexible expandable chamber that may be inflated by introducing gas thereinto.
    • 与测试晶片中形成的电路的电特性的测试器一起使用的测试单元包括:测试器,电连接到测试器; 安装在测试器板的下表面上并电连接到测试器的第一无线端口; 探针板,其包括与电子电路的电极焊盘接触的探针,并且被构造成使得探针板可以与晶片一起转移到系统箱中,同时探针和电极焊盘与 彼此; 第二无线端口,其安装在所述探针板的上表面上并电连接到所述探针,并且与所述第一无线端口执行非接触式发送/接收; 离开测试器板的夹盘,并保持探针板和晶片; 以及可以通过将气体引入其而膨胀的柔性可膨胀室。