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    • 36. 发明授权
    • Apparatus for processing a substrate
    • 用于处理衬底的装置
    • US08025732B2
    • 2011-09-27
    • US12071235
    • 2008-02-19
    • Hideaki SakuraiMasamitsu Itoh
    • Hideaki SakuraiMasamitsu Itoh
    • H01L21/027G03F7/30
    • H01L21/6708
    • A method for a substrate processing apparatus having a substrate holding mechanism and a chemical solution dispensing/sucking mechanism including a chemical solution dispensing port for supplying a first chemical solution and a chemical solution suction port, includes placing the target substrate on the substrate holding mechanism, laying out an auxiliary plate at a periphery of the substrate such that the two main faces are substantially flush with each other, supplying a second chemical solution onto the main faces, dispensing the first solution from the dispensing port and sucking the first and second solutions through the suction port, with the dispensing and suction ports brought into contact with the second solution, and while dispensing the first solution from the dispensing port and sucking the first solution through the suction port, scanning the dispensing/sucking mechanism such that the dispensing and suction ports are opposed to the main face of the substrate.
    • 一种具有基板保持机构的基板处理装置和包括用于供给第一化学溶液的化学溶液分配口和化学溶液吸入口的化学溶液分配/吸引机构的方法,包括将目标基板放置在基板保持机构上, 在所述基板的周围布置辅助板,使得所述两个主面彼此基本齐平,将第二化学溶液供应到所述主面上,从所述分配端口分配所述第一溶液并将所述第一溶液和所述第二溶液通过 所述吸入口与所述分配和吸入口与所述第二溶液接触,并且在从所述分配端口分配所述第一溶液并且通过所述吸入口吸入所述第一溶液的同时,扫描所述分配/吸入机构,使得所述分配和抽吸 端口与基板的主面相对。
    • 38. 发明申请
    • Substrate processing method, substrate processing apparatus, and semiconductor device manufacturing method
    • 基板加工方法,基板处理装置以及半导体装置的制造方法
    • US20080173400A1
    • 2008-07-24
    • US12071235
    • 2008-02-19
    • Hideaki SakuraiMasamitsu Itoh
    • Hideaki SakuraiMasamitsu Itoh
    • C23F1/08
    • H01L21/6708
    • A method for a substrate processing apparatus having a substrate holding mechanism and a chemical solution dispensing/sucking mechanism including a chemical solution dispensing port for supplying a first chemical solution and a chemical solution suction port, includes placing the target substrate on the substrate holding mechanism, laying out an auxiliary plate at a periphery of the substrate such that the two main faces are substantially flush with each other, supplying a second chemical solution onto the main faces, dispensing the first solution from the dispensing port and sucking the first and second solutions through the suction port, with the dispensing and suction ports brought into contact with the second solution, and while dispensing the first solution from the dispensing port and sucking the first solution through the suction port, scanning the dispensing/sucking mechanism such that the dispensing and suction ports are opposed to the main face of the substrate.
    • 一种具有基板保持机构的基板处理装置和包括用于供给第一化学溶液的化学溶液分配口和化学溶液吸入口的化学溶液分配/吸引机构的方法,包括将目标基板放置在基板保持机构上, 在所述基板的周围布置辅助板,使得所述两个主面彼此基本齐平,将第二化学溶液供应到所述主面上,从所述分配端口分配所述第一溶液并将所述第一溶液和所述第二溶液通过 所述吸入口与所述分配和吸入口与所述第二溶液接触,并且在从所述分配端口分配所述第一溶液并且通过所述吸入口吸入所述第一溶液的同时,扫描所述分配/吸入机构,使得所述分配和抽吸 端口与基板的主面相对。