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    • 32. 发明申请
    • LIGHTGUIDE
    • 光导
    • WO1998054606A1
    • 1998-12-03
    • PCT/JP1997001818
    • 1997-05-29
    • KURARAY CO., LTD.SHINJI, OsamuKUNISAWA, ToshitakaYOSHIKAWA, ToshiyukiYASUDA, Kouzo
    • KURARAY CO., LTD.
    • G02B06/00
    • G02B6/0036G02B6/00G02B6/0001G02B6/0061G02B6/0065Y10S385/901
    • A lightguide (3) which guides a light from at least one side end plane. A number of approximately trapezoidal protruding patterns whose apices in the cross sections perpendicular to the axis of a linear light sources have straight parts partially are arranged in patterns of specks, solid lines or broken lines on a rear surface which is opposite to a light emitting surface at a low density in a region close to the linear light source and at a high density in a region far from the linear light source so as to make the luminance distribution of the light emitted from the light emitting surface approximately uniform. It is recommended that the protruding pattern has an approximately trapezoidal shape having two round corners corresponding to both the edges of the apex in a cross section perpendicular to the axis of the linear light source, both the surface roughness of parts of which the apices of the protruding patterns are composed and the surface roughness of the parts in the protruding pattern forming surface where the protruding patterns are not formed are not larger than 0.2 /m respectively, the ratio H/W satisfies the relation, 0.1
    • 导光体(3),其从至少一个侧端平面引导光。 多个大致梯形的突出图案,其垂直于线状光源的轴线的截面中的顶点部分地具有直线部分,在与发光表面相对的后表面上以斑点,实线或虚线的图案布置 在靠近线性光源的区域中以低密度并且在远离线性光源的区域中以高密度,以使得从发光表面发射的光的亮度分布近似均匀。 推荐突出图案具有近似梯形的形状,其具有对应于垂直于线性光源的轴线的横截面中的顶点的两个边缘的两个圆角,其部分的顶点的表面粗糙度 构成突出图案,并且未形成突出图案的突出图案形成表面中的部件的表面粗糙度分别不大于0.2 / m,比率H / W满足关系式0.1
    • 33. 发明申请
    • PROCESS FOR THE PRODUCTION OF THERMOPLASTIC RESIN COMPOSITION
    • 生产热塑性树脂组合物的方法
    • WO1997013801A1
    • 1997-04-17
    • PCT/JP1996002962
    • 1996-10-14
    • KURARAY CO., LTD.MASUDA, HaruhisaOKU, TakashiKASHIMURA, Tsugunori
    • KURARAY CO., LTD.
    • C08G81/02
    • C08G81/027C08L67/02C08L2666/02
    • A process for the production of a thermoplastic resin composition, which is characterized by mixing a polyester resin (I) with an addition polymer (II) having 0.5 to 1 functional group reactive with the polyester resin at one end at a weight ratio of the resin to the polymer of 97/3 to 20/80 under molten conditions and subjecting the obtained mixture to solid-phase polymerization and which gives a thermoplastic resin composition comprising [1] a polyester resin (I') derived from the polyester resin (I) and having an enhanced molecular weight, [2] an addition polymer (II) having 0.5 to 1 functional group reactive with the polyester resin at one end and [3] a block copolymer (III) composed of a polyester block (i) derived from the polyester resin (I) and a polymer block (ii) derived from the addition polymer (II) wherein the ratio of {the total weight of the polyester resin (I') and the polyester block (i) of the block copolymer (III)} to {the total weight of the addition polymer (II) and the polymer block (ii) of the block copolymer (III)} lies between 97/3 and 20/80 and the molar ratio of the block copolymer (III) to the addition polymer (II) is 20/80 or above. The thermoplastic resin composition produced by this process is excellent in the compatibility with many kinds of polymers and therefore is useful as modifiers (such as compatibilizer or improver) for resins.
    • 一种热塑性树脂组合物的制造方法,其特征在于将聚酯树脂(I)与在一端与聚酯树脂反应的具有0.5〜1个官能团的加成聚合物(II)以树脂的重量比混合 在熔融条件下向97/3至20/80的聚合物加热,并将所得混合物进行固相聚合,得到包含[1]衍生自聚酯树脂(I)的聚酯树脂(I')的热塑性树脂组合物, 并且具有增强的分子量,[2]在一端具有0.5至1个与聚酯树脂反应的官能团的加成聚合物(II)和[3]由聚酯嵌段(i)组成的嵌段共聚物(III) 聚酯树脂(I)和衍生自加成聚合物(II)的聚合物嵌段(ii),其中聚酯树脂(I')和嵌段共聚物(III)的聚酯嵌段(i)的总重量 )}至{加成聚合物(II)的总重量a d)嵌段共聚物(III)的聚合物嵌段(ii)}在97/3和20/80之间,嵌段共聚物(III)与加成聚合物(II)的摩尔比为20/80或更高。 通过该方法制造的热塑性树脂组合物与多种聚合物的相容性优异,因此可用作树脂的改性剂(如增容剂或改良剂)。
    • 35. 发明申请
    • VINYL ALCOHOL POLYMER
    • VINYL酒精聚合物
    • WO1996039447A1
    • 1996-12-12
    • PCT/JP1995001096
    • 1995-06-05
    • KURARAY CO., LTD.FUJIWARA, NaokiKUSUDOU, TakeshiKAWAHARA, TakaharuSATO, Toshiaki
    • KURARAY CO., LTD.
    • C08F08/12
    • C08F8/12C08F2800/10C08F118/08C08F218/08C08F216/04C08F228/02
    • A vinyl alcohol polymer having a C2-C20 hydroxyalkyl group in the side chain. It has an excellent thermal stability, as the temperature causing a weight loss of 5 % is higher than 300 DEG C. As compared with conventional water-soluble vinyl alcohol polymers, which cause so much bubbling in a state dissolved in water when they have high surface activity that the industrial use thereof is problematic, the invention polymer, even when water-soluble, causes little bubbling in a state dissolved in water in spite of the high surface activity thereof, thus being highly useful industrially. It is useful as a thermoplastic resin and a dispersion stabilizer, and is applicable to various uses such as surfactant, paper modifier including paper coating agent, paper additive and pigment binder, adhesive for wood, paper, aluminum foil and inorganic material, nonwoven fabric binder, coating material, warp sizing agent, fiber treatment, sizing agent for hydrophobic fibers of, e.g., polyester, film, sheet, bottle and fiber.
    • 在侧链中具有C2-C20羟烷基的乙烯醇聚合物。 具有优异的热稳定性,因为导致重量减少5%的温度高于300℃。与常规的水溶性乙烯醇聚合物相比,当它们具有高的溶解在水中的状态下引起如此多的起泡 表面活性,其工业用途是有问题的,即使在水溶性的情况下,本发明的聚合物尽管表面活性高,但在溶解在水中的状态下几乎没有鼓泡,因此在工业上是非常有用的。 可用作热塑性树脂和分散稳定剂,适用于表面活性剂,纸张改性剂,纸张涂布剂,纸添加剂和颜料粘合剂,木材,纸,铝箔和无机材料的粘合剂,无纺布粘合剂 涂布材料,经纱上浆剂,纤维处理剂,例如聚酯,薄膜,片材,瓶子和纤维的疏水性纤维的上浆剂。
    • 36. 发明申请
    • HARD-TISSUE REPAIR COMPOSITION AND SUPPLY UNIT THEREFOR
    • 硬组织维修组合物及其供应单位
    • WO1996011715A1
    • 1996-04-25
    • PCT/JP1995002110
    • 1995-10-13
    • KURARAY CO., LTD.HINO, KenichiNAKASHIMA, Toshihide
    • KURARAY CO., LTD.
    • A61L25/00
    • A61L27/46A61L24/0084A61L2430/02C08L33/06
    • A hard-tissue repair composition comprising a paste (A) containing an inorganic powder of calcium phosphate, a polymerizable monomer mixture and a polymerization initiator and a paste (B) containing an inorganic powder of calcium phosphate, a polymerizable monomer mixture and a polymerization accelerator, wherein the content of the inorganic powder in each paste is 75-85 wt. % and each monomer mixture contains monomers represented by general formulae (1) and (2), the content of the monomer (1) accounting for 40-65 wt. % of the monomer mixture as a whole. The composition can well adhere to the bone and has a sufficient water resistance. As it generates little heat upon hardening, it is less detrimental to the patient's tissue. Furthermore, as the paste has an appropriate consistency, the supply unit of the invention facilitates homogeneous mixing of the pastes and application of the resultant mixture to the affected part. Thus this composition can be used not only as a bone cement but also as a filler for the defected part of the bone, a bone prosthesis, or an artificial bone.
    • 一种硬组织修复组合物,其包含含有磷酸钙的无机粉末,可聚合单体混合物和聚合引发剂的糊剂(A)和含有磷酸钙的无机粉末,可聚合单体混合物和聚合促进剂的糊剂(B) 其中,各浆料中的无机粉末的含量为75〜85重量%。 %,各单体混合物含有由通式(1)和(2)表示的单体,单体(1)的含量为40-65wt。 %的单体混合物作为一个整体。 组合物可以很好地粘附在骨上并具有足够的耐水性。 由于硬化时几乎不产生热量,因此对患者的组织不太有害。 此外,由于膏具有适当的稠度,本发明的供应单元有助于浆料的均匀混合并将所得混合物施加到受影响的部分。 因此,该组合物不仅可用作骨水泥,而且可用作骨,骨假体或人造骨的缺损部分的填充物。
    • 37. 发明申请
    • MONOLITHIC LCP POLYMER MICROELECTRONIC WIRING MODULES
    • 单片LCP聚合物微电子接线模块
    • WO1996008945A1
    • 1996-03-21
    • PCT/US1995011101
    • 1995-09-05
    • HOECHST CELANESE CORPORATIONKURARAY CO., LTD.
    • HOECHST CELANESE CORPORATIONKURARAY CO., LTD.JESTER, Randy, D.CULBERTSON, Edwin, C.FRANK, Detlef, M.ROUNSVILLE, Sherman, H.PENOYER, John, A.TSUDAKA, TakeichiONODERA, MioruSATO, ToshiakiSANEFUJI, Toru
    • H05K03/46
    • H05K3/4632H05K3/28H05K3/386H05K3/4617H05K2201/0129H05K2201/0141H05K2201/0145H05K2201/0195H05K2201/10378
    • The invention provides a multilayer microelectronic circuit board comprising a laminate of a plurality of circuit layers containing conductive vias (12) within the layers or a combination of conductive vias (12) and conductive wiring patterns (16) on a surface of the layers, said layers comprising a first liquid crystal polymer (10) and, interposed between said circuit layers, a layer of second liquid crystal polymer (21) having a melting point of at least about 10 DEG C lower than the melting point of said first liquid crystal polymer (10). The boards are produced by stacking a plurality of circuit layer sheets (10) in appropriate electrical alignment such that they are separated by an interposed layer (21) of the second liquid crystal polymer of lower melting point, and heating the stacked polymer sheets under pressure sufficient to bond the sheets or layers into a microelectronic printed circuit board, the temperature of the heating being sufficient to melt the lower melting second polymer but insufficient to melt the polymer present in the circuit layers. The second polymer layer may be interposed as a separate sheet during assembly or may be present as one or two separate surface layers (22) in contact with the higher melting point polymer (23) of the circuit layers.
    • 本发明提供一种多层微电子电路板,其包括多个电路层的叠层,该多个电路层在层内包含导电通孔(12),或者在该层的表面上的导电通孔(12)和导电布线图案(16)的组合, 包含第一液晶聚合物(10)的层和介于所述电路层之间的第二液晶聚合物(21)层,其熔点比所述第一液晶聚合物(10)的熔点低至少约10℃ (10)。 这些板通过以适当的电气对准层叠多个电路层片(10)而制成,使得它们被具有较低熔点的第二液晶聚合物的插入层(21)分开,并在压力下加热堆叠的聚合物片 足以将片或层结合成微电子印刷电路板,加热的温度足以熔化较低熔点的第二聚合物,但不足以熔化存在于电路层中的聚合物。 第二聚合物层可以在组装期间作为单独的片材插入,或者可以作为与电路层的较高熔点聚合物(23)接触的一个或两个分开的表面层(22)存在。