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    • 33. 发明专利
    • Process condition measurement device
    • 工艺条件测量装置
    • JP2014123762A
    • 2014-07-03
    • JP2014031279
    • 2014-02-21
    • Kla-Tencor Corpケーエルエー−テンカー・コーポレーションKla−Tencor Corporation
    • SUN MEIMARK WILTSEWAYNE G RENKENREID ZACHARYTONY DIBIASE
    • H01L21/66H01L21/027
    • H01L21/67253G03F7/70616G03F7/7085G03F7/70875Y10T29/4913
    • PROBLEM TO BE SOLVED: To provide a device which measures the temperature of wafers under exposure.SOLUTION: The device which measures parameters comprises: a substrate; a plurality of sensors 101-105 which measure parameters independently in different positions and are carried to the face of the substrate to be arranged thereon; electric conductors which spread on the surface and are connected to the sensors 101-105 and an electronic process component; and a cover which is arranged on the sensors 101-105, the electronic process component, and the conductors. The cover and the substrate have the same material characteristics to a manufacturing substrate to be processed by a substrate process cell. The present device has the approximately same thickness and/or flatness as that of the manufacturing substrate. A substrate process may be applied to the present device, and one or more parameters may be measured during the process using the present device. On the basis of parameter measurement by one or more sensors 101-105, operation characteristic of manufacturing wafers in the substrate process may be analyzed.
    • 要解决的问题:提供一种测量曝光下晶片温度的装置。解决方案:测量参数的装置包括:基板; 多个传感器101-105,其独立于不同位置测量参数,并被传送到要布置在其上的基板的表面; 在表面上扩展并连接到传感器101-105和电子处理部件的电导体; 以及布置在传感器101-105,电子处理部件和导体上的盖。 盖和基板与由基板处理单元加工的制造基板具有相同的材料特性。 本装置具有与制造基板大致相同的厚度和/或平坦度。 可以将衬底工艺应用于本装置,并且可以在使用本装置的工艺期间测量一个或多个参数。 基于通过一个或多个传感器101-105的参数测量,可以分析在基板工艺中制造晶片的操作特性。
    • 35. 发明专利
    • Catoptric objective mirror, broadband objective optical system with mirror, optical imaging system with catadioptric lens and broadband optical imaging system having two imaging paths or more
    • 目标目镜,宽带目标光学系统,具有镜面,光学成像系统,具有阴影镜头和宽带光学成像系统,具有两个成像条或更多
    • JP2013242595A
    • 2013-12-05
    • JP2013156941
    • 2013-07-29
    • Kla-Tencor Corpケーエルエー−テンカー・コーポレーションKla−Tencor Corporation
    • HWANG SHIOW-HWEIGREGORY L KIRKHWAN J JEONGDAVID SHAFERRUSSELL HUDYMA
    • G02B17/08G01N21/956G02B13/18
    • G02B17/0808G02B17/0652G02B17/084G02B21/04
    • PROBLEM TO BE SOLVED: To provide a broadband objective optical system and a broadband optical imaging system with two imaging paths or more that allow a use of a much shorter wavelength to improve resolving power as to an imaging optical device for sample inspection and avoid a risk of contaminant diffusion on a wafer.SOLUTION: An optical system includes an objective optical system with at least four mirrors and a focus adjustment optical system, and the mirrors include an outermost mirror with an aspect ratio equal to or less than 20:1. The focus adjustment optical system includes a refractive optical element. The objective optical system is configured to provide imaging at a numerical aperture equal to or greater than 0.7 and with central obscuration as low as 35%. The objective optical system may include two mirrors or more and one of the two or more mirrors contains a refractive module that seals off a central opening of the outermost mirror. The broadband imaging system may include one objective optical system and two or more imaging paths and the imaging paths are configured to provide imaging at the numeral aperture equal to or more than 0.7 and a field of view equal to or more than 0.8 mm.
    • 要解决的问题:提供宽带物镜光学系统和宽带光学成像系统,其具有两个成像路径或更多,允许使用更短的波长来提高用于样本检查的成像光学装置的分辨率,并避免风险 污染物扩散在晶片上。解决方案:光学系统包括具有至少四个反射镜和焦点调节光学系统的物镜光学系统,并且反射镜包括具有等于或小于20:1的纵横比的最外镜。 聚焦调整光学系统包括折射光学元件。 物镜光学系统被配置为提供等于或大于0.7的数值孔径并且具有低至35%的中心遮蔽的成像。 物镜光学系统可以包括两个反射镜或多于一个,并且两个或更多个反射镜中的一个包含折射模块,该折射模块密封最外侧镜的中心开口。 宽带成像系统可以包括一个物镜光学系统和两个或更多个成像路径,并且成像路径被配置为提供等于或大于0.7的数值孔径和等于或大于0.8mm的视场的成像。
    • 37. 发明专利
    • Device and method for forming conductive passage through insulating layer
    • 通过绝缘层形成导电通道的装置和方法
    • JP2012248535A
    • 2012-12-13
    • JP2012116119
    • 2012-05-22
    • Kla-Tencor Corpケーエルエー−テンカー・コーポレーションKla−Tencor Corporation
    • THOMAS PLETTNERMEHRAN NACEL-GOSHROBERT HEINESRUDY GARCIA
    • H01J37/20H01L21/66
    • H01L21/743
    • PROBLEM TO BE SOLVED: To electrically ground a substrate through an insulating layer on a surface of the substrate by nondestructive method.SOLUTION: It relates to a device for forming a conductive passage through an insulating layer on a surface of a substrate. A first radiation source is arranged so as to emit radiation to a first region of the insulating layer and a first electric contact is arranged so as to apply a first bias voltage to the first region. A second radiation source is arranged so as to emit radiation to a second region of the insulating layer and a second electric contact is arranged so as to apply a second bias voltage to the second region. Conductivity of the regions is increased by radiation such that a conduction passage is formed through the insulating layer in the regions. In an embodiment, the device can be used in an electron beam apparatus. Another embodiment relates to a method for forming the conductive passage through the insulating layer.
    • 要解决的问题:通过非破坏性方法将衬底电绝缘在衬底表面上的绝缘层。 解决方案:涉及用于形成通过基板表面上的绝缘层的导电通路的装置。 第一辐射源被布置成向绝缘层的第一区域发射辐射,并且布置第一电触点以便向第一区域施加第一偏置电压。 第二辐射源被布置成将辐射发射到绝缘层的第二区域,并且布置第二电触点以便向第二区域施加第二偏置电压。 通过辐射增加区域的电导率,使得通过该区域中的绝缘层形成传导通道。 在一个实施例中,该装置可以用在电子束装置中。 另一实施例涉及一种用于形成穿过绝缘层的导电通路的方法。 版权所有(C)2013,JPO&INPIT
    • 40. 发明专利
    • Electron reflector with multiple reflective mode
    • 具有多重反射模式的电子反射器
    • JP2011176316A
    • 2011-09-08
    • JP2011036851
    • 2011-02-23
    • Kla-Tencor Corpケーエルエー−テンカー・コーポレーションKla−Tencor Corporation
    • GRELLA LUCAFREED REGINAMCCORD MARK A
    • H01L21/027H01J37/305
    • H01J37/3175B82Y10/00B82Y40/00H01J2237/31789
    • PROBLEM TO BE SOLVED: To provide a method of controllably reflecting electrons from an array of electron reflectors to make electron beam projection lithography possible at low cost because of maskless processing, and a device of a dynamic pattern generation machine for reflective electron beam lithography. SOLUTION: An input electron beam is formed from an electron source, and the input beam is introduced into the array of electron reflectors. A first plurality of reflective plates are configured to reflect electrons in a first reflective mode in which reflected electrons coming out of the reflective plates form a focusing beam. A second plurality of reflective plates are configured to reflect electrons in a second reflective mode in which reflective electrons coming out of the reflective plates are defocused. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种从电子反射器阵列可控地反射电子的方法,以便由于无掩模处理而以低成本实现电子束投影光刻,以及用于反射电子束的动态图案生成机的装置 光刻。 解决方案:由电子源形成输入电子束,并将输入光束引入电子反射器阵列。 第一多个反射板被配置成以第一反射模式反射电子,其中从反射板出来的反射电子形成聚焦光束。 第二多个反射板被配置为以第二反射模式反射电子,其中从反射板流出的反射电子散焦。 版权所有(C)2011,JPO&INPIT