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21. 发明授权

US06634936B2 Chemical mechanical planarization or polishing pad with sections having varied groove patterns 失效
公开(公告)号：US06634936B2
公开(公告)日：2003-10-21
申请号：US09870212
申请日：2001-05-30
申请人： Alan J. Jensen , Brian S. Thornton
发明人： Alan J. Jensen , Brian S. Thornton
IPC分类号： B24B2100
CPC分类号： B24B37/26 , B24B21/04 , B24D11/001 , B24D11/04
摘要： A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

22. 发明授权

US06609961B2 Chemical mechanical planarization belt assembly and method of assembly 失效
公开(公告)号：US06609961B2
公开(公告)日：2003-08-26
申请号：US09757452
申请日：2001-01-09
申请人： Michael S. Lacy , John M. Boyd
发明人： Michael S. Lacy , John M. Boyd
IPC分类号： B24B2100
CPC分类号： B24B37/04 , B24D11/02
摘要： A method of producing a chemical mechanical planarization (CMP) polishing belt structure is disclosed that includes forming a strip of substantially rigid material into a support belt having an interior surface and an exterior surface. At least a portion of the exterior surface of the support belt is altered to form a plurality of gripping members integral with the exterior surface of the support belt. An interior surface of a seamless CMP belt is applied to the exterior surface of the support belt such that the plurality of gripping members engage the interior surface of the seamless CMP belt in a non-slip grip.

23. 发明授权

US06527629B1 Grinding device for rounding off edges of an opening in a work piece 失效
标题翻译：用于使工件上的开口的边缘倒圆的研磨装置
公开(公告)号：US06527629B1
公开(公告)日：2003-03-04
申请号：US09647679
申请日：2000-10-12
申请人： Arne Sandvold
发明人： Arne Sandvold
IPC分类号： B24B2100
CPC分类号： B24B21/025 , B24B9/007 , B24B21/002
摘要： An apparatus for rounding off edges of openings in a work piece, such as internal openings or cut outs in steel plates. The apparatus includes a belt grinding machine having a continuous grinding belt running over several belt guiding rollers which are provided on a support frame. Two of the rollers are provided on a cradle, that is pivotally supported in the support frame. The grinding belt is, between the rollers on the cradle, disposed for rectilinear working of the work piece, and a device is arranged for operating the cradle in a pendulum like movement about the pivotal support during a grinding operation.
摘要翻译：用于使工件上的开口的边缘倒圆的装置，例如钢板中的内部开口或切口。该设备包括一带式研磨机，该研磨机具有连续研磨带，该连续研磨带设置在支撑框架上的多个带引导辊上。两个辊子设置在支架上，枢轴支撑在支架上。研磨带在支架上的辊之间设置用于工件的直线加工，并且设置有用于在研磨操作期间围绕枢转支撑件摆动地摆动地摆动摇架。

24. 发明授权

US06468140B1 Swinging device for a sanding machine 失效
标题翻译：砂光机摆动装置
公开(公告)号：US06468140B1
公开(公告)日：2002-10-22
申请号：US09637196
申请日：2000-08-14
申请人： Chun-Hsiang Wang
发明人： Chun-Hsiang Wang
IPC分类号： B24B2100
CPC分类号： B24B21/22
摘要： A swinging device for a sanding device, is disclosed. The swinging device has a swinging element, having mounted with a bi-axle motor, mounted to a sanding module, and the bi-axle motor synchronously drives a driving structure mounted to the swinging element, and the driving structure is provided with a shaft rod having an eccentric post, and the eccentric post is mounted to a limiting rod of the sanding module for limiting purpose, thus, when the bi-axle motor is initiated, the shaft rod is synchronously driven, and the eccentric post is used for limiting purpose. The entire swinging device causes the sanding module to produce a reciprocating swinging, and the sanding belt produces a tangential sanding effect.
摘要翻译：公开了一种用于砂磨装置的摆动装置。摆动装置具有摆动元件，其安装有安装在砂光模块上的双轴马达，并且双轴马达同步地驱动安装在摆动元件上的驱动结构，并且驱动结构设置有轴杆具有偏心柱，并且偏心柱安装到砂光模块的限位杆用于限制目的，因此，当双轴马达启动时，轴杆被同步驱动，偏心柱用于限制目的。整个摆动装置使打磨模块产生往复摆动，并且砂带产生切向砂光效果。

25. 发明授权

US06368197B2 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates 有权
标题翻译：用于支撑和清洁用于微电子衬底的化学机械平面化的抛光垫的方法和装置
公开(公告)号：US06368197B2
公开(公告)日：2002-04-09
申请号：US09850902
申请日：2001-05-07
申请人： Jason B. Elledge
发明人： Jason B. Elledge
IPC分类号： B24B2100
CPC分类号： B24B53/017 , B08B1/007 , B08B1/02 , B08B3/022 , B08B3/041 , B08B3/123 , B24B21/04
摘要： A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.
摘要翻译：一种用于支撑，清洁和/或干燥用于平面化微电子衬底的抛光垫的方法和装置。在一个实施例中，该装置可以包括邻近抛光垫的后操作部分定位的清洁头，以清洁和/或干燥抛光垫的后表面。清洁头可以包括将流体和/或气体引向后表面的热源，机械接触元件和/或孔。该装置还可以包括一个容器，抛光垫的后表面通过该容器通过以清洁后表面。该装置还可以包括与抛光垫和支撑垫之间的区域流体连通的流动通道，抛光垫在平坦化期间搁置在支撑垫上。气体通过流动通道朝向或远离抛光垫和支撑垫之间的界面区域移动，以将抛光垫朝向或远离支撑垫拉动。

26. 发明授权

US06361421B1 Belt grinder with pivotable grinding unit and opposite supporting tables at different working heights 失效
标题翻译：带式研磨机带有可旋转研磨装置和不同工作高度的相对支撑台
公开(公告)号：US06361421B1
公开(公告)日：2002-03-26
申请号：US08952947
申请日：1997-11-17
申请人： Stephan Kündig
发明人： Stephan Kündig
IPC分类号： B24B2100
CPC分类号： B24B41/068 , B24B21/00 , B24B27/0084
摘要： The invention relates to a belt grinder of which the supporting tables (13, 14) are arranged in relation to the grinding unit (11) and hence the grinding belt (12) in such a way that tables need not be adjusted at the same time as the grinding unit is pivoted, while nevertheless the gap (z) between the grinding unit and the edges of the tables remains minimal. Such an arrangement is obtained if the value one minus the cosine of half the maximum pivoting angle (y) multiplied by the direct distance (d) between the tables edges is divided by two and the cosine of half the maximum pivoting angle (y) and gives a result acceptable for practical use and compliance with the standards and safety specifications for the gap (z) between the table edges and the grinding unit.
摘要翻译：本发明涉及一种带式研磨机，其中支撑台（13,14）相对于研磨单元（11）布置，因此与研磨带（12）以不需要同时调整的方式相配合当磨削单元枢转时，磨削单元和工作台边缘之间的间隙（z）仍然很小。如果将值1减去最大枢转角（y）的一半的余弦乘以表边缘之间的直接距离（d）的值1除以2，并且最大枢转角（y）的一半的余弦值，给出了实际使用可接受的结果，并且符合表边缘和研磨单元之间的间隙（z）的标准和安全规范。

27. 发明授权

US06244944B1 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates 有权
标题翻译：用于支撑和清洁用于微电子衬底的化学机械平面化的抛光垫的方法和装置
公开(公告)号：US06244944B1
公开(公告)日：2001-06-12
申请号：US09387190
申请日：1999-08-31
申请人： Jason B. Elledge
发明人： Jason B. Elledge
IPC分类号： B24B2100
CPC分类号： B24B53/017 , B08B1/007 , B08B1/02 , B08B3/022 , B08B3/041 , B08B3/123 , B24B21/04
摘要： A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.
摘要翻译：一种用于支撑，清洁和/或干燥用于平面化微电子衬底的抛光垫的方法和装置。在一个实施例中，该装置可以包括邻近抛光垫的后操作部分定位的清洁头，以清洁和/或干燥抛光垫的后表面。清洁头可以包括将流体和/或气体引向后表面的热源，机械接触元件和/或孔。该装置还可以包括一个容器，抛光垫的后表面通过该容器通过以清洁后表面。该装置还可以包括与抛光垫和支撑垫之间的区域流体连通的流动通道，抛光垫在平坦化期间搁置在支撑垫上。气体通过流动通道朝向或远离抛光垫和支撑垫之间的界面区域移动，以将抛光垫朝向或远离支撑垫拉动。

28. 发明授权

US06217427B1 Mobius strip belt for linear CMP tools 有权
标题翻译：用于线性CMP工具的Mobius剥离带
公开(公告)号：US06217427B1
公开(公告)日：2001-04-17
申请号：US09286430
申请日：1999-04-06
申请人： Christopher J. Case , Carlye B. Case
发明人： Christopher J. Case , Carlye B. Case
IPC分类号： B24B2100
CPC分类号： B24B37/04 , B24B21/04 , B24B49/04
摘要： A tool for the linear polishing of substrates includes an endless belt of continuous strength wrapped substantially as a helix of predetermined length and width with a 180 degree twist along the length to increase by a factor of 2× the time interval between which belt changes need to be made because of wear-and-tear, significantly reducing the costs associated with the polishing because of reduced down time. In a preferred embodiment for the chemical-mechanical polishing of silicon wafer substrates used in fabricating integrated circuits, the endless belt is constructed as a Mobius strip of a rubberized, urethane composition to be flexible, but yet strong enough to withstand the applied pressure between the polishing belt and the substrate.
摘要翻译：用于基材的线性抛光的工具包括连续强度的环形带，其基本上以预定长度和宽度的螺旋缠绕，沿着长度以180度扭转，以增加皮带变化所需的时间间隔的2倍由于磨损而造成的，由于减少了停机时间，显着降低了与抛光相关的成本。在用于制造集成电路的硅晶片衬底的化学机械抛光的优选实施例中，环形带被构造为橡胶化的聚氨酯组合物的莫比乌斯带，其是柔性的，但是足够坚固以承受施加的压力抛光带和基板。

29. 发明授权

US06171177B2 Apparatus and method for midspan access of encapsulated optical fibers 有权
标题翻译：封装光纤中跨接口的装置和方法
公开(公告)号：US06171177B2
公开(公告)日：2001-01-09
申请号：US09350034
申请日：1999-07-08
申请人： Jonathan G. Fitz
发明人： Jonathan G. Fitz
IPC分类号： B24B2100
CPC分类号： G02B6/4498 , G02B6/4403 , G02B6/4404
摘要： Midspan access to selected optical fibers which are encapsulated in an optical ribbon or tube is achieved by placing the desired span of the encapsulated fibers to be accessed between opposing abrasive layers and controllably urging at least one of the abrasive layers in the direction of the opposing abrasive layer to cause both abrasive layers to contact the encapsulant which covers the fibers. The amount of force applied to the at least one abrasive layer is limited by the structure of a resilient element which is coupled to the abrasive surface. Stress concentrators are created in the encapsulant and the encapsulant is removed from the span portion by relative movement of the encapsulated fibers and the abrasive layers. A minimum separation distance between the opposing abrasive layers can be defined, according to the thickness of the specific encapsulated fiber medium undergoing fiber separation, to avoid contact between the abrasive surfaces and the fibers within the medium. Access to the individual fibers is provided after the stress concentrators are formed in the encapsulant or encapsulant in the desired span portion has been substantially removed.
摘要翻译：封装在光学带或管中的所选择的光纤的中跨通道是通过将待访问的被包封的纤维的期望跨度放置在相对的研磨层之间并且可控地推动至少一个研磨层沿着相对磨料的方向层，以使两个磨料层接触覆盖纤维的密封剂。施加到至少一个研磨层的力的量受耦合到研磨表面的弹性元件的结构的限制。在密封剂中产生应力集中器，并且通过包封的纤维和研磨层的相对运动将密封剂从跨度部分移除。根据经历纤维分离的特定包封的纤维介质的厚度，可以限定相对的研磨层之间的最小间隔距离，以避免研磨表面和介质内的纤维之间的接触。在应力集中器形成在密封剂中之后提供对各个纤维的访问，或者已经基本上除去了期望跨度部分中的密封剂。

30. 发明授权

US06752898B1 Method and apparatus for an air bearing platen with raised topography 失效
标题翻译：具有凸起形状的空气轴承压板的方法和装置
公开(公告)号：US06752898B1
公开(公告)日：2004-06-22
申请号：US10327565
申请日：2002-12-20
申请人： Robert L. Anderson, II , Robert Charatan , Travis Robert Taylor
发明人： Robert L. Anderson, II , Robert Charatan , Travis Robert Taylor
IPC分类号： B24B2100
CPC分类号： B24B21/10 , B24B37/04
摘要： An invention is provided for a CMP apparatus that enhances removal rate uniformity. The CMP apparatus includes a polishing belt disposed below a carrier head that is capable of applying a wafer to the polishing belt. Also included is a platen disposed below the polishing belt. The platen includes a circular shim section disposed on the top surface of the platen. The circular shim section is higher than the top surface of the platen. When using this configuration, increasing pressure to the backside of the polishing belt decreases the edge removal rate of the wafer. Conversely, decreasing pressure to the backside of the polishing belt increases the edge removal rate of the wafer.
摘要翻译：提供了一种用于增强去除速率均匀性的CMP设备的发明。 CMP装置包括设置在能够将晶片施加到抛光带的载体头下方的抛光带。还包括设置在抛光带下方的压板。压盘包括设置在压板的顶表面上的圆形垫片部分。圆形垫片部分高于压板的顶部表面。当使用这种配置时，增加对抛光带背面的压力降低了晶片的边缘去除速率。相反，降低抛光带背面的压力增加了晶片的边缘去除率。

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