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    • 22. 发明申请
    • Method, apparatus and computer system for air mover configuration
    • 风机配置方法,装置和计算机系统
    • US20080049394A1
    • 2008-02-28
    • US11509110
    • 2006-08-23
    • Yoshifumi Nishi
    • Yoshifumi Nishi
    • G05D23/00H05K7/20
    • G05D23/19G06F1/20
    • Some embodiments of a method, apparatus and computer system are described for configuring one or more air movers. A computer system may include a housing and an air mover coupled to an electronic device and positioned in relative proximity to an electronic component. In some embodiments, the air mover has an intake region, and is configured such that the intake region may include a first bisection larger than a second bisection. In some embodiments, a configuration module may be coupled to the air mover, such that the configuration module may alter the configuration of the air mover such that the intake region is altered. Other embodiments are described.
    • 描述了一种方法,装置和计算机系统的一些实施例,用于配置一个或多个鼓风机。 计算机系统可以包括壳体和联接到电子设备并且相对靠近电子部件定位的空气推动器。 在一些实施例中,空气移动器具有进气区域,并且被构造成使得进气区域可以包括大于第二平分度的第一二分线。 在一些实施例中,配置模块可以联接到空气推动器,使得配置模块可以改变空气推动器的构造,使得进气区域被改变。 描述其他实施例。
    • 28. 发明申请
    • APPARATUS AND SYSTEM FOR IMPROVED THERMAL RADIATION FOR A MOBILE COMPUTING DEVICE AND CASE
    • 用于移动计算设备和案例的改进的热辐射的装置和系统
    • US20120155020A1
    • 2012-06-21
    • US12970859
    • 2010-12-16
    • Yoshifumi Nishi
    • Yoshifumi Nishi
    • H05K7/00
    • G06F1/203
    • Embodiments of an apparatus and system are described for a thermally radiating mobile computing device and case. An apparatus may comprise, for example, a thermally radiating case for a mobile computing device having a first portion arranged to receive the mobile computing device, a thermally conductive coupling arranged to removably couple the case to one or more internal heat generating components of the mobile computing device, and a second portion thermally coupled to the first portion and the thermally conductive coupling, the second portion comprising one or more thermally conductive materials arranged to radiate thermal energy away from the one or more heat generating components. Other embodiments are described and claimed.
    • 对于热辐射移动计算设备和情况描述了设备和系统的实施例。 设备可以包括例如用于移动计算设备的散热壳体,其具有布置成接收移动计算设备的第一部分,布置成将壳体可移除地耦合到移动设备的一个或多个内部发热部件的导热联接器 计算装置,以及热耦合到第一部分和导热联接件的第二部分,第二部分包括一个或多个导热材料,其布置成将热能辐射离开一个或多个发热部件。 描述和要求保护其他实施例。
    • 29. 发明授权
    • Semiconductor device and fabrication method of same
    • 半导体器件及其制造方法
    • US07642604B2
    • 2010-01-05
    • US12036703
    • 2008-02-25
    • Yoshifumi NishiTakashi YamauchiYoshinori TsuchiyaJunji Koga
    • Yoshifumi NishiTakashi YamauchiYoshinori TsuchiyaJunji Koga
    • H01L23/48
    • H01L29/47H01L21/28518H01L21/76814H01L21/823814H01L21/823835H01L29/475
    • A semiconductor device having an electrode with reduced electrical contact resistance even where either electrons or holes are majority carriers is disclosed. This device has an n-type diffusion layer and a p-type diffusion layer in a top surface of a semiconductor substrate. The device also has first and second metal wires patterned to overlie the n-type and p-type diffusion layers, respectively, with a dielectric layer interposed therebetween, a first contact electrode for electrical connection between the n-type diffusion layer and the first metal wire, and a second contact electrode for connection between the p-type diffusion layer and the second metal wire. The first contact electrode's portion in contact with the n-type diffusion layer and the second contact electrode's portion contacted with the p-type diffusion layer are each formed of a first conductor that contains a metal and a second conductor containing a rare earth metal.
    • 公开了一种半导体器件,其具有即使电子或空穴为多数载流子的具有降低的电接触电阻的电极。 该器件在半导体衬底的顶表面中具有n型扩散层和p型扩散层。 该装置还具有图案化的第一和第二金属线分别覆盖在n型和p型扩散层之间,介于其间的介电层,用于在n型扩散层和第一金属之间电连接的第一接触电极 电线和用于在p型扩散层和第二金属线之间连接的第二接触电极。 与n型扩散层接触的第一接触电极部分和与p型扩散层接触的第二接触电极部分分别由包含金属的第一导体和含有稀土金属的第二导体形成。