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    • 2. 发明授权
    • Semiconductor device and fabrication method of same
    • 半导体器件及其制造方法
    • US07642604B2
    • 2010-01-05
    • US12036703
    • 2008-02-25
    • Yoshifumi NishiTakashi YamauchiYoshinori TsuchiyaJunji Koga
    • Yoshifumi NishiTakashi YamauchiYoshinori TsuchiyaJunji Koga
    • H01L23/48
    • H01L29/47H01L21/28518H01L21/76814H01L21/823814H01L21/823835H01L29/475
    • A semiconductor device having an electrode with reduced electrical contact resistance even where either electrons or holes are majority carriers is disclosed. This device has an n-type diffusion layer and a p-type diffusion layer in a top surface of a semiconductor substrate. The device also has first and second metal wires patterned to overlie the n-type and p-type diffusion layers, respectively, with a dielectric layer interposed therebetween, a first contact electrode for electrical connection between the n-type diffusion layer and the first metal wire, and a second contact electrode for connection between the p-type diffusion layer and the second metal wire. The first contact electrode's portion in contact with the n-type diffusion layer and the second contact electrode's portion contacted with the p-type diffusion layer are each formed of a first conductor that contains a metal and a second conductor containing a rare earth metal.
    • 公开了一种半导体器件,其具有即使电子或空穴为多数载流子的具有降低的电接触电阻的电极。 该器件在半导体衬底的顶表面中具有n型扩散层和p型扩散层。 该装置还具有图案化的第一和第二金属线分别覆盖在n型和p型扩散层之间,介于其间的介电层,用于在n型扩散层和第一金属之间电连接的第一接触电极 电线和用于在p型扩散层和第二金属线之间连接的第二接触电极。 与n型扩散层接触的第一接触电极部分和与p型扩散层接触的第二接触电极部分分别由包含金属的第一导体和含有稀土金属的第二导体形成。