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    • 26. 发明授权
    • Method for forming binary intensity masks
    • 形成二进制强度掩模的方法
    • US06379849B1
    • 2002-04-30
    • US09696081
    • 2000-10-26
    • Shy-Jay LinWen-Chuan Wang
    • Shy-Jay LinWen-Chuan Wang
    • G03F900
    • G03F1/78G03F1/80G03F7/0035
    • A method for forming a binary intensity mask (BIM) using two writing steps. The first writing step has a narrow writing area, preferably about 1 micron, and outlines the desired pattern. The second writing area partially overlaps the first writing area, preferably by less than half of the E-beam diameter used for writing. The second writing does not overlap the desired pattern. The chromium layer of the BIM is dry etched after the first writing, providing good edge definition and dimensional stability. The chromium layer of the BIM is wet etched following the second writing reducing mask defects.
    • 一种使用两个写入步骤形成二进制强度掩模(BIM)的方法。 第一写入步骤具有窄的写入区域,优选约1微米,并且概述所需的图案。 第二写入区域部分地与第一写入区域重叠,优选地小于用于写入的电子束直径的一半。 第二次写入不会与所需的图案重叠。 BIM的铬层在第一次写入之后被干蚀刻,提供良好的边缘清晰度和尺寸稳定性。 在第二次写入减少掩模缺陷之后,BIM的铬层被湿蚀刻。
    • 28. 发明授权
    • Dark line CD and XY-CD improvement method of the variable shaped beam lithography in mask or wafer making
    • 可变形光束光刻在掩模或晶圆制造中的暗线CD和XY-CD改进方法
    • US06799312B1
    • 2004-09-28
    • US09584428
    • 2000-06-05
    • Fei-Gwo TsaiShy-Jay Lin
    • Fei-Gwo TsaiShy-Jay Lin
    • G06F1750
    • B82Y10/00B82Y40/00H01J37/3174H01J2237/31762H01J2237/31764
    • This invention provides a method of using an electron beam exposure system having an electron beam with a variable shape to form patterns in a layer of resist on a substrate, a mask substrate or an integrated circuit wafer, while maintaining adequate critical dimension control and beam stability. This is accomplished by setting the electron beam to a fixed square beam with a width set to provide optimum XY critical dimension control for exposing a frame pattern surrounding the original pattern. The frame pattern has a width of a first distance and surrounds the outer perimeter of the original pattern. This provides optimum XY critical dimension control at the outer perimeter of the original pattern. The remainder of the exposure field, which is the exposure field with the original pattern and the frame pattern subtracted away is exposed using an electron beam having a variable size and shape. In one embodiment the exposure of the frame pattern is completed before the exposure of the remainder pattern is carried out. Alternatively, the exposure of the remainder pattern can be completed before the exposure of the frame pattern is carried out. The digital design data for the frame pattern and the remainder of the exposure field is formed using a computer processor and the original design data.
    • 本发明提供一种使用具有可变形状的电子束的电子束曝光系统的方法,以在基板,掩模基板或集成电路晶片上的抗蚀剂层中形成图案,同时保持适当的临界尺寸控制和光束稳定性 。 这是通过将电子束设置为具有设置的宽度的固定方波来实现的,以提供用于曝光围绕原始图案的帧图案的最佳XY临界尺寸控制。 框架图案具有第一距离的宽度并且围绕原始图案的外周边。 这在原始图案的外围提供了最佳的XY临界尺寸控制。 使用具有可变尺寸和形状的电子束来曝光曝光场的剩余部分,其中原始图案和帧图案的曝光场被减去。 在一个实施例中,在执行余下图案的曝光之前完成帧图案的曝光。 或者,可以在执行帧图案的曝光之前完成余数图案的曝光。 使用计算机处理器和原始设计数据形成帧图案的数字设计数据和曝光场的其余部分。
    • 29. 发明授权
    • Apparatus and method for inspecting phase shifting masks
    • 用于检查相移掩模的装置和方法
    • US6018392A
    • 2000-01-25
    • US177340
    • 1998-10-23
    • San-De TzuShy-Jay Lin
    • San-De TzuShy-Jay Lin
    • G01N21/956G03F1/26G03F1/84G01B9/02
    • G03F1/84G01N21/95607G03F1/26
    • An apparatus for die to die inspection of masks having transparent phase shifting elements and a method of die to die inspection of masks having transparent phase shifting elements. Light from a light source is directed through a transparent mask substrate and a phase shifting mask element to a first objective lens, and through the transparent mask substrate and another phase shifting mask element to a second objective lens. Light from the first objective lens is then given a 180.degree. phase shift by a phase adjustment unit. Light from the phase adjustment unit and the second objective lens is combined at a split mirror and directed to a detector. The method makes use of the fact that the intensity of the light at the detector is proportional to the square of the cosine of one half of the phase angle between the light from the phase adjusting unit and light from the second objective lens. If the intensity of light reaching the detector is not zero, or very small, the mask has a defect.
    • 一种用于对具有透明相移元件的掩模进行裸片检查的设备,以及对具有透明移相元件的掩模进行裸片检查的方法。 来自光源的光通过透明掩模基板和相移掩模元件引导到第一物镜,并且通过透明掩模基板和另一相移掩模元件引导到第二物镜。 然后通过相位调整单元对来自第一物镜的光进行180°相移。 来自相位调整单元和第二物镜的光在分离镜处组合并被引导到检测器。 该方法利用了检测器的光强度与来自相位调整单元的光和来自第二物镜的光之间的相位角的一半的余弦平方成正比的事实。 如果到达检测器的光的强度不为零或非常小,则掩模具有缺陷。