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21. 发明授权

US07696539B2 Device fabrication by anisotropic wet etch 失效
标题翻译：通过各向异性湿法蚀刻的器件制造
公开(公告)号：US07696539B2
公开(公告)日：2010-04-13
申请号：US12141878
申请日：2008-06-18
申请人： Yujun Li , Kenneth T. Settlemyer, Jr. , Jochen Beintner
发明人： Yujun Li , Kenneth T. Settlemyer, Jr. , Jochen Beintner
IPC分类号： H01L29/80
CPC分类号： H01L21/84 , H01L21/30608 , H01L27/1203 , H01L29/045 , H01L29/66772 , H01L29/66818 , H01L29/785
摘要： A method of fabrication and a field effect device structure are presented that reduce source/drain capacitance and allow for device body contact. A Si based material pedestal is produced, the top surface and the sidewalls of which are oriented in a way to be substantially parallel with selected crystallographic planes of the pedestal and of a supporting member. The pedestal is wet etched with an anisotropic solution containing ammonium hydroxide. The sidewalls of the pedestal become faceted forming a segment in the pedestal with a reduced cross section. The dopant concentration in the reduced cross section segment is chosen to be sufficiently high for it to provide for electrical continuity through the pedestal.
摘要翻译：提出了一种制造方法和场效应器件结构，其减少源/漏电容并允许器件接触。产生基于Si的材料基座，其顶表面和其侧壁的方向定位成与基座和支撑构件的选定结晶平面基本平行。用包含氢氧化铵的各向异性溶液湿式蚀刻基座。基座的侧壁变小，在基座上形成截面减小的部分。选择减小的横截面段中的掺杂剂浓度足够高以使其提供穿过基座的电连续性。

22. 发明授权

US07470570B2 Process for fabrication of FinFETs 有权
标题翻译： FinFET的制造工艺
公开(公告)号：US07470570B2
公开(公告)日：2008-12-30
申请号：US11559460
申请日：2006-11-14
申请人： Jochen Beintner , Gary B. Bronner , Ramachandra Divakaruni , Yujun Li
发明人： Jochen Beintner , Gary B. Bronner , Ramachandra Divakaruni , Yujun Li
IPC分类号： H01L21/00
CPC分类号： H01L29/7851 , H01L29/66795
摘要： A method of fabricating a plurality of FinFETs on a semiconductor substrate in which the gate width of each individual FinFET is defined utilizing only a single etching process, instead of two or more, is provided. The inventive method results in improved gate width control and less variation of the gate width of each individual gate across the entire surface of the substrate. The inventive method achieves the above by utilizing a modified sidewall image transfer (SIT) process in which an insulating spacer that is later replaced by a gate conductor is employed and a high-density bottom up oxide fill is used to isolate the gate from the substrate.
摘要翻译：提供了在半导体衬底上制造多个FinFET的方法，其中仅使用单个蚀刻工艺限定每个单个FinFET的栅极宽度，而不是两个或更多个。本发明的方法导致改善的栅极宽度控制和在基板的整个表面上每个单独栅极的栅极宽度的变化较小。本发明的方法通过利用改进的侧壁图像转印（SIT）工艺实现上述，其中采用稍后被栅极导体替代的绝缘间隔物，并且使用高密度底部向上氧化物填充物将栅极与衬底隔离。

23. 发明申请

US20080111184A1 PROCESS FOR FABRICATION OF FINFETs 有权
标题翻译： FINFET制造工艺
公开(公告)号：US20080111184A1
公开(公告)日：2008-05-15
申请号：US11559460
申请日：2006-11-14
申请人： Jochen Beintner , Gary B. Bronner , Ramachandra Divakaruni , Yujun Li
发明人： Jochen Beintner , Gary B. Bronner , Ramachandra Divakaruni , Yujun Li
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/7851 , H01L29/66795
摘要： A method of fabricating a plurality of FinFETs on a semiconductor substrate in which the gate width of each individual FinFET is defined utilizing only a single etching process, instead of two or more, is provided. The inventive method results in improved gate width control and less variation of the gate width of each individual gate across the entire surface of the substrate. The inventive method achieves the above by utilizing a modified sidewall image transfer (SIT) process in which an insulating spacer that is later replaced by a gate conductor is employed and a high-density bottom up oxide fill is used to isolate the gate from the substrate.
摘要翻译：提供了在半导体衬底上制造多个FinFET的方法，其中仅使用单个蚀刻工艺限定每个单个FinFET的栅极宽度，而不是两个或更多个。本发明的方法导致改善的栅极宽度控制和在基板的整个表面上每个单独栅极的栅极宽度的变化较小。本发明的方法通过利用改进的侧壁图像转印（SIT）工艺实现上述，其中采用稍后被栅极导体替代的绝缘间隔物，并且使用高密度底部向上氧化物填充物将栅极与衬底隔离。

24. 发明授权

US07157329B2 Trench capacitor with buried strap 有权
标题翻译：带埋地带的沟槽电容器
公开(公告)号：US07157329B2
公开(公告)日：2007-01-02
申请号：US11053508
申请日：2005-02-08
申请人： Helmut Tews , Jochen Beintner , Stephan Kudelka
发明人： Helmut Tews , Jochen Beintner , Stephan Kudelka
IPC分类号： H01L21/8234
CPC分类号： H01L27/10867 , H01L27/10864
摘要： A trench capacitor with improved strap is disclosed. The strap is located above the top surface of the capacitor. The top surface of the trench capacitor, which is formed by the top surfaces of the collar and storage plate, is planar. By locating the strap on a planar surface, the divot present in conventional strap processes is avoided. This results in improved strap reliability and device performance.
摘要翻译：公开了一种具有改进带的沟槽电容器。带子位于电容器顶表面之上。沟槽电容器的由表圈和存储板的顶表面形成的顶表面是平面的。通过将带固定在平坦的表面上，避免了传统带状过程中存在的裂纹。这样可以提高表带的可靠性和设备性能。

25. 发明授权

US06998666B2 Nitrided STI liner oxide for reduced corner device impact on vertical device performance 有权
标题翻译：氮化氮化物衬垫氧化物，用于减少拐角装置对垂直装置性能的影响
公开(公告)号：US06998666B2
公开(公告)日：2006-02-14
申请号：US10707754
申请日：2004-01-09
申请人： Jochen Beintner , Rama Divakaruni , Rajarao Jammy
发明人： Jochen Beintner , Rama Divakaruni , Rajarao Jammy
IPC分类号： H01L21/8242
CPC分类号： H01L27/10864 , H01L27/10841 , H01L27/10894
摘要： A method of fabricating an integrated circuit device comprises etching a trench in a substrate and forming a dynamic random access memory (DRAM) cell having a storage capacitor at a lower end and an overlying vertical metal oxide semiconductor field effect transistor (MOSFET) comprising a gate conductor and a boron-doped channel. The method includes forming trenches adjacent the DRAM cell and a silicon-oxy-nitride isolation liner on either side of the DRAM cell, adjacent the gate conductor. Isolation regions are then formed in the trenches on either side of the DRAM cell. Thereafter, the DRAM cell, including the boron-containing channel region adjacent the gate conductor, is subjected to elevated temperatures by thermal processing, for example, forming a support device on the substrate adjacent the isolation regions. The nitride-containing isolation liner reduces segregation of the boron in the channel region, as compared to an essentially nitrogen-free oxide-containing isolation liner.
摘要翻译：一种制造集成电路器件的方法包括蚀刻衬底中的沟槽并形成具有位于下端的存储电容器的动态随机存取存储器（DRAM）单元和覆盖的垂直金属氧化物半导体场效应晶体管（MOSFET），其包括栅极导体和掺硼通道。该方法包括在DRAM单元附近形成沟槽和在DRAM单元的任一侧上与栅极导体相邻的硅 - 氮氧化物隔离衬垫。然后在DRAM单元的两侧的沟槽中形成隔离区。此后，包括与栅极导体相邻的含硼沟道区域的DRAM单元通过热处理受到升高的温度，例如，在邻近隔离区域的衬底上形成支撑器件。与基本上不含氮氧化物的隔离衬垫相比，含氮化物的隔离衬垫减少了沟道区域中的硼的偏析。

26. 发明授权

US06946345B2 Self-aligned buried strap process using doped HDP oxide 失效
标题翻译：使用掺杂HDP氧化物的自对准掩埋工艺
公开(公告)号：US06946345B2
公开(公告)日：2005-09-20
申请号：US10688612
申请日：2003-10-17
申请人： Jochen Beintner , Wolfgang Bergner , Richard A. Conti , Andreas Knorr , Rolf Weis
发明人： Jochen Beintner , Wolfgang Bergner , Richard A. Conti , Andreas Knorr , Rolf Weis
IPC分类号： H01L21/8242 , H01L29/94 , H01L21/20
CPC分类号： H01L27/10867 , H01L27/10864 , H01L29/945
摘要： The invention provides a trench storage structure that includes a substrate having a trench, a capacitor conductor in the lower part of the trench, a conductive node strap in the trench adjacent the capacitor conductor, a trench top oxide above the capacitor conductor, and a conductive buried strap in the substrate adjacent the trench top oxide. The trench top oxide includes a doped trench top oxide layer above the conductive strap, and an undoped trench top oxide layer above the doped trench top oxide layer.
摘要翻译：本发明提供了一种沟槽存储结构，其包括具有沟槽的衬底，沟槽下部的电容器导体，与电容器导体相邻的沟槽中的导电节点带，电容器导体上方的沟槽顶部氧化物，以及导电埋在衬底中的邻近沟槽顶部氧化物的衬底。沟槽顶部氧化物包括导电带上方的掺杂沟槽顶部氧化物层和掺杂沟槽顶部氧化物层上方的未掺杂沟槽顶部氧化物层。

27. 发明申请

US20050158961A1 Trench capacitor with buried strap 有权
标题翻译：带埋地带的沟槽电容器
公开(公告)号：US20050158961A1
公开(公告)日：2005-07-21
申请号：US11053508
申请日：2005-02-08
申请人： Helmut Tews , Jochen Beintner , Stephan Kudelka
发明人： Helmut Tews , Jochen Beintner , Stephan Kudelka
IPC分类号： H01L21/20 , H01L21/8242 , H01L27/108 , H01L33/00
CPC分类号： H01L27/10867 , H01L27/10864
摘要： A trench capacitor with improved strap is disclosed. The strap is located above the top surface of the capacitor. The top surface of the trench capacitor, which is formed by the top surfaces of the collar and storage plate, is planar. By locating the strap on a planar surface, the divot present in conventional strap processes is avoided. This results in improved strap reliability and device performance.
摘要翻译：公开了一种具有改进带的沟槽电容器。带子位于电容器顶表面之上。沟槽电容器的由表圈和存储板的顶表面形成的顶表面是平面的。通过将带固定在平坦的表面上，避免了传统带状过程中存在的裂纹。这样可以提高表带的可靠性和设备性能。

28. 发明授权

US06905976B2 Structure and method of forming a notched gate field effect transistor 失效
标题翻译：形成陷波栅场效应晶体管的结构和方法
公开(公告)号：US06905976B2
公开(公告)日：2005-06-14
申请号：US10249771
申请日：2003-05-06
申请人： Jochen Beintner , Yujun Li , Naim Moumen , Porshia Shane Wrschka
发明人： Jochen Beintner , Yujun Li , Naim Moumen , Porshia Shane Wrschka
IPC分类号： H01L29/423 , H01L21/265 , H01L21/28 , H01L21/336 , H01L29/49 , H01L29/78 , H01L29/786 , H01L21/302
CPC分类号： H01L29/6659 , H01L21/26586 , H01L21/28044 , H01L21/28114 , H01L29/42376 , H01L29/49 , H01L29/665 , Y10S438/933
摘要： The structure and method of forming a notched gate MOSFET disclosed herein addresses such problems as device reliability. A gate dielectric (e.g. gate oxide) is formed on the surface of an active area on the semiconductor substrate, preferably defined by an isolation trench region. A layer of polysilicon is then deposited on the gate dielectric. This step is followed by depositing a layer of silicon germanium) (SiGe). The sidewalls of the polysilicon layer are then laterally etched, selective to the SiGe layer to create a notched gate conductor structure, with the SiGe layer being broader than the underlying polysilicon layer. Sidewall spacers are preferably formed on sidewalls of the SiGe layer and the polysilicon layer. A silicide layer is preferably formed as a self-aligned silicide from a polysilicon layer deposited over the SiGe layer, to reduce resistance of the gate conductor. One or more other processing steps (e.g. source and drain implants, extension implants, and pocket lightly doped drain (LDD) implants), gate conductor stack doping, and silicidation are preferably performed in completing the transistor.
摘要翻译：本文公开的形成缺口栅极MOSFET的结构和方法解决了诸如器件可靠性的问题。栅电介质（例如栅极氧化物）形成在半导体衬底上的有源区的表面上，优选由隔离沟槽区限定。然后在栅极电介质上沉积多晶硅层。该步骤之后是沉积一层硅锗）（SiGe）。然后横向蚀刻多晶硅层的侧壁，对SiGe层有选择性，以产生刻蚀的栅极导体结构，其中SiGe层比下面的多晶硅层宽。侧壁间隔物优选形成在SiGe层和多晶硅层的侧壁上。硅化物层优选从沉积在SiGe层上的多晶硅层形成为自对准硅化物，以降低栅极导体的电阻。优选在完成晶体管时执行一个或多个其它处理步骤（例如源极和漏极注入，延伸注入和袖带轻掺杂漏极（LDD）注入），栅极导体堆叠掺杂和硅化。

29. 发明申请

US20050110085A1 Dual gate finfet 有权
标题翻译：双门finfet
公开(公告)号：US20050110085A1
公开(公告)日：2005-05-26
申请号：US10717737
申请日：2003-11-20
申请人： Huilong Zhu , Jochen Beintner , Bruce Doris , Ying Zhang
发明人： Huilong Zhu , Jochen Beintner , Bruce Doris , Ying Zhang
IPC分类号： H01L21/336 , H01L21/84 , H01L27/01 , H01L27/12 , H01L29/78 , H01L29/786
CPC分类号： H01L29/785 , H01L29/66795 , H01L29/7856
摘要： A field effect transistor (FET), integrated circuit (IC) chip including the FETs and a method of forming the FETS. Each FET includes a device gate along one side of a semiconductor (e.g., silicon) fin and a back bias gate along an opposite of the fin. Back bias gate dielectric differs from the device gate dielectric either in its material and/or thickness. Device thresholds can be adjusted by adjusting back bias gate voltage.
摘要翻译：包括FET的场效应晶体管（FET），集成电路（IC）芯片和形成FET的方法。每个FET包括沿半导体（例如，硅）翅片的一侧的器件栅极和沿鳍片相对的背偏置栅极。背偏置栅极电介质的不同之处在于器件栅极电介质的材料和/或厚度。可以通过调整背偏置栅极电压来调整器件阈值。

30. 发明授权

US06853025B2 Trench capacitor with buried strap 失效
标题翻译：带埋地带的沟槽电容器
公开(公告)号：US06853025B2
公开(公告)日：2005-02-08
申请号：US10248801
申请日：2003-02-20
申请人： Helmut Tews , Jochen Beintner , Stephan Kudelka
发明人： Helmut Tews , Jochen Beintner , Stephan Kudelka
IPC分类号： H01L21/20 , H01L21/8242 , H01L27/108 , H01L33/00
CPC分类号： H01L27/10867 , H01L27/10864
摘要： A trench capacitor with improved strap is disclosed. The strap is located above the top surface of the capacitor. The top surface of the trench capacitor which is formed by the top surfaces of the collar and storage plate, is planar. By locating the strap on a planar surface, the divot present in conventional strap processes is avoided. This results in improved strap reliability and device performance.
摘要翻译：公开了一种具有改进带的沟槽电容器。带子位于电容器顶表面之上。由套环和储存板的顶表面形成的沟槽电容器的顶表面是平面的。通过将带固定在平坦的表面上，避免了传统带状过程中存在的裂纹。这样可以提高表带的可靠性和设备性能。

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