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21. 发明专利

JP2009147146A Substrate-treating device and substrate treatment method 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：JP2009147146A
公开(公告)日：2009-07-02
申请号：JP2007323469
申请日：2007-12-14
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TOJIMA JIRO , KANEKO SATOSHI , AMANO YOSHIFUMI
IPC分类号： H01L21/304 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide a substrate-treating device and a substrate treatment method capable of unifying treatment to a substrate to be treated and suppressing readhesion of a treatment liquid to a wafer and the disturbance of an air current near the edge of a wafer.
SOLUTION: The substrate W to be treated supported by a support section 20 is rotated about an axis which extends substantially in a vertical direction as a center. Gas is injected downward toward the upper surface of the substrate W, to be treated on the support section 20 and is sucked upward from an upper region of the substrate W to be treated, thus pressing the substrate W to be treated on the support section 20 toward the support section 20. While the substrate W to be treated is being rotated and being pressed toward the support section 20, a treatment liquid, such as an etching liquid and a cleaning liquid, is supplied to the substrate W to be treated.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够对待处理的基板进行统一处理并抑制处理液对晶片的再粘合和边缘附近的气流的干扰的基板处理装置和基板处理方法的晶片。解决方案：由支撑部分20支撑的待处理的基板W围绕基本上沿垂直方向延伸的轴线为中心旋转。向衬底W的上表面向下方喷射气体，在支撑部20上进行处理，从被处理基板W的上部区域向上方吸引，将被处理基板W按压在支承部20上在待处理的基板W被旋转并被压向支撑部20的同时，将处理液（例如蚀刻液和清洗液）供给到待处理的基板W。版权所有（C）2009，JPO＆INPIT

22. 发明专利

JP2008147564A Steam generator, processing system, steam generation method, and recording medium 有权
标题翻译：蒸汽发生器，加工系统，蒸汽发生方法和记录介质
公开(公告)号：JP2008147564A
公开(公告)日：2008-06-26
申请号：JP2006335761
申请日：2006-12-13
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AMANO YOSHIFUMI , KANEKO SATOSHI
IPC分类号： H01L21/304 , B08B3/10 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To stabilize an amount of steam generated by a steam generator and prevent the rise of temperature of a cover for a tank case.
SOLUTION: The generator includes a storage space 61 which stores a liquid, a heater 62 which heats the liquid in the storage space 61, and a heat exchange portion 76 which raises the temperature of the liquid before the liquid is fed to the storage space 61 using the heat generated by a heater 62. The heat exchange portion 76 is disposed between a tank case 60 having the storage space 61 and the heater 61, and a cover 75 covering the outside of the tank case 60. The heat exchange passage is arranged in the heat exchange portion 76 surrounding the storage space 61 and the heater 62.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了稳定蒸汽发生器产生的蒸汽量并防止罐壳的盖的温度上升。解决方案：发电机包括储存液体的储存空间61，加热储存空间61中的液体的加热器62以及将液体供给至液体之前液体的温度升高的热交换部分76 存储空间61使用由加热器62产生的热量。热交换部分76设置在具有存储空间61的箱壳60和加热器61之间，以及覆盖箱壳60外部的盖75。通道设置在围绕储存空间61和加热器62的热交换部分76中。（C）2008，JPO＆INPIT

23. 发明专利

JP2008034490A Liquid processing device 有权
标题翻译：液体加工装置
公开(公告)号：JP2008034490A
公开(公告)日：2008-02-14
申请号：JP2006203981
申请日：2006-07-26
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： MATSUMOTO KAZUHISA , KANEKO SATOSHI , AKUMOTO MASAMI , TOSHIMA TAKAYUKI , ITO KIKO
IPC分类号： H01L21/304
CPC分类号： H01L21/67051 , H01L21/67017 , H01L21/6708 , H01L21/67173
摘要： PROBLEM TO BE SOLVED: To execute uniform processing among processing units while achieving further space-saving in a liquid processing device having a plurality of the processing units.
SOLUTION: The liquid processing device is provided with a unit chamber 21b in which a plurality of the liquid processing units 22 for executing liquid processing while supplying a processing liquid to a wafer W are horizontally arranged, a processing-liquid storage 21h which stores a processing liquid supplied to a plurality of the liquid processing units 22 in the unit chamber 21b, a piping box 21f which has a processing-liquid piping group 70 guiding the processing liquid from the processing-liquid storage 21h to each liquid processing unit 22, and a common casing 21 that houses the unit chamber 21b, the processing-liquid storage 21h, and the piping box 21f. The processing-liquid piping group 70 of the piping box 21f has horizontal piping 70a-70c horizontally arranged below the unit chamber 21b, so as to guide the processing liquid from the horizontal piping 70a-70c to each liquid processing unit 22. The processing-liquid storage 21h is provided below the piping box 21f.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：在具有多个处理单元的液体处理装置中进一步节省空间的同时，在处理单元之间执行均匀处理。解决方案：液体处理装置设置有单元室21b，其中多个用于在向晶片W供应处理液体的同时执行液体处理的液体处理单元22水平布置;处理液体存储器21h，其被存储供应到单元室21b中的多个液体处理单元22的处理液体，配管箱21f，其具有将处理液从处理液储存器21h引导到每个液体处理单元22的处理液管道组70 以及容纳单元室21b，处理液存储部21h和配管箱21f的公共壳体21。管道箱21f的处理液管道组70具有水平布置在单元室21b下方的水平管道70a-70c，以将处理液体从水平管道70a-70c引导到每个液体处理单元22。液体储存器21h设置在配管箱21f的下方。版权所有（C）2008，JPO＆INPIT

24. 发明专利

JP2007287999A Liquid processing device 有权
标题翻译：液体加工装置
公开(公告)号：JP2007287999A
公开(公告)日：2007-11-01
申请号：JP2006114961
申请日：2006-04-18
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KANEKO SATOSHI , MATSUMOTO KAZUHISA , ITO KIKO , AKUMOTO MASAMI , TOSHIMA TAKAYUKI , NANBA HIROMITSU
IPC分类号： H01L21/304 , G03F7/30 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a liquid processing device that can make a footprint small while effectively preventing a mist from re-adhering onto a substrate. SOLUTION: The liquid processing device has a wafer holder 1 that holds a wafer W horizontal and is rotatable together with the wafer W, a rotational cup 3 that surrounds the wafer W held by the wafer holder 1 and is rotatable together with the wafer W, a surface processing liquid supply nozzle 4 that supplies a process liquid onto the surface of the wafer W, and an exhaust/drainage section 6 that exhausts the air and drains the liquid of the rotational cup 3, wherein the rotational cup 3 has a vertical wall member 31 for receiving the process liquid shaken off from the wafer W and exhausting pores 33 and 34 for exhausting the process liquid formed on the vertical wall member 31, the exhaust/drainage section 6 has a drainage cup 41 outside the vertical wall member 31 for receiving and draining the process liquid exhausted from the exhausting pores 33 and 34, and a liquid film 37 is centrifugally formed of the process liquid on an inner surface of the vertical wall member 31 while the rotational cup 3 is being rotated. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以有效地防止薄膜重新附着在基底上的足够小的足迹的液体处理装置。解决方案：液体处理装置具有晶片保持器1，晶片保持器1水平地保持晶片W并且可与晶片W一起旋转，旋转杯3围绕由晶片保持器1保持的晶片W并且可旋转地与晶片W一起旋转晶片W，将处理液体供给到晶片W的表面上的表面处理液体供给喷嘴4和排出空气并排出旋转杯3的液体的排气/排出部6，其中旋转杯3具有垂直壁构件31，用于接收从晶片W摇动的处理液体，并排出用于排出形成在垂直壁构件31上的处理液体的孔33和34，排气/排出部分6在垂直壁外侧具有排水杯41 用于接收和排出从排气孔33和34排出的处理液的构件31和液膜37在垂直壁构件31的内表面上由处理液体离心地形成，而旋转杯3正在旋转。版权所有（C）2008，JPO＆INPIT

25. 发明专利

JP2012222253A Substrate cleaning device, substrate cleaning method, and computer-readable recording medium recording substrate cleaning program 有权
标题翻译：基板清洁装置，基板清洁方法和计算机可读记录介质基板清洁程序
公开(公告)号：JP2012222253A
公开(公告)日：2012-11-12
申请号：JP2011088664
申请日：2011-04-12
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KANEKO SATOSHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate cleaning device, a substrate cleaning method, and a substrate cleaning program, which enable good cleaning of a substrate without damaging the surface of the substrate.SOLUTION: A substrate cleaning device includes: liquid layer retention means (25) having a nozzle (40) for forming a liquid layer (52) of a cleaning solution; substrate heating means (24) for heating a surface of a substrate (2) to or above the boiling point of the cleaning solution; and an elevation mechanism (41a) for bringing the nozzle (40) close to the substrate (2), in which the elevation mechanism (41a) is controlled so that the liquid layer (52) formed on the nozzle (40) is heated with a surface heat of the substrate (2) heated by the substrate heating means (24) to form a vapor layer (60) between the liquid layer (52) and the surface of the substrate (2) and thereby cleaning the surface thereof.
摘要翻译：要解决的问题：提供一种能够良好地清洁基板而不损坏基板的表面的基板清洗装置，基板清洗方法和基板清洗程序。解决方案：一种基板清洁装置，包括：具有用于形成清洗液的液体层（52）的喷嘴（40）的液体层保持装置（25）用于将基板（2）的表面加热到或高于清洗溶液的沸点的基板加热装置（24）; 以及用于使喷嘴（40）靠近基板（2）的升降机构（41a），其中升高机构（41a）被控制，使得形成在喷嘴（40）上的液体层（52）被加热，由衬底加热装置（24）加热的衬底（2）的表面热，以在液体层（52）和衬底（2）的表面之间形成蒸汽层（60），从而清洁其表面。版权所有（C）2013，JPO＆INPIT

26. 发明专利

JP2012204521A Liquid processing device and liquid processing method 有权
标题翻译：液体加工装置和液体加工方法
公开(公告)号：JP2012204521A
公开(公告)日：2012-10-22
申请号：JP2011066464
申请日：2011-03-24
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KANEKO SATOSHI
IPC分类号： H01L21/304 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide a liquid processing device capable of arranging plural processing liquid supply parts on a rear side of a substrate, and a liquid processing method in the liquid processing device.SOLUTION: A liquid processing device comprises a substrate supporting member supporting a rear peripheral edge of a substrate and rotating the substrate; at least two processing parts for processing one face of the substrate supported by the substrate supporting member; a first rotation part arranged at a position corresponding to a center of the substrate supported by the substrate supporting part and rotating around a first rotation shaft; and a second rotation part arranged away from the first rotation part in a first direction and rotating around a second rotation shaft parallel to the first rotation shaft. At least the two processing parts are mounted to the first rotation part and the second rotation part, so that they can move in parallel to each other in the first direction and in a second direction orthogonal to the first direction by rotation of at least the first rotation part.
摘要翻译：要解决的问题：提供一种能够在基板的后侧设置多个处理液供给部的液体处理装置和液体处理装置中的液体处理方法。解决方案：液体处理装置包括支撑基板的后周缘并旋转基板的基板支撑构件; 至少两个处理部件，用于处理由所述基板支撑部件支撑的所述基板的一个面; 第一旋转部，其布置在与由所述基板支撑部支撑的所述基板的中心对应的位置，并且围绕第一旋转轴旋转; 以及第二旋转部，其在第一方向上离开所述第一旋转部并且围绕与所述第一旋转轴平行的第二旋转轴旋转。至少两个处理部件被安装到第一旋转部分和第二旋转部分，使得它们可以在第一方向和第二方向上彼此平行地移动，所述第二方向与第一方向正交，至少第一旋转部分旋转部分。版权所有（C）2013，JPO＆INPIT

27. 发明专利

JP2012195385A Liquid processing apparatus, liquid processing method, and storage medium storing program for executing the liquid processing method 有权
标题翻译：液体加工设备，液体加工方法和用于执行液体加工方法的储存中间储存程序
公开(公告)号：JP2012195385A
公开(公告)日：2012-10-11
申请号：JP2011057104
申请日：2011-03-15
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KANEKO SATOSHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a liquid processing apparatus and a liquid processing method that can uniformly process a substrate by supplying a plurality of processing liquids from rectangular nozzles.SOLUTION: A liquid processing apparatus includes: a substrate holding part; a rotation drive part; a first processing liquid supply part 81 formed in a rectangular form in a first direction and supplying a first processing liquid; a second processing liquid supply part 83 formed in a rectangular form in the first direction, formed in parallel to the first processing liquid supply part 81, and supplying a second processing liquid; a movement drive part 123 for moving the first processing liquid supply part 81 and the second processing liquid supply part 83 in a second direction; and a control part 200. For supplying the first processing liquid, the control part 200 causes the movement drive part 123 to move the first processing liquid supply part 81 so that the first processing liquid reaches the rotation center of the substrate. For supplying the second processing liquid, the control part 200 causes the movement drive part 123 to move the second processing liquid supply part 83 so that the second processing liquid reaches the rotation center of the substrate.
摘要翻译：解决的问题：提供一种能够通过从矩形喷嘴供给多种处理液体来均匀地处理基板的液体处理装置和液体处理方法。液体处理装置包括：基板保持部; 旋转驱动部; 第一处理液供给部81，其以第一方向成矩形形状，供给第一处理液; 形成为与第一处理液供给部81平行的第一方向为矩形的第二处理液供给部83，供给第二处理液; 移动驱动部123，用于使第一处理液供给部81和第二处理液供给部83向第二方向移动; 为了供给第一处理液，控制部200使移动驱动部123移动第一处理液供给部81，使第一处理液到达基板的旋转中心。为了供给第二处理液，控制部200使移动驱动部123移动第二处理液供给部83，使第二处理液到达基板的旋转中心。版权所有（C）2013，JPO＆INPIT

28. 发明专利

JP2012142420A Liquid processing device and liquid processing method 有权
标题翻译：液体加工装置和液体加工方法
公开(公告)号：JP2012142420A
公开(公告)日：2012-07-26
申请号：JP2010293815
申请日：2010-12-28
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TOJIMA JIRO , OGATA NOBUHIRO , KANEKO SATOSHI , NAGAMINE SHUICHI
IPC分类号： H01L21/304 , B05C11/08 , B05D1/40 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide a liquid processing device which can prevent the processing liquid from being left on a lift pin after drying a substrate, and can process the lower surface of the substrate efficiently.SOLUTION: The liquid processing device comprises a holding plate (30) which holds the circumference of a substrate (W), a lift pin plate (20) having a lift pin (22) for supporting the substrate from below, a rotation drive unit (39) which rotates the holding plate, a processing fluid supply tube (40) passing through the through holes of the holding plate and the lift pin plate, a nozzle (60) for discharging the processing liquid to the lower surface of the substrate, and a lifting mechanism (44, 46, 50, 52) for lifting the processing fluid supply tube, the nozzle, and the lift pin plate while interlocking. The nozzle has a plurality of discharge openings (61) arranged between a position facing the center of the substrate and a position facing the circumference of the substrate.
摘要翻译：要解决的问题：提供一种液体处理装置，其可以在干燥基板之后防止处理液体留在升降销上，并且可以有效地处理基板的下表面。解决方案：液体处理装置包括保持基板（W）的圆周的保持板（30），具有用于从下方支撑基板的提升销（22）的升降销板（20），旋转使所述保持板旋转的驱动单元（39），通过所述保持板和所述升降销板的通孔的加工液供给管（40），将所述处理液排出到所述保持板的下表面的喷嘴基板和提升机构（44,46,50,52），用于在互锁的同时提升处理流体供应管，喷嘴和提升销板。喷嘴具有布置在面向基板的中心的位置和面向基板的圆周的位置之间的多个排出口（61）。版权所有（C）2012，JPO＆INPIT

29. 发明专利

JP2012004407A Positioning device, substrate processing device and reference member fixation method 有权
标题翻译：定位装置，基板处理装置和参考零件固定方法
公开(公告)号：JP2012004407A
公开(公告)日：2012-01-05
申请号：JP2010139132
申请日：2010-06-18
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AMANO YOSHIFUMI , KANEKO SATOSHI
IPC分类号： H01L21/68
CPC分类号： B23Q3/15 , H01L21/6838 , H01L21/68714 , Y10T29/49998 , Y10T279/11 , Y10T279/23 , Y10T279/26
摘要： PROBLEM TO BE SOLVED: To provide a positioning device having a reference member accurately mounted at a reference position.SOLUTION: The positioning device includes: the reference member to be a criterion for positioning; a support portion for supporting the reference member; and a first fixed member provided on the support portion to fix the reference member with the support portion or to cancel the fixation. The reference member is connected to the support portion in a movable state, and fixed to the support portion by the first fixed member after being positioned.

30. 发明专利

JP2010021279A Liquid processing apparatus and liquid processing method 有权
标题翻译：液体加工设备和液体加工方法
公开(公告)号：JP2010021279A
公开(公告)日：2010-01-28
申请号：JP2008179298
申请日：2008-07-09
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KANEKO SATOSHI
IPC分类号： H01L21/306 , H01L21/027 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To process the surface of a peripheral portion of a workpiece by preventing a processing liquid supplied to the rear surface of the workpiece from wrapping around the front surface side of the workpiece because of the surface tension of the processing liquid in the peripheral portion of the workpiece.
SOLUTION: The liquid processing apparatus is provided with: a supporting portion 40 for supporting a workpiece W; a rotary driving portion 60 for rotating the supporting portion 40; a surface processing liquid supply mechanism 35 for supplying a processing liquid toward the peripheral portion of the surface of the workpiece W supported by the supporting portion 40; and a rear surface processing liquid supply mechanism 30 for supplying a processing liquid to the rear surface of the workpiece W supported by the supporting portion 41. A first guide member 21 is arranged outside the periphery of the workpiece W with a gap G
0 . The flow velocity of the processing liquid arriving at the peripheral portion through the rear surface of the workpiece W is higher than that of the processing liquid arriving at the peripheral portion through the surface of the workpiece W.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了处理工件的周边部分的表面，由于处理的表面张力，通过防止供应到工件的后表面的处理液体围绕工件的前表面侧包裹液体在工件的周边部分。解决方案：液体处理装置设有：用于支撑工件W的支撑部分40; 用于旋转支撑部分40的旋转驱动部分60; 表面处理液供给机构35，用于向由支撑部40支撑的工件W的表面的周边部供给处理液; 以及用于向由支撑部分41支撑的工件W的后表面提供处理液的后表面处理液体供给机构30.第一引导构件21设置在工件W的周围的间隙G 0 。通过工件W的后表面到达周边部分的处理液体的流速高于通过工件W的到达周边部分的处理液的流速。（C）2010 ，JPO＆INPIT

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