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21. 发明专利

JP2009222589A Pressure sensor and pressure measuring device with the same 有权
标题翻译：压力传感器和压力测量装置
公开(公告)号：JP2009222589A
公开(公告)日：2009-10-01
申请号：JP2008068138
申请日：2008-03-17
申请人： Nissan Motor Co Ltd , Tohoku Univ , 国立大学法人東北大学 , 日産自動車株式会社
发明人： HASHIMOTO SHUHEI , ESASHI MASAKI , TANAKA HIDEJI
IPC分类号： G01L9/00
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor for detecting gas pressure with no power supply while compensating the effect of temperature.
SOLUTION: The pressure sensor 10 includes a piezoelectric substrate 11, a comb tooth electrode section 12, a reflector 13 for pressure detection, a diaphragm section 14, and a reflector 15 for temperature compensation. The comb tooth electrode section receives a radio signal from the outside, excites surface acoustic wave on the piezoelectric substrate, receives the surface acoustic wave propagating on the piezoelectric substrate, and converts it into a response signal. The reflector for pressure detection reflects the surface acoustic wave excited by the comb tooth electrode section. The diaphragm section is disposed between the comb tooth electrode section and the reflector for pressure detection, and deforms according to the pressure difference between a cavity section inside the piezoelectric substrate and the outside to vary the path length of the propagation path of the surface acoustic wave. The reflector for temperature compensation is disposed on the side of the comb tooth electrode section on the propagation path of the surface acoustic wave with reference to the diaphragm section, and reflects the surface acoustic wave excited by the comb tooth electrode section.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种压力传感器，用于在补偿温度的影响的同时不用电源来检测气体压力。解决方案：压力传感器10包括压电基板11，梳齿电极部分12，用于压力检测的反射器13，隔膜部分14和用于温度补偿的反射器15。梳齿电极部从外部接收无线电信号，激发压电基板上的表面声波，接收在压电基板上传播的表面声波，并将其转换为响应信号。用于压力检测的反射器反映由梳齿电极部分激发的表面声波。隔膜部分设置在梳齿电极部分和用于压力检测的反射器之间，并且根据压电基板内部的空腔部分与外部之间的压力差而变形，以改变表面声波的传播路径的路径长度。用于温度补偿的反射器被设置在梳齿电极部分的相对于隔膜部分的声表面波的传播路径上的一侧，并且反射由梳齿电极部分激发的表面声波。版权所有（C）2010，JPO＆INPIT

22. 发明专利

JP2009023215A Dividing method of laminate 有权
标题翻译：分层方法
公开(公告)号：JP2009023215A
公开(公告)日：2009-02-05
申请号：JP2007188511
申请日：2007-07-19
申请人： Laser Gijutsu Sogo Kenkyusho , Panasonic Electric Works Co Ltd , Tohoku Univ , パナソニック電工株式会社 , 国立大学法人東北大学 , 財団法人レーザー技術総合研究所
发明人： YOSHIDA KAZUJI , KUBO MASAO , FUJITA MASAYUKI , TANAKA HIDEJI , ESASHI MASAKI
IPC分类号： B28D5/00 , B23K26/38 , B23K26/40 , B32B17/06 , C03B33/09
CPC分类号： B23K26/0057 , B23K26/40 , B23K2203/50
摘要： PROBLEM TO BE SOLVED: To provide a dividing method of a laminate capable of dividing the laminate at a low cost while preventing breakage of the laminate having a laminate structure of a translucent material layer and a crystalline material layer.
SOLUTION: The dividing method of the laminate is provided with a modified part forming process for forming modified parts 20a and 20b on a surface 13 of the crystalline material layer (Si substrate) 12 on the translucent material layer (glass substrate) 11 side and in an inside of the translucent material layer 11 respectively by irradiating laser beams LBa and LBb to the surface 13 of the crystalline material layer 12 on the translucent material layer 11 side and the inside of the translucent material layer 11 respectively along a desired division schedule line L, and a dividing process for dividing the laminate 10 along the division schedule line L while having the modified parts 20a and 20b as the division starting points by thermal stress generated by partially imparting temperature change on the laminate 10 after the modified part forming process.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：为了提供能够以低成本分割层压体的层压体的分割方法，同时防止具有半透明材料层和结晶材料层的层叠结构的层压体的断裂。解决方案：层压体的分割方法设置有在半透明材料层（玻璃基板）11上的结晶材料层（Si基板）12的表面13上形成改性部分20a和20b的改性部分形成工艺分别通过将激光束LBa和LBb照射到半透明材料层11侧的半透明材料层11侧和透光性材料层11的内部的结晶材料层12的表面13，分别沿着期望的分割时间表线L，以及分割处理，用于沿着分割时间表线L分割层压体10，同时通过在改性部分形成之后在层压体10上部分地施加温度变化而产生的热应力使修改部分20a和20b作为分割开始点处理。版权所有（C）2009，JPO＆INPIT

23. 发明专利

JP2007114758A Exposure method 有权
标题翻译：曝光方法
公开(公告)号：JP2007114758A
公开(公告)日：2007-05-10
申请号：JP2006250761
申请日：2006-09-15
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： HAGA YOICHI , MATSUNAGA TADAO , ESASHI MASAKI , TOTSU KENTARO
IPC分类号： G03F7/20
摘要： PROBLEM TO BE SOLVED: To provide an exposure method that achieves optimum exposure distribution conditions in photolithography on a three-dimensional form. SOLUTION: The photolithography on a three-dimensional form is characterized in that: height positions A, B, C and film thickness distribution of a resist are divided into two-dimensional matrixes; and exposure is carried out by operating at least one of vertical movement of the focus of an optical system, vertical movement of a substrate and movement except for vertical movement according to the substrate form and by employing a focus height according to exposure heights A', B', C' and an exposure light dose according to the resist thickness in each matrix without using a photomask. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种在三维形式的光刻中实现最佳曝光分布条件的曝光方法。解决方案：三维形式的光刻的特征在于：抗蚀剂的高度位置A，B，C和膜厚分布被划分成二维矩阵; 并且通过操作光学系统的焦点的垂直移动，基板的垂直移动和除根据基板形式的垂直移动之外的移动中的至少一个以及通过根据曝光高度A'采用焦点高度来进行曝光来进行曝光， B'，C'和根据每个矩阵中的抗蚀剂厚度的曝光光剂量，而不使用光掩模。版权所有（C）2007，JPO＆INPIT

24. 发明专利

JP2006053396A Driving mechanism and micromirror device equipped with this mechanism 审中-公开
标题翻译：具有这种机制的驱动机构和微型设备
公开(公告)号：JP2006053396A
公开(公告)日：2006-02-23
申请号：JP2004235492
申请日：2004-08-12
申请人： Pentax Corp , Tohoku Univ , ペンタックス株式会社 , 国立大学法人東北大学
发明人： ESASHI MASAKI , KIKUCHI NAOKI , MIZUNO JUN ROGERIO , MAEDA SHINHO , KARASAWA KENJI
IPC分类号： G02B26/10 , B81B3/00 , G02B26/08
CPC分类号： H02N1/008 , G02B26/0841 , H02K2201/18
摘要： PROBLEM TO BE SOLVED: To provide a driving mechanism which contributes to minimizing an entire micromirror device and can reduce the load on a hinge and other structural elements of the device.
SOLUTION: The driving mechanism functions to rotate a predetermined rotating plane around a rotating axis, and has a pair of actuators disposed below the rotating plane and arranged in a direction different from the rotating axis. Each actuator has: a first electrode part which includes a substrate almost parallel to the rotating plane in a horizontal state, a first comb-shaped part laid on the upper surface of the substrate, and a second comb-shaped part laid on the lower surface of the substrate; and a second electrode part which includes third and fourth comb-shaped parts formed to gear with the first and second comb-shaped parts while avoiding contact. The actuator is constituted in such a manner that voltages can be independently and freely applied between the first comb-shaped part and the third comb-shaped part and between the second comb-shaped part and the fourth comb-shaped part.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种驱动机构，其有助于使整个微镜装置最小化并且可以减小铰链和装置的其他结构元件的负载。解决方案：驱动机构用于使预定的旋转平面围绕旋转轴旋转，并且具有设置在旋转平面下方并沿与旋转轴不同的方向布置的一对致动器。每个致动器具有：第一电极部分，其包括基本上平行于水平状态的旋转平面的基板，第一梳状部分放置在基板的上表面上，第二梳状部分放置在下表面的基底; 以及第二电极部分，其包括形成为与第一和第二梳状部分齿轮同时避免接触的第三和第四梳状部分。致动器构成为能够在第一梳状部和第三梳状部之间以及第二梳状部与第四梳状部之间独立且自由地施加电压。版权所有（C）2006，JPO＆NCIPI

25. 发明专利

JP2013239839A Tunable filter 有权
标题翻译： TUNABLE过滤器
公开(公告)号：JP2013239839A
公开(公告)日：2013-11-28
申请号：JP2012110793
申请日：2012-05-14
申请人： Murata Mfg Co Ltd , 株式会社村田製作所 , Tohoku Univ , 国立大学法人東北大学 , Chiba Univ , 国立大学法人千葉大学
发明人： KADOTA MICHIO , KIMURA TETSUYA , TANAKA HIDEJI , ESASHI MASAKI , HASHIMOTO KIYONARI , INABA MAO
IPC分类号： H03H9/64 , H03H7/075 , H03H7/12 , H03H9/56 , H03H9/58
摘要： PROBLEM TO BE SOLVED: To provide a tunable filter that inexpensively and compactly reduces the number of variable elements for changing characteristics.SOLUTION: A tunable filter 1 has a resonator section 4 and a series variable reactance element 5 connected in series on a signal path connecting an input terminal 2 and an output terminal 3 to constitute a first circuit element, and has a parallel variable reactance element 6 connected to the first circuit element. The resonator section 4 comprises either an n-tuple mode resonator (n is an integer of two or greater) or a plurality of resonators.
摘要翻译：要解决的问题：提供一种可变滤波器，其可以廉价和紧凑地减少用于改变特性的可变元件的数量。解决方案：可调谐滤波器1具有谐振器部分4和串联可变电抗元件5，其串联连接在信号路径上输入端子2和输出端子3构成第一电路元件，并具有连接到第一电路元件的并联可变电抗元件6。谐振器部分4包括n元组模式谐振器（n为2或更大的整数）或多个谐振器。

26. 发明专利

JP2013164996A Structure of nanocrystal silicon electron emitter array electron source and method for manufacturing the same 有权
标题翻译：纳米晶硅电子发射体阵列电子源的结构及其制造方法
公开(公告)号：JP2013164996A
公开(公告)日：2013-08-22
申请号：JP2012027740
申请日：2012-02-10
申请人： Tokyo Univ Of Agriculture & Technology , 国立大学法人東京農工大学 , Tohoku Univ , 国立大学法人東北大学
发明人： KOSHIDA NOBUYOSHI , IKEGAMI NAOKATSU , ESASHI MASAKI
IPC分类号： H01J1/312 , H01J9/02
CPC分类号： H01J37/073 , H01J2237/0635 , H01J2237/31786
摘要： PROBLEM TO BE SOLVED: To provide an nc-Si electron emitter array structure suitable for integration with an LSI circuit for control drive, and a method for manufacturing the nc-Si electron emitter array structure.SOLUTION: A nanocrystal electron emitter array including a plurality of electron emitters is formed by, after the deposition of a protective layer on an entire surface of a polycrystalline silicon film which is provided on an SOI substrate having an active layer and processed in a dot array, opening the protective layer in a specified region by etching to expose a surface part of polycrystalline silicon, and subjecting the exposed surface part of polycrystalline silicon to selective anodic oxidation. Substrate through wiring penetrating through the SOI substrate is buried so as to be electrically connected to each electron emitter, and a connection electrode is provided at an end of the substrate through wiring. The nanocrystal silicon electron emitter array and an LSI for control drive thereof are joined via the connection electrode.
摘要翻译：要解决的问题：提供适合与用于控制驱动的LSI电路集成的nc-Si电子发射器阵列结构，以及用于制造nc-Si电子发射器阵列结构的方法。解决方案：包括多个纳米晶体的纳米晶体电子发射器阵列的电子发射体之后，在设置在具有有源层的SOI衬底上的多晶硅膜的整个表面上沉积保护层，并以点阵列加工后，通过在特定区域中打开保护层，形成保护层蚀刻以暴露多晶硅的表面部分，以及使多晶硅的暴露表面部分进行选择性阳极氧化。通过穿过SOI衬底的布线的衬底被埋入以与每个电子发射体电连接，并且通过布线在衬底的末端设置连接电极。纳米晶硅电子发射体阵列及其控制驱动用LSI通过连接电极接合。

27. 发明专利

JP2012146707A Package and method of manufacturing the same 有权
标题翻译：包装及其制造方法
公开(公告)号：JP2012146707A
公开(公告)日：2012-08-02
申请号：JP2011001553
申请日：2011-01-06
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： LIN YU-CHING , ESASHI MASAKI , THOMAS GESSNER
IPC分类号： H01L23/02 , H01L23/04
摘要： PROBLEM TO BE SOLVED: To provide a package for an electronic component which allows for irregularity of a connection surface, particulate contamination, substrate warp, and the like by using a metallic glass thin film, thus permitting connection between substrates, and a method of manufacturing the same.SOLUTION: In the package for an electronic component which includes a first substrate 2 and a second substrate 4, and is configured to mount the electronic component 8 on at least one of the first substrate 2 and the second substrate 4, and allows the first substrate 2 and the second substrate 4 to be connected to each other via a seal part 6 so as to encase the electronic component 8, the seal part 6 is composed of a metallic glass thin film. For example, the first substrate 2 is a COSLSI composed of an Si substrate, and an MEMS is formed on the second substrate 4. Hermetic sealing and electrical connection of the seal part 6 become possible by using plastic deformation of the metallic glass thin film, without restrictions, such as irregularity and warp of the substrates, and particulate contamination.
摘要翻译：要解决的问题：提供一种电子部件的封装，其通过使用金属玻璃薄膜来允许连接表面的不规则性，颗粒污染，基板翘曲等，从而允许基板之间的连接，以及制造方法解决方案：在用于包括第一基板2和第二基板4的电子部件的封装中，并且被配置为将电子部件8安装在第一基板2和第二基板4中的至少一个上，并且允许第一基板2和第二基板4经由密封部6彼此连接以封装电子部件8，密封部6由金属玻璃薄膜构成。例如，第一基板2是由Si基板构成的COSLSI，并且在第二基板4上形成MEMS。通过使用金属玻璃薄膜的塑性变形，密封部6的密封和电连接成为可能，没有限制，例如基板的不规则和翘曲，以及颗粒污染。版权所有（C）2012，JPO＆INPIT

28. 发明专利

JP2010232113A Rf-mems switch, manufacturing method of rf-mems switch, antenna changeover device, cellphone, portable information terminal equipment and equipment for ic test 审中-公开
标题翻译： RF-MEMS开关，RF-MEMS开关的制造方法，天线更换装置，电话，便携式信息终端设备和用于IC测试的设备
公开(公告)号：JP2010232113A
公开(公告)日：2010-10-14
申请号：JP2009080783
申请日：2009-03-30
申请人： Otax Co Ltd , Tohoku Univ , オータックス株式会社 , 国立大学法人東北大学
发明人： NISHIMURA NAOTAKA , AOKI KAZUO , MORIYAMA MASAAKI , ESASHI MASAKI , KAWAI YUSUKE
IPC分类号： H01H57/00 , B81B3/00 , H01H49/00
摘要： PROBLEM TO BE SOLVED: To provide an RF-MEMS switch with a simple structure, easy to manufacture, compactly constituted, and with its information signal and an on/off operation hardly affected by noise, and, therefore, capable of surely carrying out on/off changeover.
SOLUTION: The switch is made up by assembling a lower base plate 3 mounting a cantilever part 2, and an upper base plate at a cover side equipped with fixed-side RF input/output signal lines 4, 5. The cantilever part 2 provided at the lower base plate 3 constitutes a piezoelectric actuator, with its one end fixed to the lower base plate 3 and the other end having a contact part 6 on a top face in free up-and-down rocking movement. When the cantilever part 2 is bent upward, the contact part 6 also moves upward and comes in contact with both the RF input signal line 4 and the RF output signal line 5 on the upper base plate to electrically conduct the both lines 4, 5. Further, the lower base plate 3 does not exist under the rocking part of the cantilever part 2, with a space left there.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种结构简单，易于制造，紧凑构造的RF-MEMS开关，并且其信息信号和几乎不受噪声影响的开/关操作，因此能够可靠地进行开/关切换。
解决方案：开关是通过组装安装悬臂部件2的下基板3和安装有固定侧RF输入/输出信号线4,5的盖板的上基板组成的。悬臂部分 2设置在下基板3上，构成压电致动器，其一端固定在下基板3上，另一端在上表面具有自由上下摆动的接触部分6。当悬臂部分2向上弯曲时，接触部分6也向上移动并与上基板上的RF输入信号线4和RF输出信号线5接触，以导电两条线4,5。此外，下基板3不存在于悬臂部2的摆动部下方，其间留有空间。版权所有（C）2011，JPO＆INPIT

29. 发明专利

JP2010177340A Dicing method and expanding apparatus 有权
标题翻译：定标方法和扩展装置
公开(公告)号：JP2010177340A
公开(公告)日：2010-08-12
申请号：JP2009016612
申请日：2009-01-28
申请人： Laser Gijutsu Sogo Kenkyusho , Panasonic Electric Works Co Ltd , Tohoku Univ , パナソニック電工株式会社 , 国立大学法人東北大学 , 財団法人レーザー技術総合研究所
发明人： TANAKA HIDEJI , ESASHI MASAKI , YOSHIDA KAZUJI , TOMII KAZUYUKI , FUJITA MASAYUKI , MIYANAGA NORIAKI , NAKADA YOSHIKI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a dicing method and an expanding apparatus by which a wafer is divided precisely into individual chips collectively regardless of a type of the wafer, and a manufacturing yield is improved. SOLUTION: In an expanding process in the dicing method, a peripheral part of an adhesive resin tape 30 is fixed onto a table 41, and a ring stage 43 and a pressing stage 44 which are disposed inside the table 41 and hold a wafer ring 42, are raised relatively to a virtual plane including a surface to which the adhesive resin tape 30 is fixed, of the table 41 so as to perform a stretching step of stretching the adhesive resin tape 30 over the wafer ring 42. A dividing step is then performed wherein the pressing stage 44 is raised to expand the adhesive resin tape 30 and a bending stress is applied to a wafer 10 to divide the wafer into individual chips 1, and then, a restretching step is performed wherein the ring stage 43 is furthermore raised relatively to the virtual plane to stretch again the adhesive resin tape 30 over the wafer ring 42. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种切片方法和扩展装置，通过该切割方法和扩展装置，不管晶片的类型如何，晶片都被精确地划分成单独的芯片，并且提高了制造成品率。解决方案：在切割方法的扩展过程中，粘合树脂带30的周边部分固定在台41上，环台43和压制台44设置在工作台41的内部并保持晶片环42相对于包括固定有粘合树脂带30的表面的虚拟平面而升高，以便执行将粘合树脂带30拉伸在晶片环42上的拉伸步骤。分割然后进行步骤，其中按压台44升高以使粘合树脂带30膨胀，并且将弯曲应力施加到晶片10以将晶片分成单独的芯片1，然后进行再拉伸步骤，其中环形台43 进一步相对于虚拟平面升高，以将粘合树脂带30再次拉伸在晶片环42上。版权所有（C）2010，JPO＆INPIT

30. 发明专利

JP2009207575A Ultrasonic probe, endoscope and method of manufacturing ultrasonic probe 有权
标题翻译：超声探头，内窥镜及制造超声探头的方法
公开(公告)号：JP2009207575A
公开(公告)日：2009-09-17
申请号：JP2008051454
申请日：2008-03-01
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： HAGA YOICHI , ESASHI MASAKI , MATSUNAGA TADAO
IPC分类号： A61B8/12 , H04R17/00 , H04R31/00
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic probe in which piezoelectric elements are arranged in a ring array shape and made into multi-elements, and to provide an endoscope equipped with the same and a method of manufacturing the ultrasonic probe. SOLUTION: The ultrasonic probe 1 is provided with ultrasonic oscillators 11 arranged in the ring array shape, vibration absorbing bodies 12 arranged on the rear side of the ultrasonic oscillators for each ultrasonic oscillator, and holding parts 13 for holding the respective vibration absorbing bodies 12. A wiring connection part 16 for each ultrasonic oscillator 11 is provided on the rear end face of the holding part, and a back side electrode 11D for each ultrasonic oscillator and the wiring connection part 16 are electrically connected by a multilayer wiring structure inside the holding part 13. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种超声波探头，其中压电元件以环形阵列形状布置并制成多元件，并提供一种配备有该元件的内窥镜和一种制造超声波探头的方法。解决方案：超声波探头1设置有以环形阵列形状布置的超声波振荡器11，布置在每个超声波振荡器的超声波振荡器的后侧的振动吸收体12和用于保持各个振动吸收的保持部13 在保持部的后端面设置有用于每个超声波振荡器11的布线连接部16，并且用于每个超声波振荡器的背面电极11D和布线连接部16通过内部的多层布线结构电连接（C）2009，JPO＆INPIT

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