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    • 22. 发明申请
    • LIGHT EMITTING DIODE
    • 发光二极管
    • US20080083919A1
    • 2008-04-10
    • US11848709
    • 2007-08-31
    • Ken TAKAHASHITaichiroo KonnoMasahiro Arai
    • Ken TAKAHASHITaichiroo KonnoMasahiro Arai
    • H01L33/00
    • H01L33/14H01L33/025H01L33/10H01L33/30H01L33/40
    • On a GaAs substrate 1, a light emitting part 4, an intermediate layer 5 of AlGaInP and a current spreading layer 6 are sequentially formed. The light emitting part 4 includes a first conductivity type AlGaInP based lower cladding layer 41, an AlGaInP based light emitting layer 42, and a second conductivity type AlGaInP based upper cladding layer 43 sequentially formed on the GaAs substrate 1. In each layer of the light emitting part 4, a hydrogen concentration is not more than 2×1017 cm−3, a carbon concentration is not more than 2×1016 cm−3, and an oxygen concentration is not more than 2×1016 cm−3. In a partial region or in a total region of the current-spreading layer 6, a hydrogen concentration is not more than 5×1017 cm−3, a carbon concentration is not more than 5×1017 cm−3, and an oxygen concentration is not more than 2×1016 cm−3.
    • 在GaAs衬底1上,依次形成发光部分4,AlGaInP的中间层5和电流扩散层6。 发光部分4包括依次形成在GaAs衬底1上的第一导电型AlGaInP基下包层41,AlGaInP基发光层42和第二导电型AlGaInP基上包层43。 在发光部分4的每个层中,氢浓度不超过2×10 17 cm -3,碳浓度不超过2×10 16, -3 O 3,氧浓度不大于2×10 16 cm -3。 在电流扩散层6的局部区域或总区域中,氢浓度不大于5×10 17 cm -3,碳浓度不大 超过5×10 17 cm -3,氧浓度不超过2×10 16 cm -3。
    • 23. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US07230281B2
    • 2007-06-12
    • US11165568
    • 2005-06-24
    • Masahiro AraiTaichiroo KonnoKazuyuki Iizuka
    • Masahiro AraiTaichiroo KonnoKazuyuki Iizuka
    • H01L33/00
    • H01L33/02H01L33/14H01L33/30
    • A semiconductor light emitting device has: a semiconductor substrate; a semiconductor layer having an n-type cladding layer, an active layer, a p-type cladding layer and a p-type contact layer, wherein the p-type contact layer is made of an As-based material and located at the top of the semiconductor layer and doped with a p-type dopant at a concentration of 1×1019/cm3 or more; a current spreading layer formed on the semiconductor layer and made of a metal oxide material; and a diffusion prevention layer formed between the p-type contact layer and the p-type cladding layer. The diffusion prevention layer is made of a group III–V semiconductor that has phosphorus as a group V element and has a crystal lattice mismatch ratio of within ±0.3% to the semiconductor substrate.
    • 半导体发光器件具有:半导体衬底; 具有n型包覆层,有源层,p型覆层和p型接触层的半导体层,其中p型接触层由基于As的材料制成,位于 半导体层并掺杂浓度为1×10 9 / cm 3以上的p型掺杂剂; 形成在半导体层上并由金属氧化物材料制成的电流扩展层; 以及形成在p型接触层和p型覆层之间的扩散防止层。 扩散防止层由具有磷作为V族元素并且具有与半导体衬底的±0.3%以内的晶格失配比的III-V族半导体制成。
    • 24. 发明申请
    • Semiconductor light-emitting device
    • 半导体发光装置
    • US20070075321A1
    • 2007-04-05
    • US11497379
    • 2006-08-02
    • Taichiroo KonnoKazuyuki IizukaMasahiro Arai
    • Taichiroo KonnoKazuyuki IizukaMasahiro Arai
    • H01L33/00
    • H01L33/14H01L33/30
    • A semiconductor light-emitting device having: a light-emitting portion formed on a semiconductor substrate, the light-emitting portion having an n-type clad layer, an active layer and a p-type clad layer; an As-based contact layer formed on the light-emitting portion, the contact layer being doped with a p-type dopant of 1×1019/cm3 or more; a current spreading layer formed on the contact layer, the current spreading layer being formed of a transparent conductive film of a metal oxide material; and a buffer layer formed between the contact layer and the p-type clad layer or formed being inserted inside of the p-type clad layer. The buffer layer is of an undoped group III/V semiconductor, and the group III/V semiconductor is of a group V element having P(phosphorus) as a main component thereof.
    • 一种半导体发光器件,具有:形成在半导体衬底上的发光部分,所述发光部分具有n型覆盖层,有源层和p型覆盖层; 形成在发光部分上的基于As的接触层,所述接触层掺杂有1×10 19 / cm 3以上的p型掺杂物; 形成在所述接触层上的电流扩展层,所述电流扩展层由金属氧化物材料的透明导电膜形成; 以及形成在所述接触层和所述p型覆盖层之间或形成为插入所述p型覆盖层内部的缓冲层。 缓冲层为未掺杂的III / V族III族半导体,III / V族半导体为具有P(磷)作为主要成分的V族元素。
    • 28. 发明授权
    • Epitaxial wafer, light-emitting element, method of fabricating epitaxial wafer and method of fabricating light-emitting element
    • 外延晶片,发光元件,外延晶片的制造方法和制造发光元件的方法
    • US08212268B2
    • 2012-07-03
    • US12692754
    • 2010-01-25
    • Taichiroo Konno
    • Taichiroo Konno
    • H01L33/00
    • H01L33/10H01L33/22
    • An epitaxial wafer, a light-emitting element, a method of fabricating the epitaxial wafer and a method of fabricating the light-emitting element, which have a high output and a low forward voltage, and can be fabricated without increasing fabricating cost, are provided. The epitaxial wafer is formed with a light-emitting portion, a reflective portion provided between a semiconductor substrate and the light-emitting portion and a current dispersing layer having first and second current dispersing layers, wherein the reflective portion has plural pairs of layers having first and second semiconductor layers wherein the first semiconductor layer has a thickness of TA defined by Equation (1), T A = λ p 4 ⁢ n A ⁢ 1 - ( n I ⁢ n ⁢ sin ⁢ ⁢ θ n A ) 2 ( 1 ) the second semiconductor layer has a thickness of TB defined by Equation (2), T B = λ p 4 ⁢ n B ⁢ 1 - ( n I ⁢ n ⁢ sin ⁢ ⁢ θ n B ) 2 ( 2 ) and the second current dispersing layer has a high carrier density or a high impurity density and is provided with the convexoconcave portion on the surface.
    • 提供外延晶片,发光元件,制造外延晶片的方法和制造发光元件的方法,其具有高输出和低正向电压,并且可以在不增加制造成本的情况下制造。 。 外延晶片形成有发光部分,设置在半导体基板和发光部分之间的反射部分和具有第一和第二电流分散层的电流分散层,其中反射部分具有多对具有第一 和第二半导体层,其中第一半导体层具有由等式(1)定义的TA的厚度,TA =λp 4 n A 1 - (n I n sinüt; thetas; n A)2(1) 第二半导体层具有由公式(2)定义的TB的厚度,TB =λp 4 n B 1 - (n I n sinüt; thetas; n B)2(2)和第二电流分散 层具有高载流子密度或高杂质浓度,并且在表面上设置凸凹部。
    • 29. 发明授权
    • Light-emitting element
    • 发光元件
    • US08120050B2
    • 2012-02-21
    • US12585494
    • 2009-09-16
    • Taichiroo KonnoTakehiko Tani
    • Taichiroo KonnoTakehiko Tani
    • H01L33/00
    • H01L33/10
    • A light-emitting element includes a semiconductor substrate, a light emitting layer portion including an active layer on the semiconductor substrate, a first reflective layer between the semiconductor substrate and the active layer for reflecting light emitted from the active layer; and a second reflective layer between the semiconductor substrate and the first reflective layer for reflecting light with a wavelength different from that of the light reflected by the first reflective layer. The second reflective layer reflects light with a wavelength longer than that of the light reflected by the first reflective layer.
    • 发光元件包括半导体衬底,在半导体衬底上包括有源层的发光层部分,在半导体衬底和有源层之间的第一反射层,用于反射从有源层发射的光; 以及在所述半导体衬底和所述第一反射层之间的第二反射层,用于反射与由所述第一反射层反射的光的波长不同的波长的光。 第二反射层反射的波长比由第一反射层反射的光的波长长。
    • 30. 发明申请
    • Light-emitting element
    • 发光元件
    • US20100252849A1
    • 2010-10-07
    • US12585494
    • 2009-09-16
    • Taichiroo KonnoTakehiko Tani
    • Taichiroo KonnoTakehiko Tani
    • H01L33/00
    • H01L33/10
    • A light-emitting element includes a semiconductor substrate, a light emitting layer portion including an active layer on the semiconductor substrate, a first reflective layer between the semiconductor substrate and the active layer for reflecting light emitted from the active layer; and a second reflective layer between the semiconductor substrate and the first reflective layer for reflecting light with a wavelength different from that of the light reflected by the first reflective layer. The second reflective layer reflects light with a wavelength longer than that of the light reflected by the first reflective layer.
    • 发光元件包括半导体衬底,在半导体衬底上包括有源层的发光层部分,在半导体衬底和有源层之间的第一反射层,用于反射从有源层发射的光; 以及在所述半导体衬底和所述第一反射层之间的第二反射层,用于反射与由所述第一反射层反射的光的波长不同的波长的光。 第二反射层反射的波长比由第一反射层反射的光的波长长。