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21. 发明专利

JP2004250785A Electrolytic treatment apparatus and substrate treatment apparatus 审中-公开
公开(公告)号：JP2004250785A
公开(公告)日：2004-09-09
申请号：JP2004016318
申请日：2004-01-23
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SUZUKI HIDENAO , NOMURA KAZUFUMI , IDE KUNIHITO , KANDA HIROYUKI , MISHIMA KOJI , MIHARA NAOTERU , MAKINO NATSUKI , KATSUOKA SEIJI
IPC分类号： C25D5/08 , C25D7/12 , C25D21/04 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To make the intra-surface uniformity of the film thickness of a plating film with, for example, an electrolytic plating equipment by making it possible to make the electric field over the entire surface of a surface to be treated of a substrate more uniform even in the case of the substrate of particularly a large area and to more uniformly control the flow velocity over the entire surface of the surface to be treated of the substrate of a plating liquid flowing along the surface to be treated of the substrate. SOLUTION: The electrolytic treatment apparatus has a substrate holding section 36 which holds the substrate, a first electrode 88 which energies the surface to be treated of the substrate by coming into contact with the substrate, a second electrode 98 which is arranged nearly parallel to the surface to be treated in the position facing the surface to be treated of the substrate held by the section 36, a high-resistance structure 110 which is arranged between the substrate W held by the section 36 and the second electrode 98, an electrolyte injection section 104 which injects the electrolyte from the lateral of the structure 110 within a region where the substrate W held by the section 36 and the structure 110 face each other, and a power source 114 which impresses a voltage between the first electrode 88 and the second electrode 98. COPYRIGHT: (C)2004,JPO&NCIPI

22. 发明专利

JP2012129559A Substrate processing apparatus and substrate processing method 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：JP2012129559A
公开(公告)日：2012-07-05
申请号：JP2012080426
申请日：2012-03-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KOBAYASHI KENICHI , SOTOZAKI HIROSHI , SHINOZAKI HIROYUKI , MAKINO NATSUKI , KATSUOKA SEIJI , KUNISAWA JUNJI , NABEYA OSAMU , MORISAWA SHINYA , OGAWA TAKAHIRO
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can achieve a high throughput.SOLUTION: The substrate processing apparatus comprises: a polishing section having a vertically movable top ring 31A for holding a substrate W; a transfer mechanism 6 having a vertically movable transfer stage performing transfer of the substrate W to/from the top ring 31A; and a retainer station ring 143 disposed between the top ring 31A and the transfer stage. The top ring 31A has a top ring body 38, and a retainer ring 40 movable vertically relative to the top ring body 38. The retainer station ring 143 has a plurality of push-up mechanisms 144 which push up the retainer ring 40.
摘要翻译：要解决的问题：提供可以实现高生产率的基板处理装置。解决方案：基板处理设备包括：抛光部分，具有用于保持基板W的可垂直移动的顶环31A; 传送机构6，其具有可移动的传送台，用于将基板W传送到顶环31A或从顶环31A传送; 以及设置在顶环31A和转印台之间的保持架环143。顶环31A具有顶环主体38和相对于顶环主体38可垂直移动的保持环40.保持架环143具有多个向上推动保持环40的上推机构144。 >版权所有（C）2012，JPO＆INPIT

23. 发明专利

JP2007050505A Electrolytic machining device and electrolytic machining method 审中-公开
标题翻译：电动加工装置和电动加工方法
公开(公告)号：JP2007050505A
公开(公告)日：2007-03-01
申请号：JP2006219805
申请日：2006-08-11
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MAKINO NATSUKI , KUNISAWA JUNJI , NAMIKI KEISUKE , FUKUNAGA YUKIO , MUTSUHIRA KATSUYUKI , FANG RAY , COOPER EMANUEL I , COTTE JOHN M , DELIGIANNI HARIKLIA , KWIETNIAK KEITH T , BAKER-O'NEAL BRETT C , FLOTTA MATTEO , VEREECKEN PHILIPPE M
IPC分类号： B23H5/00 , B23H5/08 , C25F3/16 , H01L21/304 , H01L21/3205
CPC分类号： B23H5/08 , C25F3/02 , C25F7/00
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic machining device capable of flattening the whole surface of a substrate uniformly by low pressure without damaging the substrate when forming wiring on the substrate by, for example, the damascene method.
SOLUTION: This electrolytic machining device 10 is provided with a wafer holder 14 for rotating a wafer forming a metallic film on its surface while holding the wafer and an electrolytic machining unit 16 for applying electrolytic machining on the wafer. The electrolytic machining unit 16 is provided with a rotatable machining electrode 52, a polishing pad 53 attached to the machining electrode 52, a pressing mechanism 72 for pressing the polishing pad 53 against the wafer, a liquid supply mechanism for supplying electrolytic machining liquid between the wafer and the machining electrode 52, a relative movement mechanism for letting the wafer and the machining electrode 52 perform relative movement, and power supply 103 for applying voltage between the machining electrode 52 and the metallic film of the wafer so that the machining electrode 52 becomes a cathode and the metallic film of the wafer becomes an anode.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种电解加工装置，其能够通过例如大马士革法在基板上形成布线时在低压下均匀地平坦化基板的整个表面而不损坏基板。解决方案：该电解加工装置10设置有用于在保持晶片的同时在其表面上旋转形成金属膜的晶片的晶片保持器14和用于在晶片上施加电解加工的电解加工单元16。电解加工单元16设置有可旋转的加工电极52，附着到加工电极52的抛光垫53，用于将抛光垫53压靠在晶片上的按压机构72，用于在该晶片之间供应电解加工液的液体供给机构晶片和加工电极52，用于使晶片和加工电极52进行相对移动的相对移动机构，以及用于在加工电极52和晶片的金属膜之间施加电压的电源103，使得加工电极52变为阴极和晶片的金属膜变成阳极。版权所有（C）2007，JPO＆INPIT

24. 发明专利

JP2005139558A Substrate plating device 有权
标题翻译：基板镀层器件
公开(公告)号：JP2005139558A
公开(公告)日：2005-06-02
申请号：JP2005036162
申请日：2005-02-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MAKINO NATSUKI , MISHIMA KOJI , KUNISAWA JUNJI , KIMURA NORIO , ODAGAKI MITSUKO , NANJO TAKAHIRO
IPC分类号： C25D17/06 , C25D17/00 , C25D17/08 , C25D17/10
摘要： PROBLEM TO BE SOLVED: To provide a substrate plating device capable of performing plating treatment and treatment accompanying the same in a single unit, capable of improving the further miniaturization and operation efficiency as the single unit, and exhibiting excellent maintenance properties as well.
SOLUTION: The device comprises: a substrate holding part 36 freely ascending/descending among a substrate delivery position A in the lower part, a plating position B in the upper part and a pretreatment/washing position C between them and holding a substrate W freely attachable and detachable in such a manner that the face to be plated is directed upward; a cathode part 38 provided with a cathode electrode 88 and a seal material 90 abutted against the peripheral part of the substrate W held by the substrate holding part 36 located at the plating position; and a freely movable electrode head 28 provided with an anode 102 arranged at the position confronted with the substrate W held by the substrate holding part 36 located at the plating position. The delivery of the substrate is performed at the substrate delivery position, the plating treatment at the plating position, and at least one of the pretreatment, washing and drying of the substrate at the pretreatment/washing position.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决问题：为了提供能够以单个单元进行电镀处理和处理的基板电镀装置，能够提高作为单个单元的进一步的小型化和运行效率，并且还表现出优异的维护性能。解决方案：该装置包括：在下部的基板输送位置A之间自由上升/下降的基板保持部36，上部的电镀位置B和它们之间的预处理/清洗位置C，并且保持基板 W可以这样的方式自由地安装和拆卸，使得要被镀的表面向上指向; 设置有阴极电极88的阴极部38和与位于电镀位置的基板保持部36保持的基板W的周边部抵接的密封材料90; 以及可自由移动的电极头28，其设置有阳极102，该阳极设置在与由位于电镀位置的基板保持部36保持的基板W相对的位置。在基板输送位置，电镀位置处的电镀处理以及在预处理/洗涤位置处的基板的预处理，洗涤和干燥中的至少一个进行基板的输送。版权所有（C）2005，JPO＆NCIPI

25. 发明专利

JP2004197220A Electrolytic treatment device, and method therefor 审中-公开
公开(公告)号：JP2004197220A
公开(公告)日：2004-07-15
申请号：JP2003399443
申请日：2003-11-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MAKINO NATSUKI , KUNISAWA JUNJI
IPC分类号： C25D7/12 , C25D21/00 , C25D21/12 , C25F3/12 , C25F7/00 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To perform CMP (Chemical Mechanical Polishing) working in a short time by improving the flatness of a plating film even if fine grooves and large grooves are coexistent on the surface of a substrate.
SOLUTION: The electrolytic treatment device is provided with: a substrate holding part 36 for holding a substrate; a first electrode 88 for supplying electric currents to the treatment face of the substrate; and an electrode head 28 having a second electrode 98 and a high resistance structure 110 arranged so as to be confronted with the substrate holding part 36 in order, and a polishing face 120a arranged at a position facing the substrate W held by the substrate holding part 36. The electrolytic treatment device is further provided with: an electrolytic solution injecting means of injecting an electrolytic solution into the space between the substrate held by the substrate holding part 36 and the second electrode 98; a relative movement mechanism of relatively moving the substrate holding part 36 and the electrode head 28; a pressing mechanism 122 of pressing the polishing face 120a of the electrode head 28 against the substrate W held by the substrate holding part 36; and a power source 114 of applying voltage in such a manner that the direction of the electric current is selectively switched between the first electrode 88 and the second electrode 98.
COPYRIGHT: (C)2004,JPO&NCIPI

26. 发明专利

JP2001348693A SUBSTRATE TREATING DEVICE 失效
公开(公告)号：JP2001348693A
公开(公告)日：2001-12-18
申请号：JP2000170076
申请日：2000-06-07
申请人： EBARA CORP
发明人： MISHIMA KOJI , INOUE HIROAKI , MAKINO NATSUKI , NAKAMURA KENJI , MATSUMOTO MORIHARU
IPC分类号： C23C18/31 , C25D7/12 , C25D17/00 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide a substrate treating device capable of being made compact and inexpensive and by which one substrate treating process is smoothly transferred to the succeeding substrate treating process in a short time, and the substrate treating process is stabilized. SOLUTION: A substrate holding part 36 to hold a substrate W with its face to be treated turned upward, a cathode 38 to be brought into contact with the substrate W held on the part 36 and energized and plural anode heads 30-1, 2 provided with an anode 98 and moving the anode 98 freely between the face of the substrate W to be plated and a refuge 22 are provided. The plural anode heads 30-1, 2 are positioned in order at specified places on the face of the substrate W, a plating solution is injected on the face from a plating solution feed pipe 102, and the face is plated in plural stages.

27. 发明专利

JP2001003198A PLATING METHOD FOR SUBSTRATE AND DEVICE THEREFOR 失效
公开(公告)号：JP2001003198A
公开(公告)日：2001-01-09
申请号：JP17573499
申请日：1999-06-22
申请人： EBARA CORP
发明人： MISHIMA KOJI , INOUE HIROAKI , MAKINO NATSUKI , KUNISAWA JUNJI
IPC分类号： H01L21/3205 , C25D7/12 , C25D17/10 , H01L21/288 , H01L21/768 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To stably hold a black film over the whole face of an anode and to stably execute plating to the whole face of a substrate by coating the surface of the anode with a protecting member composed of a water retainable material. SOLUTION: An anode 28 is composed of copper contg. phosphorous for preventing the formation of slime at the time of melting, and the surface on the inside is coated with a protecting member 30. This protecting member 30 is composed of a woven fabric composed of fiber such as of a polypropylene having water retainability and permeability and having durability to acidic plating contg. sulfuric acid of high concn., and in which the elution of impurities does not exert undesirable influence on its plating performance. In this way, the surface of the anode 28 is damped with a plating soln. 16 supported with the protecting member 30 even in the case the member 12 on the substrate side is opened, therefor, the air oxidation of a black film does not progress. Moreover, the liberation of the black film into the plating soln. 16 is suppressed, so that the black film is stably supported with the anode 28.

28. 发明专利

JP2010050436A Substrate processing apparatus, and substrate processing method 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：JP2010050436A
公开(公告)日：2010-03-04
申请号：JP2009108671
申请日：2009-04-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KOBAYASHI KENICHI , SOTOZAKI HIROSHI , SHINOZAKI HIROYUKI , MAKINO NATSUKI , KATSUOKA SEIJI , KUNISAWA JUNJI , NABEYA OSAMU , MORISAWA SHINYA , OGAWA TAKAHIRO
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which has a high throughput. SOLUTION: The substrate processing apparatus includes a polishing section 3 configured to polish a substrate W, transfer mechanisms 5 and 6 configured to transfer the substrate W, and a cleaning section 4 configured to clean and dry the polished substrate W. The cleaning section 4 has plural cleaning lines for cleaning plural substrates. The plurality of cleaning lines have plural cleaning modules 201A, 201B, 202A, 202B, and the plurality of plural transfer robots 209 and 210 transfer the substrates. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高生产量的基板处理装置。解决方案：基板处理装置包括：抛光部3，其被配置为对基板W进行抛光;转印机构5和6，被配置为传送基板W;以及清洁部分4，其构造成清洁和干燥抛光的基板W.清洁部分4具有用于清洁多个基板的多个清洁线。多个清洁线具有多个清洁模块201A，201B，202A，202B，并且多个传送机器人209和210传送基板。版权所有（C）2010，JPO＆INPIT

29. 发明专利

JP2009226550A Hand with oscillating mechanism and substrate carrying device equipped with the same 有权
标题翻译：手动摇摆机构和底座携带装置
公开(公告)号：JP2009226550A
公开(公告)日：2009-10-08
申请号：JP2008075745
申请日：2008-03-24
申请人： Ebara Corp , Yaskawa Electric Corp , 株式会社安川電機 , 株式会社荏原製作所
发明人： SANEMASA YASUKI , YAMAMOTO HIDEO , TORII HIROOMI , OGAWA TAKAHIRO , KATSUOKA SEIJI , NAKAO HIDETAKA , MAKINO NATSUKI
IPC分类号： B25J15/08 , B65G49/06 , B65G49/07 , H01L21/677
CPC分类号： H01L21/68707 , Y10S414/141
摘要： PROBLEM TO BE SOLVED: To provide a hand for a substrate carrying device capable of directly delivering/receiving a substrate to/from a substrate holding mechanism on the opposing side in a normal direction of a plane of the substrate held by the hand. SOLUTION: The hand 1 comprises a hand base 4 serving as a base part, an oscillation hand 3 arranged to be overlapped with the hand base 4 and supporting the substrate 2, and oscillation mechanisms 5 arranged between the hand base 4 and the oscillation hand 3 and supporting the oscillation hand 3 to enable inclination and parallel displacement with respect to the hand base 4. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在基板保持机构的基板保持机构的基板保持机构的基板保持机构的基板保持机构的基板保持机构的基板保持机构的平面的法线方向上保持手的基板承载装置的手。解决方案：手1包括用作基部的手基座4，布置成与手基座4重叠并支撑基底2的摆动手3，以及布置在手基座4和手柄基座4之间的振动机构5。摆动手3并且支撑摆动手3以相对于手基座4倾斜并平移位置。（C）2010，JPO＆INPIT

30. 发明专利

JP2005248328A Substrate treatment apparatus 有权
标题翻译：基板处理设备
公开(公告)号：JP2005248328A
公开(公告)日：2005-09-15
申请号：JP2005066317
申请日：2005-03-09
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MISHIMA KOJI , INOUE HIROAKI , MAKINO NATSUKI , NAKAMURA KENJI , MATSUMOTO MORIHARU
IPC分类号： C23C18/31 , C25D5/06 , C25D7/12 , C25D17/00 , C25D19/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which can be made compact and low-cost, and in which shift from one substrate treatment process to next substrate treatment process is smoothly performed in a short period of time and a stable substrate treatment process can be obtained.
SOLUTION: The substrate treatment apparatus includes: a substrate holding means 36 (a substrate treatment section 20) which holds the substrate W; and substrate treatment heads 30 (first and second anode heads 30-1, and 2) which are movable between the surface to be treated of the substrate W and a retreating section 22 and is equipped with a substrate treating liquid supplying mechanism. A plurality of the substrate treatment apparatus (plating units) 12 which perform the substrate treatment by transferring the substrate treatment heads 30 onto the the substrates W held on the substrate holding means 36 are installed within a single apparatus.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以制造得紧凑且低成本的基板处理装置，并且其中从一个基板处理工艺到下一个基板处理工艺的转变在短时间内平稳地进行并且稳定可以获得基板处理工艺。解决方案：基板处理装置包括：保持基板W的基板保持装置36（基板处理部20）以及能够在基板W的待处理表面和退避部22之间移动的基板处理头30（第一和第二阳极头30-1,2），并且配备有基板处理液供给机构。通过将基板处理头30转印到保持在基板保持装置36上的基板W上进行基板处理的多个基板处理装置（电镀单元）12安装在单个装置内。版权所有（C）2005，JPO＆NCIPI

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