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21. 发明专利

JPH10276113A ULTRAHIGH FREQUENCY BAND RADIO COMMUNICATION EQUIPMENT 失效
公开(公告)号：JPH10276113A
公开(公告)日：1998-10-13
申请号：JP7709697
申请日：1997-03-28
申请人： TOSHIBA CORP
发明人： IZEKI YUJI , YAMAGUCHI KEIICHI , KONNO YOSHIO
IPC分类号： H01L23/552 , H01Q13/18 , H01Q21/00 , H01Q23/00 , H04B1/38
摘要： PROBLEM TO BE SOLVED: To miniaturize an equipment while the characteristics of antennas are secured by providing the reception antenna and the transmission antenna on the surface of a package through the use of the package having an electrically constricted part forming a high space whose cutoff frequency is higher than the carrier frequency of radio communication at the periphery of a semiconductor chip. SOLUTION: Feeding lines 9 for the antennas 1 and 3 and slots 10 are provided on a high frequency circuit board 2. They are loaded on a module casing 6 constituted of a conductive material so that the circuit board 2 becomes a cover. The areas of the module casing 6 and the circuit board 2 are covered by the solid pattern of ground at a part except for wiring. The semiconductor chip 5 is mounted so that it is positioned in the constricted part 8. The area of the high frequency circuit board 2 in the constricted part 8 is covered by the solid pattern of ground. Since the antenna elements 1 and 3 are positioned on the surface (back of high frequency circuit board 2), they are not affected by the wall face of the casing 6.

22. 发明专利

JPH10107519A HIGH FREQUENCY MODULE 失效
公开(公告)号：JPH10107519A
公开(公告)日：1998-04-24
申请号：JP25954896
申请日：1996-09-30
申请人： TOSHIBA CORP
发明人： HANAWA TAKESHI , IZEKI YUJI , KONNO YOSHIO
IPC分类号： H05K9/00 , H01P5/107 , H01P7/06 , H03B1/00
摘要： PROBLEM TO BE SOLVED: To reduce the loss at a coupling part by providing a waveguide acting like a cut-off waveguide with respect to a resonance frequency of a cavity resonator between a semiconductor integrated circuit and the cavity resonator in the high frequency module consisting of the semiconductor integrated circuit and the cavity resonator to reduce the dielectric loss. SOLUTION: A metallic case for a semiconductor integrated circuit 2, a cavity resonator 1 and a cut-off waveguide 3 is structured to be a unified case except a cover 5. Since respective physical sizes of the semiconductor integrated circuit, the cavity resonator and the cut-off waveguide are decided independently of each other, a degree of freedom of design is improved thereby obtaining an optional coupling coefficient by changing the length and the cross sectional shape of the cut-off waveguide. Since a current is distributed over the entire guide wall of the cut-off waveguide, its conductor loss is small. When no dielectric material is placed inside the waveguide, the dielectric loss is reduced in comparison with the coupling via a semiconductor and a dielectric board, an electromagnetic field is concentrated only to a part on the semiconductor integrated circuit coupled with the cavity resonator and coupling is attained without giving effect on the other parts.

23. 发明专利

JPH09252217A MONOLITHIC ANTENNA 失效
公开(公告)号：JPH09252217A
公开(公告)日：1997-09-22
申请号：JP6061196
申请日：1996-03-18
申请人： TOSHIBA CORP
发明人： IZEKI YUJI , YAMADA HIROSHI , SAITO MASAYUKI , HONMA SOICHI , ONOMURA JIYUNKO , TAKAGI EIJI
IPC分类号： H01Q23/00 , H01Q1/22 , H01Q13/08
摘要： PROBLEM TO BE SOLVED: To suppress determination in the radiation characteristics of the mono lithic antenna used for microwave and millimeter bands. SOLUTION: A semiconductor board 21 and a dielectric board 12 are opposed to each other with a prescribed interval by means of bumps 20 and a strip conductor 16 is formed to a face of the semiconductor board 11 opposed to the dielectric board 12 and a ground conductor 13 is formed to the dielectric board 12 opposed to the strip conductor 16. A coupling hole 14 is made to the ground conductor 13 at a position corresponding to the strip conductor 16. A microwave circuit and the ground conductor 13 composed of the strip conductor 16 or the like form a microstrip line and the strip conductor 16 and the coupling hole 14 form a microstrip antenna.

24. 发明专利

JPH09246461A HIGH-FREQUENCY SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE 失效
公开(公告)号：JPH09246461A
公开(公告)日：1997-09-19
申请号：JP5341296
申请日：1996-03-11
申请人： TOSHIBA CORP
发明人： ONOMURA JIYUNKO , IZEKI YUJI , TAKAGI EIJI , SAITO MASAYUKI , YAMADA HIROSHI , HONMA SOICHI
IPC分类号： H01L25/00 , H01P1/04 , H01P1/30 , H01P5/08 , H04B1/40
摘要： PROBLEM TO BE SOLVED: To realize miniaturization and high performance of a high-frequency semiconductor device and improve the degree of freedom for designing, by mounting first and second semiconductor circuit boards along a crossing plane, and connecting first and second semiconductor circuits by electromagnetic field coupling. SOLUTION: Semiconductor circuits 41a and 41b are arranged in such a manner that a GaAs board 43b is placed along a plane crossing perpendicularly to a GaAs board 43a. Ground layers 47a, 49a are connected with a ground layer 47b. A slit 53 is formed on a circuit coupling portion of the ground layer 47b. Transmission lines 55a, 55b for performing electromagnetic field coupling of the semiconductor circuits 41a, 41b are provided on polyimide layers 45a, 45b. Since shielding by the ground layer 47b is released near the slit 53, the transmission lines 55a, 55b perform electromagnetic field coupling by resonance at distal end portions 55a', 55b'. Thus, the semiconductor circuits 41a and 41b are electrically connected to each other, thereby enabling miniaturization of a high-frequency semiconductor device of high performance.

25. 发明专利

JPH09153839A VERY HIGH FREQUENCY BAND RADIO COMMUNICATION EQUIPMENT 失效
公开(公告)号：JPH09153839A
公开(公告)日：1997-06-10
申请号：JP18084696
申请日：1996-07-10
申请人： TOSHIBA CORP
发明人： YOSHIHARA KUNIO , KONNO YOSHIO , IZEKI YUJI , SHIZUKI YASUSHI , HANAWA TAKESHI , MORITSUKA KOHEI , ASHIZAWA YASUO , KURIYAMA YASUHIKO , MORINAGA MOTOYASU , TAKAGI EIJI , MIYAGI TAKESHI , AKAGI JUNKO
IPC分类号： H01L25/00 , H01L23/552 , H01L25/065 , H01L25/07 , H01L25/18 , H01P5/08 , H01P7/06 , H01P7/10 , H01Q23/00 , H03D7/00 , H04B1/38 , H04B1/44
摘要： PROBLEM TO BE SOLVED: To make a very high frequency band radio communication equipment small in size and low in manufacture cost. SOLUTION: This very high frequency band radio communication equipment is provided with one substrate 14 where a reception antenna 13, a transmission antenna 12 and a semiconductor chip 11 are mounted. The semiconductor chip is provided with an input, terminal 19 for inputting a base band signal, an output terminal 19 for outputting the base band signal from the semiconductor chip and a control signal terminal 19 for controlling the reception antenna and the transmission antenna. Then, interruption means 15, 16 and 18 forming space where a cut off frequency is higher than the carrier frequency of radio communication at the mounting position of the semiconductor chip are provided.

26. 发明专利

JPH0992684A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0992684A
公开(公告)日：1997-04-04
申请号：JP24820395
申请日：1995-09-27
申请人： TOSHIBA CORP
发明人： IZEKI YUJI , SHIZUKI YASUSHI , UCHIDA TATSUAKI , YOSHIHARA KUNIO , SAITO MASAYUKI
IPC分类号： H01L21/60 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To facilitate the detection of defective connections by forming pad projections when viewed from above. SOLUTION: Pads 14a, 14b have triangular projections 19a, 19b respectively, and the opposed sides of the projections are almost in parallel with each other. When a semiconductor ship component 15 is mounted, bumps 17 composed of solder paste is printed and applied to the pads 14 on a wiring board 11. The semiconductor chip component 15 is placed on the wiring board 11 in such a manner that the bumps 17 are aligned with the electrodes 16 on the semiconductor chip component 15. If an electrode 16b is less wettable to solder at this time, moment is exerted on the electrode 16a by the surface tension of the properly wetted bumps 17a during the subsequent solder reflow. As a result the semiconductor chip component 15 is inclined, which facilitates the visual identification of defective connections.

27. 发明专利

JPH0786460A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0786460A
公开(公告)日：1995-03-31
申请号：JP23167493
申请日：1993-09-17
申请人： TOSHIBA CORP
发明人： TAKAGI EIJI , ONO NAOKO , IZEKI YUJI
IPC分类号： H01L23/04 , H01L23/02 , H01L23/08 , H01L23/28 , H01L23/31 , H01L23/495 , H01L23/66
摘要： PURPOSE:To suppress lowering of gain after loading an element while having high reliability besides preventing a mounting area of a substrate from being reduced. CONSTITUTION:This is a semiconductor device 10 where a semiconductor element 14 is loaded and a metal member 11 working as an electrode for earthing for this semiconductor device and the electrodes 12 connected to the semiconductor element are sealed in with resin. Then, the metal member 11 is exposed in the underside of this semiconductor device coming in contact with this substrate 16 besides the electrodes 12 are led out to be level with the substrate 16 and the exposed surfaces coming in contact with the substrate 16 of the metal members 12 and the main surface of the semiconductor element 14 are vertical.

28. 发明专利

JP2007243448A Semiconductor module and its manufacturing method 有权
标题翻译：半导体模块及其制造方法
公开(公告)号：JP2007243448A
公开(公告)日：2007-09-20
申请号：JP2006061419
申请日：2006-03-07
申请人： Toshiba Corp , 株式会社東芝
发明人： IZEKI YUJI , YAMAGUCHI KEIICHI , SEKINE SHUICHI
IPC分类号： H01Q23/00 , H01Q13/08
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module which can reduce a transmission loss of an excitation path and can improve an antenna characteristic with respect to the external environment, and also to provide its manufacturing method.
SOLUTION: The semiconductor module 1 comprises a first substrate 2 wherein a microwave circuit 21 is formed on a first surface 201 thereof; a second substrate 4 which has a second surface 401 being away from and facing the first surface 201, and has a high dielectric constant higher than that of the air; and an antenna (patch antenna 41) which is formed on the second surface 401 so as to face the microwave circuit 21, and is excited by the microwave circuit 21.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种半导体模块，其可以减少激励路径的传输损耗并且可以改善相对于外部环境的天线特性，并且还提供其制造方法。解决方案：半导体模块1包括第一衬底2，其中微波电路21形成在其第一表面201上; 第二基板4，其具有远离第一表面201并且面向第一表面201的第二表面401，并且具有高于空气的高介电常数; 以及形成在第二表面401上以面对微波电路21并由微波电路21激励的天线（贴片天线41）。（C）2007，JPO＆INPIT

29. 发明专利

JP2003174367A PORTABLE RADIO EQUIPMENT 审中-公开
公开(公告)号：JP2003174367A
公开(公告)日：2003-06-20
申请号：JP2002284451
申请日：2002-09-27
申请人： TOSHIBA CORP
发明人： SEKINE SHUICHI , ITO TAKAYOSHI , MURAKAMI YASUSHI , ODATE KISHO , INOUE KAZUHIRO , TSUJIMURA TERUHIRO , IZEKI YUJI , YAMAGUCHI KEIICHI , ONO NAOKO , KAYANO HIROYUKI
IPC分类号： H04B1/04 , H04B1/3822 , H04B1/40
摘要： PROBLEM TO BE SOLVED: To provide portable radio equipment capable of executing communication always matched with an antenna without being influenced by objects arranged around the antenna. SOLUTION: In the portable radio equipment, the impedance of the antenna is optimized by adjusting a matching circuit connected to the antenna and having an impedance adjusting function on the basis of an antenna reflection phase outputted from a reflection phase detection circuit and a current to be supplied to a transceiver for sending a transmission signal. COPYRIGHT: (C)2003,JPO

30. 发明专利

JP2002176769A DC-DC CONVERTER 审中-公开
公开(公告)号：JP2002176769A
公开(公告)日：2002-06-21
申请号：JP2001311798
申请日：2001-10-09
申请人： TOSHIBA CORP
发明人： SATO TOSHIRO , MATSUKURA KUNIO , YANASE ISAMU , IZEKI YUJI , MIZOGUCHI TETSUHIKO , IDE YUJI , HASEGAWA MICHIO , YAMAGUCHI YOSHIHIRO , IWAMOTO YASUNORI
IPC分类号： H01F30/00 , H02M3/155 , H02M3/28
摘要： PROBLEM TO BE SOLVED: To provide a DC-DC converter capable of reducing loss caused by an overcurrent detecting means. SOLUTION: This DC-DC converter includes a switching means for generating a rectangular wave from an input signal, a means for modulating the pulse width of the rectangular wave, a flat transformer which has primary and secondary flat coils insulated from each other, two-layer insulating layers formed on both surface of the coils, and two-layer soft magnetic layers formed on the outside of the two-layer insulating layers respectively. The converter accumulates electromagnetic energy on the primary flat coil when the switching means is turned on; releases the electromagnetic energy accumulated under an off state through the secondary flat coil, a capacitor of smoothing the rectangular wave, a rectifying device, and a lat search coil which is disposed on the outside of one or both sides of the two-layer soft magnetic layers that form the flat transformer; and detects the overcurrent running through the flat coil.

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