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    • 22. 发明授权
    • Well structure in high voltage device
    • 高压器件结构良好
    • US07009260B2
    • 2006-03-07
    • US10730299
    • 2003-12-08
    • Sung Kee Park
    • Sung Kee Park
    • H01L29/76H01L29/94
    • H01L29/0619H01L27/115H01L29/0615
    • A well structure in a high voltage device comprises a first well formed in a substrate, the first well having an opposite conductive type from the substrate; a second well isolated from the first well, the second well having the same conductive type as the substrate; a field stop implant region formed between the first well and the second well and spaced apart from each of the first well and the second well by a given distance, the field stop implant region having the same conductive type as the substrate; and a pick-up region overlapped on the field stop implant region, the pick-up region having the same conductive type as the field stop implant region.
    • 高压器件中的阱结构包括形成在衬底中的第一阱,第一阱具有与衬底相反的导电类型; 与第一阱隔离的第二阱,第二阱具有与衬底相同的导电类型; 形成在所述第一阱和所述第二阱之间并且与所述第一阱和所述第二阱中的每一个间隔开给定距离的场停止注入区域,所述场停止注入区域具有与所述衬底相同的导电类型; 并且拾取区域与场停止注入区域重叠,拾取区域具有与场停止注入区域相同的导电类型。
    • 23. 发明授权
    • Patterns of semiconductor device and method of forming the same
    • 半导体器件的形态及其形成方法
    • US08298961B2
    • 2012-10-30
    • US12650498
    • 2009-12-30
    • Sung Kee Park
    • Sung Kee Park
    • H01L21/475
    • H01L21/0338H01L21/0337
    • A method of forming patterns of a semiconductor device comprises providing a semiconductor substrate comprising a first region wherein first patterns are to be formed and a second region wherein second patterns are to be formed, each of the second patterns having a wider width than the first patterns, forming an etch target layer over the semiconductor substrate, forming first etch patterns over the etch target layer of the first and second regions, forming second etch patterns on both sidewalls of each of the first etch patterns, wherein the second etch pattern formed in the second region has a wider width than the second etch pattern formed in the first region, removing the first etch patterns, forming third etch patterns over the etch target layer of the second region, the third etch pattern overlapping part of the second pattern, and etching the etch target layer using the third etch patterns and the second etch patterns as an etch mask, to form the first and second patterns.
    • 一种形成半导体器件的图形的方法包括提供一种半导体衬底,该半导体衬底包括将要形成第一图案的第一区域和要形成第二图案的第二区域,每个第二图案的宽度比第一图案宽 在所述半导体衬底上形成蚀刻目标层,在所述第一和第二区域的所述蚀刻目标层上形成第一蚀刻图案,在所述第一蚀刻图案的每个的两个侧壁上形成第二蚀刻图案,其中形成在所述第一蚀刻图案中的所述第二蚀刻图案 第二区域具有比在第一区域中形成的第二蚀刻图案宽的宽度,去除第一蚀刻图案,在第二区域的蚀刻目标层上形成第三蚀刻图案,第二蚀刻图案与第二图案重叠部分,以及蚀刻 使用第三蚀刻图案和第二蚀刻图案作为蚀刻掩模的蚀刻目标层,以形成第一和第二图案。
    • 28. 发明授权
    • Row decoder in flash memory and erase method of flash memory cell using the same
    • 闪存中的行解码器和闪存单元的擦除方法使用相同
    • US06819597B2
    • 2004-11-16
    • US10614229
    • 2003-07-07
    • Ki Seog KimKeun Woo LeeSung Kee ParkYoo Nam Jeon
    • Ki Seog KimKeun Woo LeeSung Kee ParkYoo Nam Jeon
    • G11C1606
    • G11C16/08G11C16/16G11C29/70
    • Disclosed are a row decoder in a flash memory and erasing method in a flash memory cell using the same. The row decoder comprises a PMOS transistor having a gate electrode for receiving a first input signal as an input and connected between a first power supply terminal and a first node, a first NMOS transistor having a gate electrode for receiving the first input signal as an input and connected between the first node and a second node, a second NMOS transistor having a gate electrode for receiving the second input signal as an input and connected between the second node and a ground terminal, and a switching means having a gate electrode for receiving the third input signal as an input and connected between the second node and a second power supply terminal, wherein the first node is connected to word lines.
    • 本发明公开了一种闪速存储器中的行解码器和使用其的擦除方法。 行解码器包括具有用于接收第一输入信号作为输入并连接在第一电源端子和第一节点之间的栅电极的PMOS晶体管,具有用于接收第一输入信号作为输入的栅电极的第一NMOS晶体管 并连接在第一节点和第二节点之间的第二NMOS晶体管,具有用于接收第二输入信号作为输入并连接在第二节点和接地端子之间的栅电极的第二NMOS晶体管,以及具有栅电极的开关装置, 第三输入信号作为输入并连接在第二节点和第二电源端子之间,其中第一节点连接到字线。
    • 29. 发明授权
    • Method of forming a floating gate in a flash memory device
    • 在闪速存储器件中形成浮动栅极的方法
    • US06743676B2
    • 2004-06-01
    • US10286980
    • 2002-11-04
    • Sung Kee ParkKi Seog KimKeun Woo LeeKeon Soo Shim
    • Sung Kee ParkKi Seog KimKeun Woo LeeKeon Soo Shim
    • H01L21336
    • H01L27/11521H01L27/115
    • The present invention relates to a method of forming a floating gate in a flash memory device. Upon formation of a device isolation film, a space of a lower polysilicon layer for a floating gate is defined, a bird's beak is formed on an internal surface of a trench by subsequent well sacrificial oxidization process and well oxidization process and an upper polysilicon layer for a floating gate is then formed, so that the space of the floating gate is formed. Therefore, the present invention can reduce the cost since a mask process is not required compared to an existing stepper method and the process cost since a planarization process using chemical mechanical polishing process (CMP) is not required compared to the self-aligned floating mode.
    • 本发明涉及一种在闪速存储器件中形成浮动栅极的方法。 在形成器件隔离膜时,限定用于浮置栅极的下多晶硅层的空间,通过随后的良好牺牲氧化过程和阱氧化过程在沟槽的内表面上形成鸟嘴,以及上部多晶硅层 形成浮栅,从而形成浮栅的空间。 因此,与现有步进法相比,本发明可以降低成本,因为与自对准浮动模式相比,不需要使用化学机械抛光工艺(CMP)的平坦化处理,因此与现有的步进方法和工艺成本相比不需要掩模处理。