专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20090121678A1 Feeder-Lineless Traffic System and Charging Method Therefor 有权
标题翻译：无馈线交通系统及其充电方法
公开(公告)号：US20090121678A1
公开(公告)日：2009-05-14
申请号：US12225883
申请日：2008-02-20
申请人： Masaya Mitake , Katsuaki Morita , Masahiro Yamaguchi , Hiroshi Yamashita , Masaomi Yamada , Kousuke Katahira
发明人： Masaya Mitake , Katsuaki Morita , Masahiro Yamaguchi , Hiroshi Yamashita , Masaomi Yamada , Kousuke Katahira
IPC分类号： H02J7/00
CPC分类号： B60L5/42 , B60L9/00 , B60L11/1816 , B60L11/1824 , B60L11/1837 , B60L11/185 , B60L2200/26 , B60L2230/30 , B60M1/36 , Y02T10/7005 , Y02T10/7088 , Y02T90/121 , Y02T90/128 , Y02T90/14
摘要： Provided is a railway type feeder-lineless traffic system in which the weight of a vehicle is reduced while the structure of the vehicle is simplified, and it is possible to carry out a quick charge during a brief stopping time at a station or the like. A charging method in a feeder-lineless traffic system in which a vehicle mounted thereon with an electric storage unit runs on a predetermined pathway with the use of a power, and the electric storage unit in the vehicle is charged from a charger set up on the pathway, wherein a contact charging way in which a power feeder 24 connected to the charger 21 set up on the ground is made into contact with a power receiver 6 mounted on a vehicle 1 is carried out when the vehicle 1 comes to a stop, and a commercial electric power is converted by the charger and a charge control unit of the charger into a DC power which is chargeable direct into the electric storage unit 1, and the DC power is quickly charged into the electric storage unit through the intermediary of the power feeder and the power receiver while a current value of the DC power is controlled.
摘要翻译：提供了一种在车辆的结构简化的同时减轻车辆重量的铁路式无馈线交通系统，并且可以在车站等的短暂停止时间期间进行快速充电。一种无馈线交通系统中的充电方法，其中安装有蓄电单元的车辆通过使用电力在预定路径上行驶，并且车辆中的蓄电单元从设置在车辆上的充电器充电路径，其中，当车辆1停止时，执行其中连接到设置在地面上的充电器21的馈电器24与安装在车辆1上的电力接收器6接触的接触充电方式，商用电力由充电器和充电器的充电控制单元转换成可直接充电到蓄电单元1中的直流电力，并且直流电力通过电力中继被快速充电到蓄电单元馈电器和电源接收器，同时控制直流电源的当前值。

22. 发明申请

US20120049354A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME 审中-公开
标题翻译：半导体器件及其形成方法
公开(公告)号：US20120049354A1
公开(公告)日：2012-03-01
申请号：US13219155
申请日：2011-08-26
申请人： Emi SAWAYAMA , Masahiro Yamaguchi
发明人： Emi SAWAYAMA , Masahiro Yamaguchi
IPC分类号： H01L23/498 , H01L23/48
CPC分类号： H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/3135 , H01L23/49816 , H01L24/05 , H01L24/13 , H01L24/75 , H01L24/81 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2221/68327 , H01L2224/0332 , H01L2224/0401 , H01L2224/05017 , H01L2224/05023 , H01L2224/05025 , H01L2224/05147 , H01L2224/05564 , H01L2224/05611 , H01L2224/05655 , H01L2224/1132 , H01L2224/11849 , H01L2224/13018 , H01L2224/13025 , H01L2224/131 , H01L2224/13247 , H01L2224/13564 , H01L2224/13611 , H01L2224/13655 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81205 , H01L2224/81385 , H01L2224/83192 , H01L2224/92125 , H01L2224/92143 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2924/01047 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： A semiconductor device includes a wiring board, a first semiconductor chip disposed over the wiring board, a stack of second semiconductor chips disposed over the first semiconductor chip; and a first connection structure connecting the first semiconductor chip and the stack of second semiconductor chips. The first connection structure includes first and second connection electrodes disposed on the first semiconductor chip and a closest second semiconductor chip of the stack, respectively. The closest second semiconductor chip is closest to the first semiconductor chip. A bonding material bonds the first and second connection electrodes.
摘要翻译：半导体器件包括布线板，设置在布线板上的第一半导体芯片，布置在第一半导体芯片上的第二半导体芯片堆叠; 以及连接第一半导体芯片和第二半导体芯片堆叠的第一连接结构。第一连接结构包括分别设置在第一半导体芯片上的第一和第二连接电极和堆叠的最靠近的第二半导体芯片。最靠近的第二半导体芯片最靠近第一半导体芯片。接合材料结合第一和第二连接电极。

23. 发明申请

US20100052133A1 STACK TYPE SEMICONDUCTOR DEVICE WITH REINFORCING RESIN 审中-公开
标题翻译：具有增强树脂的堆叠型半导体器件
公开(公告)号：US20100052133A1
公开(公告)日：2010-03-04
申请号：US12496066
申请日：2009-07-01
申请人： Hisashi TANIE , Hiroshi Moriya , Masahiro Yamaguchi , Emi Sawayama
发明人： Hisashi TANIE , Hiroshi Moriya , Masahiro Yamaguchi , Emi Sawayama
IPC分类号： H01L23/52 , H01L21/50 , H01L21/607
CPC分类号： H01L24/86 , H01L23/5385 , H01L23/5387 , H01L24/29 , H01L24/50 , H01L25/0657 , H01L25/50 , H01L2224/13144 , H01L2225/06572 , H01L2225/06579 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , H01L2924/3512 , H01L2924/00 , H01L2224/48 , H01L2224/0401
摘要： A semiconductor device includes a plurality of semiconductor packages each with a semiconductor element and a flexible board. The flexible board is wider than the semiconductor element and is electrically connected to the semiconductor element. The plurality of semiconductor packages are stacked on one surface of a mother board. The semiconductor element is positioned between the flexible boards of the semiconductor packages in adjacent layers. The flexible boards in the adjacent layers are joined together at junction portions positioned at a part of the flexible boards which sticks out from an area in which the semiconductor elements and the flexible boards overlap. A reinforcing resin is provided in at least a part of the area between the flexible boards in the adjacent layers and between the junction portion of the flexible boards and the corresponding semiconductor element. The reinforcing resin contacts at least a part of the adjacent flexible board.
摘要翻译：半导体器件包括多个半导体封装，每个半导体封装均具有半导体元件和柔性板。柔性板比半导体元件宽，并与半导体元件电连接。多个半导体封装堆叠在母板的一个表面上。半导体元件位于相邻层中的半导体封装的柔性板之间。相邻层中的柔性板在位于柔性板的从半导体元件和柔性板重叠的区域伸出的部分的接合部处接合在一起。在相邻层中的柔性板之间的区域的至少一部分之间以及柔性板的接合部分和相应的半导体元件之间设置增强树脂。增强树脂与相邻柔性板的至少一部分接触。

24. 发明授权

US07548679B2 Container for accommodating optical fiber coil and optical fiber module having the container 有权
标题翻译：用于容纳光纤线圈的容器和具有容器的光纤模块
公开(公告)号：US07548679B2
公开(公告)日：2009-06-16
申请号：US11923269
申请日：2007-10-24
申请人： Masaaki Hirano , Masahiro Yamaguchi , Masaki Tsuruga
发明人： Masaaki Hirano , Masahiro Yamaguchi , Masaki Tsuruga
IPC分类号： G02B6/00
CPC分类号： G02B6/4457
摘要： A container for an optical fiber coil and an optical fiber module including the container is provided, wherein an excess length portion of a pigtail fiber is accommodated in the container and the remaining portion can be drawn out from the container. The container includes a first part for accommodating a coil having a functional optical fiber, and a second part disposed on an outer periphery side of the first part and windingly accommodating a pigtail fiber that is optically connected to the functional optical fiber. The second part has a gap that extends over the entirety of the outer periphery, and communicates with the exterior. The optical fiber module includes the container, the coil having the functional optical fiber accommodated in the first part of the container, and the pigtail fiber that is optically connected to the functional fiber and that has a portion windingly accommodated in the second part.
摘要翻译：提供了一种用于光纤线圈的容器和包括容器的光纤模块，其中猪尾纤维的多余长度部分容纳在容器中，其余部分可以从容器中抽出。容器包括用于容纳具有功能光纤的线圈的第一部分和设置在第一部分的外周侧上的第二部分，并且卷绕容纳与功能光纤光学连接的引出纤维。第二部分具有在整个外周上延伸并与外部连通的间隙。光纤模块包括容器，具有容纳在容器的第一部分中的功能光纤的线圈和光纤连接到功能性光纤并且具有卷绕在第二部分中的部分的尾纤光纤。

25. 发明申请

US20090086522A1 ADDRESS LINE WIRING STRUCTURE AND PRINTED WIRING BOARD HAVING SAME 有权
标题翻译：地线接线结构和印刷线路板
公开(公告)号：US20090086522A1
公开(公告)日：2009-04-02
申请号：US12239900
申请日：2008-09-29
申请人： Atsushi HIRAISHI , Toshio Sugano , Masahiro Yamaguchi , Yoji Nishio , Tsutomu Hara , Koichiro Aoki
发明人： Atsushi HIRAISHI , Toshio Sugano , Masahiro Yamaguchi , Yoji Nishio , Tsutomu Hara , Koichiro Aoki
IPC分类号： G11C5/06 , H05K1/18 , H05K7/00
CPC分类号： G11C5/063 , G11C5/04 , G11C8/14 , H05K1/181 , H05K2201/09254 , H05K2201/09263 , H05K2201/10159 , Y02P70/611
摘要： An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL0 from the data transferring element to a first branch point S1 where a branch line is branched at a shortest distance from the data transferring element is configured to become equal to or greater than a wiring length TL1 from the first branch point S1 to a second branch point S2 where a second branch line is branched. A wiring length TL3 from the second branch point S2 to a third branch point S3 where a third branch line is branched is configured to become greater than the wiring lengths TL0 and TL1.
摘要翻译：具有短截线结构的地址信号线连接在至少三个存储器元件和数据传输元件之间，并传送存储器元件的地址信号。数据传送元件的地址端子的阻抗低于地址信号线的特性阻抗。从数据传送元件到分支线从数据传送元件到最短距离分支的第一分支点S1的布线长度TL0被配置成等于或大于从第一分支点S1到布线长度TL1 第二分支点S2，其中第二支线被分支。从第二分支点S2到分支第三分支线的第三分支点S3的布线长度TL3被配置为变得大于布线长度TL0和TL1。

26. 发明申请

US20080185729A1 SEMICONDUCTOR ELEMENT UNIT AND COMPLEX THEREOF, SEMICONDUCTOR DEVICE AND MODULE THEREOF, ASSEMBLED STRUCTURE THEREOF AND FILM SUBSTRATE CONNECTION STRUCTURE 审中-公开
标题翻译：半导体元件及其复合物，半导体器件及其模块，其组装结构和薄膜衬底连接结构
公开(公告)号：US20080185729A1
公开(公告)日：2008-08-07
申请号：US12022516
申请日：2008-01-30
申请人： Masahiro Yamaguchi , Naoya Kanda , Yasuo Amano , Shigeharu Tsunoda
发明人： Masahiro Yamaguchi , Naoya Kanda , Yasuo Amano , Shigeharu Tsunoda
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/49833 , H01L23/538 , H01L24/16 , H01L24/50 , H01L24/86 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/0652 , H01L2225/06527 , H01L2225/06568 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device is provided with a film substrate that has through-vias that are formed by filling a conductive material in through-holes that pass through the front and rear of a film-shaped substrate body and wiring or terminals that connect to the through-vias, with a semiconductor element being mounted on the film-shaped substrate body by terminal members thereof being electrically connected to the wiring or terminals of the film substrate.
摘要翻译：半导体器件具有薄膜基板，该薄膜基板具有通孔，所述通孔通过在通过薄膜状基板主体的前后的通孔中填充导电材料而形成，并且连接到通孔的接线或端子，通孔，其半导体元件通过其端子部件电连接到薄膜基板的布线或端子而安装在膜状基板主体上。

27. 发明申请

US20080110736A1 Switch and method of manufacturing the same 有权
标题翻译：开关及其制造方法
公开(公告)号：US20080110736A1
公开(公告)日：2008-05-15
申请号：US11907013
申请日：2007-10-09
申请人： Kuniharu Matsuoka , Masahiro Yamaguchi , Keiichirou Tamenaga , Kazuyuki Watanabe
发明人： Kuniharu Matsuoka , Masahiro Yamaguchi , Keiichirou Tamenaga , Kazuyuki Watanabe
IPC分类号： H01H9/18 , H01H11/00
CPC分类号： H01H11/00 , H01H9/182 , H01H2009/187 , Y10T29/49105
摘要： A switch to be used mainly for controlling a variety of electronic devices in automobiles, and a method of manufacturing the same switch are disclosed for providing a switch free from positional deviation in its display section and easy to manufacture. Operating units having no display sections are mounted to a housing, then the shapes of each one of the operating units are recognized by a control circuit. An upper jig and a lower jig are moved for a laser beam device to remove a non-translucent section and expose parts of a translucent section, thereby forming the display sections. This structure allows eliminating positional deviation of the display sections and also requiring no visual checks done for confirming the display sections in manufacturing.
摘要翻译：用于主要用于控制汽车中的各种电子装置的开关以及制造相同开关的方法被公开用于提供一种在其显示部分中没有位置偏差的开关并且易于制造。没有显示部的操作单元被安装到壳体，然后由控制电路识别每个操作单元的形状。移动上夹具和下夹具用于激光束装置以去除非透光部分并暴露部分透光部分，从而形成显示部分。该结构允许消除显示部分的位置偏差，并且也不需要对制造中的显示部分的确认进行目视检查。

28. 发明申请

US20070241463A1 ELECTRODE, MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE HAVING THE SAME 审中-公开
标题翻译：电极，其制造方法和具有该电极的半导体器件
公开(公告)号：US20070241463A1
公开(公告)日：2007-10-18
申请号：US11735836
申请日：2007-04-16
申请人： Masahiro Yamaguchi , Hirofumi Nakamura
发明人： Masahiro Yamaguchi , Hirofumi Nakamura
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L25/105 , H01L21/4846 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Metal posts are formed by etching a metal plate. Therefore, the metal posts can be formed with an accurate height and at a fine pitch. By connecting together upper and lower packages using the metal posts formed in the upper package, there is obtained a miniaturized semiconductor device having a fine electrode pitch.
摘要翻译：通过蚀刻金属板形成金属柱。因此，金属柱可以以精确的高度和精细的间距形成。通过使用形成在上部封装中的金属柱将上部和下部封装连接在一起，获得具有细电极间距的小型化的半导体器件。

29. 发明授权

US07002623B1 Image processing apparatus for correcting a color and texture of an image and displaying the corrected image 失效
标题翻译：用于校正图像的颜色和纹理并显示校正图像的图像处理装置
公开(公告)号：US07002623B1
公开(公告)日：2006-02-21
申请号：US09391943
申请日：1999-09-08
申请人： Nagaaki Ohyama , Masahiro Yamaguchi , Takashi Obi , Masaru Tsuchida , Kensuke Ishii
发明人： Nagaaki Ohyama , Masahiro Yamaguchi , Takashi Obi , Masaru Tsuchida , Kensuke Ishii
IPC分类号： H04N9/73
CPC分类号： H04N1/6088 , G06T7/55 , H04N13/207 , H04N13/239 , H04N13/344
摘要： An image processing apparatus is provided which includes an image input apparatus for inputting an image including an object. The image is input into a reproducing environment converting unit, which sets a desired illuminating environment on a monitor display screen in which the image is reproduced. The reproducing environment unit converts the image of the object by three-dimensionally moving and rotating the object in the set environment, and an image output apparatus displays and prints the converted image.
摘要翻译：提供一种图像处理装置，其包括用于输入包括对象的图像的图像输入装置。图像被输入到再现环境转换单元，其在其中再现图像的监视器显示屏幕上设置期望的照明环境。再现环境单元通过在设定环境中三维地移动和旋转对象来转换对象的图像，并且图像输出设备显示并打印转换的图像。

30. 发明授权

US06472193B1 Recombinant lysophosphatidic acid phosphatase 失效
标题翻译：重组溶血磷脂酸性磷酸酶
公开(公告)号：US06472193B1
公开(公告)日：2002-10-29
申请号：US09600588
申请日：2000-09-11
申请人： Tadaomi Takenawa , Masami Hiroyama , Tatsuya Kishimoto , Masahiro Yamaguchi , Mitsuyoshi Toyosato , Kouji Mizuno
发明人： Tadaomi Takenawa , Masami Hiroyama , Tatsuya Kishimoto , Masahiro Yamaguchi , Mitsuyoshi Toyosato , Kouji Mizuno
IPC分类号： C12N914
CPC分类号： C12N9/16 , C12Q1/42
摘要： An object of the present invention is to provide a recombinant LPA phosphates capable of specifically hydrolyzing LPA, which is useful for elucidation of the metabolic pathway of LPA, and also for diagnosis and treatment of various diseases with which LPA is associated. The present invention also provides for a method capable of simply and inexpensively determining LPA associated with various diseases. The present invention also provides for a kit for determination suitable for the method. The present invention has succeeded in purifying the LPA phosphatase using bovine brain as a raw material, and further in cloning human LPA phosphatase gene. The present invention specifically relates to a DNA encoding a peptide comprising the amino acid sequence of SEQ ID NO:1; a DNA comprising the nucleotide sequence of SEQ ID NO:2; a protein encoded by the DNA; and expression vector carrying the DNA; a transformant harboring the expression vector; a method for producing a recombinant lysophosphatidic acid phosphatase by the transformant; a method for determination of LPA by the protein; a determination reagent for LPA by the protein; a kit for diagnosis, comprising the reagent for determination, and the like.
摘要翻译：本发明的目的是提供能够特异性水解LPA的重组LPA磷酸酯，其可用于阐明LPA的代谢途径，以及用于诊断和治疗与LPA相关的各种疾病。本发明还提供了能够简单且廉价地确定与各种疾病相关的LPA的方法。本发明还提供了适用于该方法的用于测定的试剂盒。本发明成功地使用牛脑作为原料来纯化LPA磷酸酶，进一步克隆人类LPA磷酸酶基因。本发明具体涉及编码包含SEQ ID NO：1的氨基酸序列的肽的DNA; 包含SEQ ID NO：2的核苷酸序列的DNA; 由DNA编码的蛋白质; 和携带DNA的表达载体; 携带表达载体的转化体; 由转化体生产重组溶血磷脂酸性磷酸酶的方法; 一种由蛋白质测定LPA的方法; 用于蛋白质的LPA的测定试剂; 用于诊断的试剂盒，包括用于测定的试剂等。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式