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    • 21. 发明申请
    • THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    • 薄膜晶体管及其制造方法
    • US20110042670A1
    • 2011-02-24
    • US12990408
    • 2009-04-28
    • Ayumu SatoRyo HayashiHisato YabutaMasafumi Sano
    • Ayumu SatoRyo HayashiHisato YabutaMasafumi Sano
    • H01L29/786H01L21/44
    • H01L29/7869H01L29/78621
    • Provided are a coplanar structure thin film transistor that allows a threshold voltage to change only a little under electric stress, and a method of manufacturing the same. The thin film transistor includes on a substrate at least: a gate electrode; a gate insulating layer; an oxide semiconductor layer including a source electrode, a drain electrode, and a channel region; a channel protection layer; and an interlayer insulating layer. The channel protection layer includes one or more layers, the layer in contact with the oxide semiconductor layer among the one or more layers being made of an insulating material containing oxygen, ends of the channel protection layer are thinner than a central part of the channel protection layer, the interlayer insulating layer contains hydrogen, and regions of the oxide semiconductor layer that are in direct contact with the interlayer insulating layer form the source electrode and the drain electrode.
    • 提供一种共面结构薄膜晶体管,其制造方法允许阈值电压在电应力下变化很小。 薄膜晶体管至少在基板上包括:栅电极; 栅极绝缘层; 包括源电极,漏电极和沟道区的氧化物半导体层; 通道保护层; 和层间绝缘层。 沟道保护层包括一层或多层,一层或多层中与氧化物半导体层接触的层由含氧的绝缘材料制成,沟道保护层的端部比通道保护层的中心部分薄 层间绝缘层含有氢,与层间绝缘层直接接触的氧化物半导体层的区域形成源电极和漏电极。
    • 25. 发明申请
    • METHOD OF FORMING DEPOSITED FILM AND METHOD OF FORMING PHOTOVOLTAIC ELEMENT
    • 形成沉积膜的方法和形成光伏元件的方法
    • US20070184191A1
    • 2007-08-09
    • US11627066
    • 2007-01-25
    • Yasuyoshi TakaiMasafumi SanoKeishi Saito
    • Yasuyoshi TakaiMasafumi SanoKeishi Saito
    • C23C16/00
    • C23C16/24C23C16/45523C23C16/545Y02E10/545Y02E10/548
    • Provided is a deposited film containing microcrystalline silicon by plasma CVD, which includes changing at least one of conditions selected from a high frequency power density, a bias voltage with respect to an interelectrode distance, a bias current with respect to an electrode area, a high frequency power with respect to a source gas flow rate, a ratio of a diluting gas flow rate to a source gas flow rate, a substrate temperature, a pressure, and an interelectrode distance, between conditions for forming a deposited film of a microcrystalline region and conditions for forming a deposited film of an amorphous region; and forming a deposited film under conditions within a predetermined range in the vicinity of boundary conditions under which the crystal system of the deposited film substantially changes between a amorphous state and a microcrystalline state.
    • 提供了通过等离子体CVD包含微晶硅的沉积膜,其包括改变选自高频功率密度,相对于电极间距离的偏置电压,相对于电极面积的偏置电流,高电平 用于形成微晶区域的沉积膜的条件和相对于源气体流量的稀释气体流量的比率,稀释气体流量与源气体流量的比率,基板温度,压力和电极间距离 形成非晶区沉积膜的条件; 以及在沉积膜的晶体系统在非晶态和微晶态之间基本上变化的边界条件附近的预定范围内的条件下形成沉积膜。