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21. 发明申请

US20060032617A1 Heat sink electronic components 审中-公开
标题翻译：散热器电子元件
公开(公告)号：US20060032617A1
公开(公告)日：2006-02-16
申请号：US11012958
申请日：2004-12-14
申请人： Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0275 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.
摘要翻译：一种用于电子部件的散热器包括基座，耦合到基座的第一散热构件，嵌入在基座中的热管和耦合到基座的第二散热构件。基座由第一金属材料制成，并且包括具有用于与电子部件接触的底面的吸热部和从吸热部的顶面延伸的导热部。第一散热构件由第二金属材料制成并且联接到基座的吸热部分。第二散热构件由第二金属材料制成并且连接到基座的导热部分。第一金属材料与第二金属材料不同并且具有比第二金属材料更高的热导率。

22. 发明申请

US20050141201A1 Fastener for heat sink 失效
标题翻译：散热器紧固件
公开(公告)号：US20050141201A1
公开(公告)日：2005-06-30
申请号：US10989694
申请日：2004-11-16
申请人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
发明人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
IPC分类号： F28F7/00 , H01L23/40 , H05K7/12 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A fastener for a heat sink of the present invention includes a length-variable operating member (10), a piston member (20), an embracing member (30), a resilient member (40) and a post (58) extending from a printed circuit board (50). The piston member is movable in the operating member when the operating member varies between a shortest length and a longest length. The resilient member covers around the piston member. The embracing member is controllable cooperatively by the piston member and the resilient member to grasp the post or release the post.
摘要翻译：本发明的用于散热器的紧固件包括长度可变的操作构件（10），活塞构件（20），包围构件（30），弹性构件（40）和从一个印刷电路板（50）。当操作构件在最短长度和最长长度之间变化时，活塞构件可在操作构件中移动。弹性构件围绕活塞构件覆盖。包围构件由活塞构件和弹性构件协同控制以抓住柱或释放柱。

23. 发明授权

US08296947B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US08296947B2
公开(公告)日：2012-10-30
申请号：US12506213
申请日：2009-07-20
申请人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： B21D53/02 , H05K7/20
CPC分类号： B21D53/085 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要翻译：散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。还公开了一种制造散热器的方法。

24. 发明授权

US08220527B2 Heat dissipation device with heat pipe 有权
标题翻译：散热装置带热管
公开(公告)号：US08220527B2
公开(公告)日：2012-07-17
申请号：US12056295
申请日：2008-03-27
申请人： Peng Liu , Shi-Wen Zhou , Chun-Chi Chen , Yi-Jiun Li
发明人： Peng Liu , Shi-Wen Zhou , Chun-Chi Chen , Yi-Jiun Li
IPC分类号： F28D15/02
CPC分类号： F28D15/0233
摘要： A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.
摘要翻译：散热装置包括用于与发热电子设备热接合的散热器，位于散热器上方的散热器组件，以及与散热器和散热器组件连接的第一和第二热管。第一和第二热管中的每一个包括接合在散热器中的蒸发部分，热插入散热器组件中的两个弧形冷凝部分和互连相应的冷凝部分和蒸发部分的两个连接部分。冷凝段彼此共面并且位于同一个圆中。第一热管的冷凝部沿顺时针方向延伸，第二热管的冷凝部沿逆时针方向延伸。

25. 发明授权

US07990719B2 Electronic system with heat dissipation device 有权
标题翻译：具有散热装置的电子系统
公开(公告)号：US07990719B2
公开(公告)日：2011-08-02
申请号：US12610388
申请日：2009-11-02
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20154
摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
摘要翻译：散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。电子元件具有不同的高度。所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

26. 发明授权

US07866375B2 Heat dissipation device with heat pipes 有权
标题翻译：带热管的散热装置
公开(公告)号：US07866375B2
公开(公告)日：2011-01-11
申请号：US11566003
申请日：2006-12-01
申请人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
发明人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
IPC分类号： F28D15/00 , F28F7/00 , H01L23/24 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
摘要翻译：一种散热装置，包括底座（10），多个翅片（20），第一和第二热管（30），（40），风扇架（50）和固定到风扇架的风扇（60）。第一热管包括受热部（32）和两个散热部（34）。第二热管包括蒸发部分（42）和两个冷凝部分（44）。第二热管的冷凝部分延伸到翅片中并且与每个翅片的相对端相邻设置。一个放热部分在翅片中延伸并且设置在冷凝部分之间，从而允许从基座吸收的热量通过散热部分和冷凝部分均匀分布在整个翅片上。

27. 发明申请

US20100155023A1 HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN 审中-公开
标题翻译：具有其中的热管的散热装置
公开(公告)号：US20100155023A1
公开(公告)日：2010-06-24
申请号：US12423816
申请日：2009-04-15
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： F28D15/0233 , F28D15/0266 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan.
摘要翻译：散热装置包括底座，基座上的散热器，热连接底座和散热器的两个热管和安装在散热器中的风扇。散热器包括放置在基座上的第一翅片组和位于第一翅片组上的第二翅片组。每个热管包括连接到基座的蒸发部分，冷凝部分和互连蒸发部分和冷凝部分的绝热部分。热管的冷凝部分夹在第一和第二翅片组之间并围绕风扇。

28. 发明授权

US07493940B2 Heat dissipation device having mounting brackets 失效
标题翻译：具有安装支架的散热装置
公开(公告)号：US07493940B2
公开(公告)日：2009-02-24
申请号：US11309841
申请日：2006-10-10
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Li He , Peng Liu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Li He , Peng Liu
IPC分类号： F24H3/02 , F28F9/00 , H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.
摘要翻译：散热装置（100）包括散热片（10），散热片（10）具有多个散热片（14）和多个与散热片的翅片相互扣合的安装支架（20）。每个安装支架包括安装在散热器顶部的安装板（22）和从安装板的一侧延伸到散热器底部的挡板（26）。挡板终止于保持板（28）。多个紧固件（50）延伸穿过保持板以将散热装置安装到印刷电路板上。自攻螺钉（40）用于延伸通过风扇和安装支架的安装板，并与翅片螺纹接合，从而将风扇安装在散热器上。

29. 发明授权

US07382047B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07382047B2
公开(公告)日：2008-06-03
申请号：US11306412
申请日：2005-12-27
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H01L23/10 , B23P6/00 , F28F27/00 , H01B7/42
CPC分类号： F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.
摘要翻译：散热装置（1）包括散热器（10），风扇（20）和冷却构件（30）。散热器包括基座，从基座延伸的多个翅片和至少一个热连接底座和翅片的热管。冷却件在其上设置有翅片组件，并且包括附接到翅片的一侧的冷表面和至少一个热管的冷凝部分，以使翅片的一侧和冷凝部分具有较低的温度。

30. 发明申请

US20070263358A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070263358A1
公开(公告)日：2007-11-15
申请号：US11308847
申请日：2006-05-15
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/467 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.
摘要翻译：散热装置包括与中央处理单元接触的主散热器（10）和附接在与中央处理单元相邻的发热电子元件上的二次散热器（20）。主散热器包括设置在基座中间的基座（12）和散热部分（14）。二次散热器包括基板（22）和布置在基板上的多个翅片组件（24）。底座被放置在基板上，翅片组件布置在散热部分周围。主散热器部分地叠置在具有紧凑结构的二次散热器上。散热部分可以同时从中央处理单元及其相邻的发热电子元件散热。

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