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    • 21. 发明申请
    • Power supply sense circuit, power supply system and integrated circuit
    • 电源检测电路,电源系统和集成电路
    • US20070273353A1
    • 2007-11-29
    • US11520733
    • 2006-09-14
    • Koji Okamoto
    • Koji Okamoto
    • H02M5/257
    • G01R19/16552G01R31/3004
    • The present invention relates to a technique capable of reliably detecting supply voltages at a plurality of points in an integrated circuit with a simple arrangement and improving the setting accuracy of a supply voltage to the integrated circuit irrespective of position in the interior of the integrated circuit. The integrated circuit internally includes a plurality of voltage sense points, a selection circuit connected to each of the plurality of voltage sense points for selecting one of the plurality of voltage sense points on the basis of an input signal, and a voltage sense terminal connected to the selection circuit for outputting a voltage of the one voltage sense point, selected by the selection circuit, to the exterior of the integrated circuit.
    • 本发明涉及一种能够以简单的布置可靠地检测集成电路中的多个点处的电源电压的技术,并且提高了对集成电路的电源电压的设置精度,而与集成电路内部的位置无关。 集成电路内部包括多个电压检测点,连接到多个电压检测点中的每一个的选择电路,用于基于输入信号选择多个电压检测点中的一个,以及连接到 所述选择电路用于将由所述选择电路选择的所述一个电压检测点的电压输出到所述集成电路的外部。
    • 24. 发明授权
    • Method and apparatus for applying a protecting film to a semiconductor wafer
    • 将保护膜施加到半导体晶片的方法和装置
    • US06258198B1
    • 2001-07-10
    • US09481998
    • 2000-01-11
    • Hiroshi SaitoTsuyoshi KuritaKoji Okamoto
    • Hiroshi SaitoTsuyoshi KuritaKoji Okamoto
    • B32B3100
    • H01L21/67132H01L21/67092Y10T156/1057Y10T156/108Y10T156/1343Y10T156/1734
    • In an apparatus and method of applying a protecting film to a semiconductor wafer, a semiconductor wafer is placed on top of a table, a protecting film is pressed onto the wafer by a press roller biased toward the table, the table is moved to apply the protecting film to the wafer, a tension roller arranged upstream from the press roller applies a tensile force to the protecting film in a direction opposite the feeding direction of the film, the tensile force of the tension roller is first set at a relatively high value at the beginning of the application of the protecting film to place the protecting film in a stretched state and then at a relatively small value during the application of the protecting film to prevent the portion of the protecting film which has not yet been applied from coming into contact with the wafer, and then, after the protecting film has been applied to the wafer, a cutting blade is used to cut the protecting film to match the shape of the semiconductor wafer by first moving the cutting blade in the Y direction to cut from an angular portion C1 of the orientation flat portion to an angular portion C2, then rotating the table while moving the cutter and the table to align the cutting direction of the cutting blade with the tangential direction of the circumferential portion of the semiconductor wafer, and then rotating the table to cut the protecting film along the circumferential portion of the semiconductor wafer.
    • 在将保护膜施加到半导体晶片的装置和方法中,将半导体晶片放置在工作台的顶部,通过偏压于工作台的压辊将保护膜压在晶片上,使工作台移动 将保护膜保护到晶片上,布置在压辊上游的张力辊在与膜的进给方向相反的方向上对保护膜施加张力,拉伸辊的张力首先设定在相对较高的值 开始使用保护膜以将保护膜置于拉伸状态,然后在施加保护膜期间以相对较小的值,以防止尚未施加的保护膜的部分接触 然后在将保护膜施加到晶片之后,使用切割刀来切割保护膜以匹配半导体晶片的形状 通过首先沿Y方向移动切割刀片以从定向平坦部分的角度部分C1切割成角度部分C2,然后在移动切割器和台面的同时旋转工作台以使切割刀片的切割方向与 半导体晶片的周向部分的切线方向,然后旋转工作台以沿着半导体晶片的圆周部分切割保护膜。
    • 26. 发明授权
    • Protective panel having touch panel function
    • 保护面板具有触摸屏功能
    • US08279188B2
    • 2012-10-02
    • US12521922
    • 2007-12-18
    • Yasuji KusudaTakao HashimotoToshiyuki IwaiKoji OkamotoJun Shimizu
    • Yasuji KusudaTakao HashimotoToshiyuki IwaiKoji OkamotoJun Shimizu
    • G06F3/041
    • G06F3/041G06F3/045
    • A protective panel having touch panel function is used for protecting a front surface of a display device that is disposed so as to be visually recognized from outside, and the protective panel is fitted in a panel fitting part of a casing provided with an opening such that an outer surface of the protective panel forms a flat plane identical with that of the casing with no gap formed therebetween. The protective panel includes: an upper electrode sheet having a decorative layer and upper electrodes provided thereon; and a lower electrode sheet having lower electrodes provided on an upper surface thereof, and the upper electrode sheet and the lower electrode sheet are disposed such that the respective electrodes thereof face with each other. On a lower surface of the upper electrode sheet, at a non-electrode part not provided with the upper electrodes, there is provided a height difference adjustment part that has a thickness substantially equal to each of those of the upper electrodes, and the height difference adjustment part is provided such that short circuit is prevented with the upper electrodes as well as with the lower electrodes.
    • 具有触摸面板功能的保护面板用于保护被设置为从外部被视觉识别的显示装置的前表面,并且保护面板装配在设置有开口的壳体的面板装配部分中,使得 保护面板的外表面形成与壳体相同的平面,其间形成有间隙。 保护面板包括:具有装饰层的上电极片和设置在其上的上电极; 以及设置在其上表面上的具有下电极的下电极片,并且上电极片和下电极片被布置成使得它们的各个电极彼此面对。 在上部电极片的下表面上,在不设置上部电极的非电极部上设置有高度差调整部,其厚度与上部电极的厚度基本相同,高度差 提供调节部件,以便与上电极以及下电极一起防止短路。
    • 28. 发明授权
    • Method for producing gold colloid and gold colloid
    • 金胶体和金胶体的生产方法
    • US08048193B2
    • 2011-11-01
    • US12298313
    • 2007-05-29
    • Junichi TaniuchiHirofumi NakagawaKoji Okamoto
    • Junichi TaniuchiHirofumi NakagawaKoji Okamoto
    • B22F9/24
    • B01J13/0043B22F1/0022B22F9/24B82Y30/00Y10S977/896
    • It is an object of the present invention to provide a method for producing gold colloid having a targeted particle size, a sharp particle size distribution and a uniform and perfect spherical shape. The present invention relates to a method for producing gold colloid including a nucleation step of forming nuclear colloidal particles by adding a first reducing agent to a first gold salt solution; and a growth step of growing nuclear colloid by adding a second gold salt and a second reducing agent to the solution of the nuclear colloidal particles, characterized in that the growth step is performed at least once; a citrate is used as the first reducing agent and an ascorbate is used as the second reducing agent; and the addition of the ascorbate in the growth step is performed simultaneously with addition of the second gold salt. According to the method for producing gold colloid of the present invention, gold colloid having a sharp particle size distribution and a uniform and perfect spherical shape can be obtained.
    • 本发明的目的是提供一种具有目标粒度,尖锐的粒度分布和均匀且完美的球形形状的金胶体的制造方法。 本发明涉及一种生产金胶体的方法,包括通过向第一金盐溶液中加入第一还原剂形成核胶体颗粒的成核步骤; 以及通过向核胶体粒子的溶液中添加第二金盐和第二还原剂来生长核胶体的生长步骤,其特征在于,所述生长步骤至少进行一次; 使用柠檬酸盐作为第一还原剂,使用抗坏血酸作为第二还原剂; 并且在添加第二金盐的同时进行生长步骤中的抗坏血酸盐的添加。 根据本发明的金胶体的制造方法,可以获得具有尖锐的粒度分布和均匀且完美的球形的金胶体。