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    • 23. 发明申请
    • DATA STATE-BASED TEMPERATURE COMPENSATION DURING SENSING IN NON-VOLATILE MEMORY
    • 在非易失性存储器中感测期间基于数据状态的温度补偿
    • WO2010033409A1
    • 2010-03-25
    • PCT/US2009/056405
    • 2009-09-09
    • SANDISK CORPORATIONDUNGA, Mohan, V.HIGASHITANI, Masaaki
    • DUNGA, Mohan, V.HIGASHITANI, Masaaki
    • G11C11/56G11C16/26
    • G11C11/5642G11C7/04G11C16/26
    • Temperature effects in a non-volatile storage device are addressed by providing a data state-dependent, and optionally temperature dependent, sense current during verify and read operations. A different sense current (1) is provided for each data state (2), so that a common temperature coefficient (3) is realized for storage elements with different data states. The temperature coefficient for higher states can be reduced to that of lower states. During sensing, a sense time can be adjusted to achieve a desired sense current when a selected storage element is in a conductive state. A fixed voltage trip point may be maintained. During the sense time, a pre-charged capacitor discharges into a selected storage element such as via a bit line and NAND string, when the selected storage element is in a conductive state. The discharge level is translated to a current which is compared to a state-dependent, and optionally temperature dependent, reference current.
    • 通过在验证和读取操作期间提供数据状态相关的和可选的与温度相关的感测电流来解决非易失性存储设备中的温度效应。 为每个数据状态(2)提供不同的感测电流(1),使得对于具有不同数据状态的存储元件实现共同的温度系数(3)。 较高状态的温度系数可以降低到较低的状态。 在感测期间,当所选择的存储元件处于导通状态时,可以调整感测时间以实现期望的感测电流。 可以保持固定的电压跳变点。 在感测时间期间,当所选存储元件处于导通状态时,预充电电容器通过位线和NAND串放电到选定的存储元件中。 将放电电平转换为与状态相关的,并且可选地与温度相关的参考电流进行比较的电流。
    • 29. 发明申请
    • INTEGRATED NON-VOLATILE MEMORY AND PERIPHERAL CIRCUITRY FABRICATION
    • 集成的非易失性存储器和外围电路制造
    • WO2008122012A2
    • 2008-10-09
    • PCT/US2008/059035
    • 2008-04-01
    • SANDISK CORPORATIONKAI, JamesPHAM, TuanHIGASHITANI, MasaakiMATAMIS, GeorgeORIMOTO, Takashi
    • KAI, JamesPHAM, TuanHIGASHITANI, MasaakiMATAMIS, GeorgeORIMOTO, Takashi
    • H01L21/8247H01L27/105H01L27/115
    • H01L27/11529H01L27/105H01L27/115H01L27/11526H01L27/11536H01L27/11539
    • Non-volatile memory and integrated memory and peripheral circuitry fabrication processes are provided. Sets of charge storage regions, such as NAND strings including multiple non-volatile storage elements, are formed over a semiconductor substrate using a layer of charge storage material such as a first layer of polysilicon. An intermediate dielectric layer is provided over the charge storage regions. A layer of conductive material such as a second layer of polysilicon is deposited over the substrate and etched to form the control gates for the charge storage regions and the gate regions of the select transistors for the sets of storage elements. The first layer of polysilicon is removed from a portion of the substrate, facilitating fabrication of the select transistor gate regions from only the second layer of polysilicon. Peripheral circuitry formation is also incorporated into the fabrication process to form the gate regions for devices such as high voltage and logic transistors. The gate regions of these devices can be formed from the layer forming the control gates of the memory array.
    • 提供非易失性存储器和集成存储器和外围电路制造工艺。 使用诸如第一多晶硅层的电荷存储材料层在半导体衬底上形成诸如包括多个非易失性存储元件的NAND串的电荷存储区的集合。 中间电介质层设置在电荷存储区域的上方。 将诸如第二多晶硅层的导电材料层沉积在衬底上并被蚀刻以形成用于存储元件组的选择晶体管的电荷存储区域和栅极区域的控制栅极。 从衬底的一部分去除第一层多晶硅,便于仅从第二层多晶硅制造选择晶体管栅极区。 外围电路形成也被并入到制造过程中以形成诸如高电压和逻辑晶体管的器件的栅极区域。 这些器件的栅极区域可以由形成存储器阵列的控制栅极的层形成。