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    • 21. 发明申请
    • PACKAGE CONFIGURATIONS FOR LOW EMI CIRCUITS
    • 低EMI电路的封装配置
    • US20110101466A1
    • 2011-05-05
    • US12611018
    • 2009-11-02
    • Yifeng Wu
    • Yifeng Wu
    • H01L27/088H01L29/78
    • H01L21/4803H01L21/4814H01L21/4871H01L21/77H01L23/057H01L23/36H01L25/072H01L25/115H01L27/0248H01L2224/48091H01L2924/13055H01L2924/13091H01L2924/30107H01L2924/00014H01L2924/00
    • An electronic component includes a high voltage switching transistor encased in a package. The high voltage switching transistor comprises a source electrode, a gate electrode, and a drain electrode all on a first side of the high voltage switching transistor. The source electrode is electrically connected to a conducting structural portion of the package. Assemblies using the abovementioned transistor with another transistor can be formed, where the source of one transistor can be electrically connected to a conducting structural portion of a package containing the transistor and a drain of the second transistor is electrically connected to the second conductive structural portion of a package that houses the second transistor. Alternatively, the source of the second transistor is electrically isolated from its conductive structural portion, and the drain of the second transistor is electrically isolated from its conductive structural portion.
    • 电子部件包括封装在封装中的高压开关晶体管。 高电压开关晶体管包括全部在高压开关晶体管的第一侧上的源电极,栅电极和漏电极。 源电极电连接到封装的导电结构部分。 可以形成使用上述晶体管与另一晶体管的组件,其中一个晶体管的源极可以电连接到包含晶体管的封装的导电结构部分,并且第二晶体管的漏极电连接到第二导体结构部分的第二导电结构部分 一个容纳第二个晶体管的封装。 或者,第二晶体管的源极与其导电结构部分电隔离,并且第二晶体管的漏极与其导电结构部分电隔离。
    • 22. 发明授权
    • Image processing system and method
    • 图像处理系统和方法
    • US07929161B2
    • 2011-04-19
    • US10825452
    • 2004-04-15
    • Yifeng WuKevin R. Hudson
    • Yifeng WuKevin R. Hudson
    • G06F3/12G06K9/00
    • H04N1/32502G06F3/1208G06F3/1263G06F3/1285H04N1/32523H04N1/3255
    • A printing control system includes a plurality of printing units, an image source, and a system processing unit. The image source provides a print job comprising a plurality of images to the system processing unit. The system processing unit receives the plurality of images in the print job from the image source, and calculates an image histogram for each image in the print job. The system processing unit then determines the similarity of the images in the print job by comparing the calculated histograms. The system processing unit then classifies the images into classes based on the comparison, and sends the classes of images to the printing units.
    • 打印控制系统包括多个打印单元,图像源和系统处理单元。 图像源向系统处理单元提供包括多个图像的打印作业。 系统处理单元从图像源接收打印作业中的多个图像,并计算打印作业中每个图像的图像直方图。 然后,系统处理单元通过比较计算的直方图来确定打印作业中图像的相似性。 然后,系统处理单元基于比较将图像分类为类,并将图像的类别发送到打印单元。
    • 24. 发明授权
    • High voltage GaN transistors
    • 高压GaN晶体管
    • US07692263B2
    • 2010-04-06
    • US11603427
    • 2006-11-21
    • Yifeng WuPrimit ParikhUmesh Mishra
    • Yifeng WuPrimit ParikhUmesh Mishra
    • H01L29/93
    • H01L29/7787H01L29/2003H01L29/404H01L29/66462H01L29/7786
    • A multiple field plate transistor includes an active region, with a source, a drain, and a gate. A first spacer layer is over the active region between the source and the gate and a second spacer layer over the active region between the drain and the gate. A first field plate on the first spacer layer is connected to the gate. A second field plate on the second spacer layer is connected to the gate. A third spacer layer is on the first spacer layer, the second spacer layer, the first field plate, the gate, and the second field plate, with a third field plate on the third spacer layer and connected to the source. The transistor exhibits a blocking voltage of at least 600 Volts while supporting a current of at least 2 Amps with an on resistance of no more than 5.0 mΩ-cm2, of at least 600 Volts while supporting a current of at least 3 Amps with an on resistance of no more than 5.3 mΩ-cm2, of at least 900 Volts while supporting a current of at least 2 Amps with an on resistance of no more than 6.6 mΩ-cm2, or a blocking voltage of at least 900 Volts while supporting a current of at least 3 Amps with an on resistance of no more than 7.0 mΩ-cm2.
    • 多场板晶体管包括有源区,源极,漏极和栅极。 第一间隔层在源极和栅极之间的有源区上方,并且在漏极和栅极之间的有源区上方具有第二间隔层。 第一间隔层上的第一场板连接到栅极。 第二间隔层上的第二场板连接到栅极。 第三间隔层位于第一间隔层,第二间隔层,第一场板,栅极和第二场板上,在第三间隔层上具有第三场板并连接到源极。 晶体管表现出至少600伏特的阻断电压,同时支持至少2安培的电流,其导通电阻不超过5.0mΩ(OHgr·-cm2)为至少600伏,同时支持至少3安培的电流 耐电压不超过5.3mΩ,OHgr--cm2,至少900V,同时支持至少2安培的电流,导通电阻不超过6.6mΩ,OHgr-cm2,或阻断电压至少为900V,同时 支持至少3安培的电流,导通电阻不超过7.0mΩ,OHgr; -cm2。
    • 26. 发明申请
    • INSULATING GATE AlGaN/GaN HEMT
    • 绝缘栅AlGaN / GaN HEMT
    • US20090315078A1
    • 2009-12-24
    • US12554803
    • 2009-09-04
    • Primit ParikhUmesh MishraYifeng Wu
    • Primit ParikhUmesh MishraYifeng Wu
    • H01L29/778H01L29/06H01L29/772H01L29/12
    • H01L29/7787H01L23/291H01L23/3171H01L29/2003H01L29/432H01L29/517H01L29/518H01L29/7783H01L29/7786H01L2924/0002H01L2924/00
    • AlGaN/GaN HEMTs are disclosed having a thin AlGaN layer to reduce trapping and also having additional layers to reduce gate leakage and increase the maximum drive current. One HEMT according to the present invention comprises a high resistivity semiconductor layer with a barrier semiconductor layer on it. The barrier layer has a wider bandgap than the high resistivity layer and a 2DEG forms between the layers. Source and drain contacts contact the barrier layer, with part of the surface of the barrier layer uncovered by the contacts. An insulating layer is included on the uncovered surface of the barrier layer and a gate contact is included on the insulating layer. The insulating layer forms a barrier to gate leakage current and also helps to increase the HEMT's maximum current drive. The invention also includes methods for fabricating HEMTs according to the present invention. In one method, the HEMT and its insulating layer are fabricated using metal-organic chemical vapor deposition (MOCVD). In another method the insulating layer is sputtered onto the top surface of the HEMT in a sputtering chamber.
    • 公开了具有薄AlGaN层的AlGaN / GaN HEMT以减少陷阱并且还具有附加层以减少栅极泄漏并增加最大驱动电流。 根据本发明的一个HEMT包括其上具有阻挡半导体层的高电阻率半导体层。 阻挡层具有比高电阻率层更宽的带隙,并且层之间形成2DEG。 源极和漏极触点接触阻挡层,阻挡层的一部分表面被触点覆盖。 绝缘层包括在阻挡层的未覆盖表面上,并且绝缘层上包括栅极接触。 绝缘层对栅极漏电流形成屏障,也有助于增加HEMT的最大电流驱动。 本发明还包括用于制造根据本发明的HEMT的方法。 在一种方法中,HEMT及其绝缘层使用金属有机化学气相沉积(MOCVD)制造。 在另一种方法中,在溅射室中将绝缘层溅射到HEMT的顶表面上。
    • 27. 发明申请
    • LED Fabrication via Ion Implant Isolation
    • 通过离子植入隔离制造LED
    • US20090309124A1
    • 2009-12-17
    • US12507288
    • 2009-07-22
    • Yifeng WuGerald H. NegleyDavid B. Slater, JR.Valeri F. TsvetkovAlexander Suvorov
    • Yifeng WuGerald H. NegleyDavid B. Slater, JR.Valeri F. TsvetkovAlexander Suvorov
    • H01L33/00
    • H01L33/32H01L33/305
    • A semiconductor light emitting diode includes a semiconductor substrate, an epitaxial layer of n-type Group III nitride on the substrate, a p-type epitaxial layer of Group III nitride on the n-type epitaxial layer and forming a p-n junction with the n-type layer, and a resistive gallium nitride region on the n-type epitaxial layer and adjacent the p-type epitaxial layer for electrically isolating portions of the p-n junction. A metal contact layer is formed on the p-type epitaxial layer. In method embodiments disclosed, the resistive gallium nitride border is formed by forming an implant mask on the p-type epitaxial region and implanting ions into portions of the p-type epitaxial region to render portions of the p-type epitaxial region semi-insulating. A photoresist mask or a sufficiently thick metal layer may be used as the implant mask.
    • 半导体发光二极管包括半导体衬底,衬底上的n型III族氮化物的外延层,n型外延层上的III族氮化物的p型外延层,并与n型外延层形成pn结, 型层和n型外延层上的电阻性氮化镓区,并且邻近p型外延层,用于电隔离pn结的部分。 在p型外延层上形成金属接触层。 在公开的方法实施例中,通过在p型外延区上形成注入掩模并将离子注入到p型外延区的一部分中以形成半绝缘的p型外延区的部分来形成电阻性氮化镓边界。 可以使用光致抗蚀剂掩模或足够厚的金属层作为植入物掩模。
    • 28. 发明申请
    • High efficiency AC LED driver circuit
    • 高效率交流LED驱动电路
    • US20080252229A1
    • 2008-10-16
    • US11786907
    • 2007-04-13
    • Yifeng Wu
    • Yifeng Wu
    • H05B37/00
    • H05B33/0803H05B33/0809Y02B20/342
    • In an AC drive circuit for LEDs, a current limiting capacitor connects to an AC source, a first circuit portion, including a first rectifying diode and a first power capacitor, connects between the current limiting capacitor and the source and a second circuit portion, including a second rectifying diode in series with a second power capacitor, is in parallel with the first circuit portion. A first LED is in the first circuit portion in parallel with the first power capacitor, while a second LED in the second circuit portion is in parallel with the second power capacitor. During positive half cycles, the first rectifying diode charges the first power capacitor and drives the first LED. During negative half cycles, the second rectifying diode charges the second power capacitor and drives the second LED.
    • 在用于LED的AC驱动电路中,限流电容器连接到AC电源,包括第一整流二极管和第一功率电容器的第一电路部分连接在限流电容器和源极之间以及第二电路部分,包括 与第二电力电容器串联的第二整流二极管与第一电路部分并联。 第一LED与第一电力电容器并联在第一电路部分中,而第二电路部分中的第二LED与第二功率电容器并联。 在正半周期期间,第一整流二极管对第一功率电容器充电并驱动第一LED。 在负半周期期间,第二整流二极管对第二功率电容器充电并驱动第二LED。
    • 30. 发明申请
    • GaN based HEMTs with buried field plates
    • 具有掩埋场板的GaN基HEMT
    • US20080128752A1
    • 2008-06-05
    • US11901103
    • 2007-09-13
    • Yifeng Wu
    • Yifeng Wu
    • H01L29/205
    • H01L29/778H01L29/2003H01L29/402H01L29/42316H01L29/66462H01L29/7786H01L29/7787H01L29/8128
    • A transistor comprising an active region, with source and drain electrodes formed in contact with the active region and a gate formed between the source and drain electrodes and in contact with the active region. A first spacer layer is on at least part of the surface of the active region between the gate and the drain electrode and between the gate and the source electrode. The gate comprises a generally t-shaped top portion that extends toward the source and drain electrodes. A field plate is on the spacer layer and under the overhand of at least one section of the gate top portion. The field plate is at least partially covered by a second spacer layer, with the second spacer layer on at least part of the surface of the first active layer and between the gate and the drain and between the gate and the source. At least one conductive path electrically connects the field plate to the source electrode or the gate.
    • 一种晶体管,包括有源区,源极和漏极形成为与有源区接触,栅极形成在源极和漏极之间并与有源区接触。 第一间隔层位于栅极和漏电极之间以及栅极和源电极之间的有源区的表面的至少一部分上。 栅极包括朝向源极和漏极延伸的大致t形的顶部部分。 场板位于间隔层上并且在栅极顶部的至少一个部分的下方。 场板至少部分地被第二间隔层覆盖,其中第二间隔层位于第一有源层的至少部分表面上,并且在栅极和漏极之间以及栅极和源极之间。 至少一个导电路径将场板电连接到源电极或栅极。