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21. 发明授权

US4152011A Characteristic compensating device for air springs for automotive suspension use 失效
标题翻译：用于汽车悬架使用的空气弹簧的特征补偿装置
公开(公告)号：US4152011A
公开(公告)日：1979-05-01
申请号：US839121
申请日：1977-10-03
申请人： Shoichi Sano , Noriyuki Takahashi , Goro Urushiyama , Seiji Kasai , Toshihiko Aoyama , Tokuro Takaoka
发明人： Shoichi Sano , Noriyuki Takahashi , Goro Urushiyama , Seiji Kasai , Toshihiko Aoyama , Tokuro Takaoka
IPC分类号： B60G11/64 , B60G7/04 , B60G17/02 , B60G21/04 , B60G21/055 , B60G11/18
CPC分类号： B60G21/0551 , B60G17/025 , B60G7/04
摘要： A device including a torsion bar rotatably mounted on the vehicle frame transversely thereof and a pair of rock arms extending integrally from the opposite ends of the torsion bar at right angles thereto and connected with a right and a left wheel, respectively. An abutment arm is fixed to the torsion bar at the middle thereof and engageable with a stop pad provided on the vehicle frame, when either or both of the wheels are moved down, to restrain further downward movement thereof. Thus, the spring rate of air springs associated with the respective wheels is in effect increased as the loads thereon are reduced, particularly in a lower load region.
摘要翻译：一种装置，包括横向地可转动地安装在车架上的扭力杆，以及一对岩石臂，它们分别从扭力杆的相对端部与其直角地一体地延伸，并与左右车轮连接。一个抵靠臂在其中间被固定到扭力杆上，当车轮中的任一个或两个都向下移动时，可以与设置在车架上的止动垫接合，以限制其进一步的向下运动。因此，与相应车轮相关联的空气弹簧的弹簧速率实际上随着其上的负载而减小，特别是在较低负载区域中。

22. 发明授权

US4092017A Pneumatic spring device 失效
标题翻译：气动弹簧装置
公开(公告)号：US4092017A
公开(公告)日：1978-05-30
申请号：US803286
申请日：1977-06-03
申请人： Goro Urushiyama , Noriyuki Takahashi
发明人： Goro Urushiyama , Noriyuki Takahashi
IPC分类号： B60G11/26 , F16F9/08
CPC分类号： B60G11/26 , F16F9/082 , B60G2206/4222
摘要： A diaphragm arranged in a rigid casing to define therein a chamber to be filled with a mass of gaseous spring medium and another chamber to be held under oil pressure load is normally bulged into the oil chamber and formed on both surfaces thereof with dense clusters of elastic piles or projections which are compressed against each other only when the diaphragm is displaced from its neutral position to the load side as the load is reduced. Such displacement of the diaphragm is resisted by the elastic projections so as to increase the spring constant of the device in the lower load region and, with the device, used as a spring for automotive suspension, the pitching and rolling movements of the vehicle body are minimized.
摘要翻译：布置在刚性壳体中的膜片在其中限定有填充有大量气态弹簧介质的腔室和待保持在油压负载下的另一腔室通常凸起到油室中，并在其两个表面上形成致密的弹性簇只有当负载减小时隔膜从其中立位置移动到负载侧时，彼此压缩的桩或突起。膜片的这种位移被弹性突起抵抗，以便增加装置在较低载荷区域的弹簧常数，并且该装置用作用于汽车悬架的弹簧，车身的俯仰和滚动运动是最小化。

23. 发明申请

US20120097523A1 METHOD AND SYSTEM FOR PURIFYING SILICON 审中-公开
标题翻译：用于净化硅的方法和系统
公开(公告)号：US20120097523A1
公开(公告)日：2012-04-26
申请号：US13266631
申请日：2010-04-27
申请人： Nobuyuki Mori , Hiroshi Yano , Toshiyuki Shiroishi , Takashi Ushida , Nobuhiro Shimizu , Noriyuki Takahashi , Toshihiro Mitsuzuka
发明人： Nobuyuki Mori , Hiroshi Yano , Toshiyuki Shiroishi , Takashi Ushida , Nobuhiro Shimizu , Noriyuki Takahashi , Toshihiro Mitsuzuka
IPC分类号： C01B33/037 , B01J19/08
CPC分类号： C01B33/037
摘要： [Objects] To improve productivity and reduce thermal energy consumption in manufacturing of high purity silicon as a raw material for metallurgical grade pure silicon.[Means to Solve]After conducting a first treatment of either removing boron by water-vapor added plasma arc heating or low-pressure oxygen plasma arc heating upon raw silicon contained in a hearth in a chamber to thereby putting the raw silicon into a high temperature molten state to thereby oxidizing and removing boron by evaporation, or removing phosphorus by electron beam irradiation to thereby putting the raw silicon into a high temperature molten state to thereby remove phosphorus by evaporation in an atmosphere suitable to the treatment; the atmosphere of the chamber is then changed to a vacuum atmosphere suitable to the remaining second treatment, while maintaining the silicon contained in the hearth in its molten state, and the second purification treatment is conducted; whereafter end(s) enriched in impurities is cut off by way of one-way coagulation method to obtain a high purity refined silicon ingot highly free from phosphorus, boron and other impurities.
摘要翻译： [对象]提高生产率，降低冶金级纯硅原料的高纯度硅制造中的热能消耗。 [解决方法]在室内的原料硅中，通过水蒸汽添加等离子体电弧加热或低压氧等离子体电弧加热进行第一次处理之后，将原料硅置于高温从而通过蒸发氧化和除去硼，或通过电子束照射除去磷，从而将原料硅置于高温熔融状态，从而通过在适于处理的气氛中蒸发除去磷; 然后将室的气氛变成适合于剩余的第二处理的真空气氛，同时将包含在炉床中的硅保持在其熔融状态，并且进行第二净化处理; 然后通过单向凝结法切断富集杂质的末端，得到高度无磷，硼等杂质的高纯度精制硅锭。

24. 发明授权

US07847388B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07847388B2
公开(公告)日：2010-12-07
申请号：US12537124
申请日：2009-08-06
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： H01L23/02
CPC分类号： H01L21/78 , G01R1/0483 , G01R31/2863 , G01R31/2886 , H01L23/3114 , H01L23/3171 , H01L23/585 , H01L29/0657 , H01L2224/0401 , H01L2224/05569 , H01L2224/05572 , H01L2224/13022 , H01L2224/16 , H01L2924/00014 , H01L2924/0002 , H01L2924/01079 , H01L2924/10253 , H01L2924/00 , H01L2224/05552
摘要： Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping.
摘要翻译：要防止半导体芯片的碎裂。半导体器件包括具有主表面的半导体芯片，在主表面上形成的多个焊盘，在主表面上形成的改变布线以改变多个焊盘的布置的重排布线，以及形成在多个焊盘上的保护膜和绝缘膜主表面和多个焊料凸块，每个焊料凸块连接到重排布线并且与多个焊盘不同的布置。形成在半导体芯片的主表面的周边上的与主表面倾斜连续的斜切面的存在防止了切屑。

25. 发明授权

US07579216B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07579216B2
公开(公告)日：2009-08-25
申请号：US12118752
申请日：2008-05-12
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/58
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译：一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个托盘，并且分别从托盘传送半导体器件。由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

26. 发明授权

US07481186B2 Engine with cooling water passage formed inside crank case 有权
标题翻译：发动机在曲轴箱内形成冷却水通道
公开(公告)号：US07481186B2
公开(公告)日：2009-01-27
申请号：US11674016
申请日：2007-02-12
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： F01P3/20 , F01P11/04 , F02F7/00
CPC分类号： F01P5/10 , F01M1/02 , F01P11/04 , F01P2050/16 , F02B61/02 , F02B75/22 , F02F7/007
摘要： A cooling water structure for an engine with improved external appearance and reduced cost. A first passage section of a cooling water passage discharges cooling water from a water pump to water jackets of front and rear cylinders. The first passage section is formed in a surface of a partition wall of a right case that is an inside wall surface of a crank case. The water pump is accommodated with the first passage section in a crank chamber of the crank case.
摘要翻译：用于发动机的冷却水结构，具有改善的外观和降低的成本。冷却水通道的第一通道部分将冷却水从水泵排放到前缸和后缸的水套上。第一通道部分形成在作为曲轴箱的内壁表面的右壳体的分隔壁的表面中。水泵容纳有曲柄箱的曲柄室中的第一通道部分。

27. 发明授权

US4087969A Hydraulic speed change gear having an automatic pressure control device 失效
标题翻译：具有自动压力控制装置的液压变速齿轮
公开(公告)号：US4087969A
公开(公告)日：1978-05-09
申请号：US775322
申请日：1977-03-07
申请人： Noriyuki Takahashi , Masao Nishikawa
发明人： Noriyuki Takahashi , Masao Nishikawa
IPC分类号： B62D11/18 , F16H39/02 , F16H61/40 , F16H61/4008 , F16H61/4035 , F16H61/4052 , F16H61/4139 , F15B9/14 , F15B11/16
CPC分类号： F16H61/4078 , B62D11/18 , F16H39/02 , F16H61/4026 , F16H61/4139 , F16H61/421 , F16H61/46
摘要： A hydraulic speed change gear designed to automatically control its hydraulic circuit pressure to be held at all times at a substantially constant level irrespective of the loading condition so as to enable the pressure oil in the hydraulic circuit to be used as a pressure source for other various hydraulic equipment. To this end, the gear includes a fixed displacement hydraulic pump adapted to be driven by an input shaft, a variable displacement hydraulic motor having an output shaft, a closed hydraulic circuit connecting between said pump and said motor, a hydraulic supply pump drivably coupled to said input shaft, a supply passage connected with a discharge port of said supply pump and with said closed hydraulic circuit through check valves, and an oil pressure control device connected with said closed hydraulic circuit and said supply passage for reducing the oil pressure in said supply passage in proportion to a pressure rise in said closed hydraulic circuit.
摘要翻译：一种液压变速齿轮，被设计成自动控制其液压回路压力，始终保持在基本上恒定的水平，无论装载状况如何，以使液压回路中的压力油能够用作其它各种压力源液压设备。为此，齿轮包括适于由输入轴驱动的固定排量液压泵，具有输出轴的可变排量液压马达，连接在所述泵和所述马达之间的闭合液压回路，可驱动地连接到所述输入轴，与所述供给泵的排出口连接的供给通道和通过止回阀的所述闭合液压回路;以及与所述闭合液压回路和所述供给通路连接的油压控制装置，用于降低所述供给的油压与所述封闭液压回路中的压力升高成比例地流动。

28. 外观设计

USD704694S1 Digital audio disc player for automobile 有权
公开(公告)号：USD704694S1
公开(公告)日：2014-05-13
申请号：US29428487
申请日：2012-07-31
申请人： Noriyuki Takahashi
设计人： Noriyuki Takahashi

29. 发明授权

US08368191B2 Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US08368191B2
公开(公告)日：2013-02-05
申请号：US12954876
申请日：2010-11-28
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/4952 , H01L23/49541 , H01L23/49551 , H01L23/49558 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/291 , H01L2224/2919 , H01L2224/29339 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48647 , H01L2224/49052 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/78743 , H01L2224/83102 , H01L2224/83192 , H01L2224/8385 , H01L2224/85181 , H01L2224/85447 , H01L2224/92125 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/48465 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device of a multi-pin structure using a lead frame is provided. The semiconductor device comprises a tab having a chip supporting surface, the chip supporting surface whose dimension is smaller than a back surface of a semiconductor chip, a plurality of leads arranged around the tab, the semiconductor chip mounted over the chip supporting surface of the tab, a plurality of suspending leads for supporting the tab, four bar leads arranged outside the tab so as to surround the tab and coupled to the suspending leads, a plurality of wires for coupling between the semiconductor chip and the leads, and a sealing body for sealing the semiconductor chip and the wires with resin, with first slits being formed respectively in first coupling portions of the bar leads for coupling with the suspending leads.
摘要翻译：提供了使用引线框的多引脚结构的半导体器件。半导体器件包括具有芯片支撑表面的突片，尺寸小于半导体芯片的背面的芯片支撑表面，布置在突片周围的多个引线，安装在突片的芯片支撑表面上的半导体芯片，用于支撑突片的多个悬挂引线，布置在突片外部的四个引脚，以围绕突片并耦合到悬挂引线，用于在半导体芯片和引线之间耦合的多条引线，以及用于用树脂密封半导体芯片和电线，其中第一狭缝分别形成在条引线的第一耦合部分中，用于与悬挂引线耦合。

30. 发明授权

US08063478B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08063478B2
公开(公告)日：2011-11-22
申请号：US12938275
申请日：2010-11-02
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： H01L23/02
CPC分类号： H01L21/78 , G01R1/0483 , G01R31/2863 , G01R31/2886 , H01L23/3114 , H01L23/3171 , H01L23/585 , H01L29/0657 , H01L2224/0401 , H01L2224/05569 , H01L2224/05572 , H01L2224/13022 , H01L2224/16 , H01L2924/00014 , H01L2924/0002 , H01L2924/01079 , H01L2924/10253 , H01L2924/00 , H01L2224/05552
摘要： Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping.
摘要翻译：要防止半导体芯片的碎裂。半导体器件包括具有主表面的半导体芯片，在主表面上形成的多个焊盘，在主表面上形成的改变布线以改变多个焊盘的布置的重排布线，以及形成在多个焊盘上的保护膜和绝缘膜主表面和多个焊料凸块，每个焊料凸块连接到重排布线并且与多个焊盘不同的布置。形成在半导体芯片的主表面的周边上的与主表面倾斜连续的斜切面的存在防止了切屑。

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