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    • 27. 发明专利
    • Method of manufacturing sheet for sealing optical semiconductor element
    • 用于密封光学半导体元件的制造方法
    • JP2011029668A
    • 2011-02-10
    • JP2010249894
    • 2010-11-08
    • Nitto Denko Corp日東電工株式会社
    • HARADA NORIAKISUEHIRO ICHIROHOTTA YUJIYOSHIMURA TAKUYA
    • H01L33/54H01L33/56H01L33/58
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a sheet for sealing an optical semiconductor element capable of obtaining a uniform white light with a high light extraction efficiency, and capable of efficiently manufacturing a thin optical semiconductor device. SOLUTION: The sheet for sealing the optical semiconductor element is constituted by laminating a plurality of resin layers, wherein one or more interfaces of each resin layer have an irregularity form. The method of manufacturing a sheet for sealing an optical semiconductor element includes a step of sticking a resin sheet not having the irregularity form and a resin sheet having the irregularity form, so that the irregularity form that the resin sheet having the irregularity form has is faced with the resin sheet not having the irregularity form. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种制造用于密封光学半导体元件的方法,该光学半导体元件能够以高的光提取效率获得均匀的白光,并且能够有效地制造薄的光学半导体器件。 解决方案:用于密封光学半导体元件的片材通过层叠多个树脂层而构成,其中每个树脂层的一个或多个界面具有不规则形式。 制造用于密封光半导体元件的片材的方法包括粘贴不均匀的树脂片和具有不规则形状的树脂片的步骤,使得具有不规则形式的树脂片的不规则形状面对 树脂片不具有不规则形式。 版权所有(C)2011,JPO&INPIT