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1. 发明专利

JP2015048504A アルカリ水電解用隔膜の製造方法およびアルカリ水電解用隔膜审中-公开
标题翻译：碱性水电解制备阻垢剂的制备方法及碱性水溶液阻隔剂
公开(公告)号：JP2015048504A
公开(公告)日：2015-03-16
申请号：JP2013180392
申请日：2013-08-30
申请人：日東電工株式会社 , Nitto Denko Corp
发明人： MURAKI YUZO , INOUE TAKEO , HIGUCHI HIROYUKI , KAWAGUCHI YOSHIHIDE , HARADA NORIAKI
IPC分类号： C25B13/08 , C08J9/26 , C25B1/10
CPC分类号： C08J9/26 , C08J2201/0464 , C08J2363/02 , C08J2471/02 , C25B1/04 , C25B13/08 , Y02E60/366
摘要：【課題】イオンの透過性および耐薬品性に優れ、かつ、電解時に電極で生成したガスが隔膜表面に付着し難いアルカリ水電解用隔膜の製造方法を提供すること。【解決手段】本発明のアルカリ水電解用隔膜の製造方法は、エポキシ樹脂、硬化剤およびポロゲンを含む樹脂組成物を調製する工程と、該樹脂組成物を用いて樹脂シートを得る工程とを含む。1つの実施形態においては、本発明のアルカリ水電解用隔膜の製造方法は、上記樹脂シートから前記ポロゲンを除去する工程をさらに含む。【選択図】図1
摘要翻译：要解决的问题：为了提供碱性水电解屏障的制造方法，具有优异的离子渗透性和耐化学性的屏障以及在电解中在电极处产生的气体的表面难以粘附。解决方案：制造方法碱性水电解的阻挡层包括：制备包含环氧树脂，固化剂和致孔剂的树脂组合物的步骤; 以及使用该树脂组合物制备树脂片的步骤。在一个实施方案中，碱性水电解屏障的制造方法还包括从树脂片中除去致孔剂的步骤。

2. 发明专利

JP2012121160A Method of manufacturing thermosetting resin sheet and method of manufacturing thermosetting resin porous sheet 审中-公开
标题翻译：热固性树脂板的制造方法和制造热固性树脂多孔板的方法
公开(公告)号：JP2012121160A
公开(公告)日：2012-06-28
申请号：JP2010271620
申请日：2010-12-06
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HARADA NORIAKI , KAWAGUCHI YOSHIHIDE , KO ATSUSHI , HAYASHI OSAMU , ISHII KATSUMI , HARADA CHIAKI , MIZUIKE ATSUKO
IPC分类号： B29D7/00 , B01D69/10 , B01D71/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin sheet including thermosetting resin and a hardener which prevents in-plane unevenness.SOLUTION: In the method of manufacturing the resin sheet, a cylindrical or columnar resin hardened body is formed of a resin mixture including the thermosetting resin and the hardener, and the surface of the resin hardened body is cut at predetermined thickness, so as to prepare the resin sheet. During the preparation of the resin hardened body, after the resin mixture is agitated, it is made to leave at rest for hardening. The mixture is agitated again in the state where viscosity at 30-40°C of the mixture is 1,500-4,000 mPa s.
摘要翻译：要解决的问题：提供一种制造包含热固性树脂和防止平面不均匀的硬化剂的树脂片的方法。解决方案：在制造树脂片的方法中，圆柱形或柱状树脂硬化体由包含热固性树脂和硬化剂的树脂混合物形成，并且树脂硬化体的表面以预定厚度被切割，因此以制备树脂片。在制备树脂硬化体时，在搅拌树脂混合物之后，使其静置硬化。在混合物的30-40℃的粘度为1,500-4,000mPa·s的状态下，再次搅拌该混合物。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012005967A Porous support and method for manufacturing the same 审中-公开
标题翻译：多种支持及其制造方法
公开(公告)号：JP2012005967A
公开(公告)日：2012-01-12
申请号：JP2010144663
申请日：2010-06-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KAWAGUCHI YOSHIHIDE , KO ATSUSHI , HARADA NORIAKI , HAYASHI OSAMU , MIZUIKE ATSUKO , ISHII KATSUMI
IPC分类号： B01D69/10 , B01D69/12 , B01D71/46 , C08J9/26
摘要： PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a porous support comprising an epoxy resin porous body having a desired thickness and shape, to provide a porous support having excellent chemical resistance, and to provide a composite semi-permeable membrane having excellent chemical resistance, practical water permeability and a salt blocking property.SOLUTION: The method for manufacturing the porous support includes steps of: forming an uncured resin layer by using resin composition containing a monomer having a photo-polymerizable functional group, epoxy resin, a hardener and porogen; forming a semi-cured resin layer by polymerizing a monomer having the photo-polymerizable functional group by irradiating the uncured resin layer with an active energy ray; forming a cured resin layer by heating the semi-cured resin layer to perform the three-dimensional cross-linking of the epoxy resin: and forming the epoxy resin porous body having pores communicating with a three-dimensional network skeleton by removing the porogen in the cured resin layer.
摘要翻译：解决的问题：提供一种容易制造多孔载体的方法，其包括具有所需厚度和形状的环氧树脂多孔体，以提供具有优异耐化学性的多孔载体，并提供复合半透膜具有优异的耐化学性，实用的透水性和耐盐性。制造多孔载体的方法包括以下步骤：通过使用含有具有可光聚合官能团的单体的树脂组合物，环氧树脂，硬化剂和致孔剂，形成未固化的树脂层; 通过用活性能量射线照射未固化的树脂层，使具有光聚合性官能团的单体聚合来形成半固化树脂层; 通过加热半固化树脂层来形成固化树脂层，以进行环氧树脂的三维交联;以及形成具有与三维网状骨架连通的孔的环氧树脂多孔体，固化树脂层。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2007246652A Epoxy resin sheet for molding optical member 审中-公开
标题翻译：用于模制光学部件的环氧树脂片
公开(公告)号：JP2007246652A
公开(公告)日：2007-09-27
申请号：JP2006070933
申请日：2006-03-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： AKAZAWA MITSUHARU , HARADA NORIAKI , USUI HIDEYUKI
IPC分类号： C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin sheet for molding an optical member holding strength even when having a sheet form with good operation efficiency and having high elongation at break and excellent curing characteristics and transmittance.
SOLUTION: The epoxy resin sheet for molding the optical member comprises an epoxy resin, a curing agent and a curing accelerator. The epoxy equivalent of the epoxy resin is 2,000-7,000.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使在具有良好的操作效率和高断裂伸长率以及优异的固化特性和透光率的片状的情况下，也提供了一种用于模制光学构件保持强度的环氧树脂片。解决方案：用于模制光学部件的环氧树脂片包括环氧树脂，固化剂和固化促进剂。环氧树脂的环氧当量为2,000-7,000。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2005093842A Heat dissipation sheet and heat dissipation member 审中-公开
标题翻译：散热片和散热片
公开(公告)号：JP2005093842A
公开(公告)日：2005-04-07
申请号：JP2003327158
申请日：2003-09-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HARADA NORIAKI , SUEHIRO ICHIRO , HOTTA YUJI
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide heat dissipation structure capable of suppressing deterioration in a heat dissipation effect even at a change of temperature while improving the efficiency of heat conduction. SOLUTION: A plurality of projections 1 comprising a heat conductive material are formed in an area which is a part of a plate surface of a metallic plate 4 (or a heat receiving surface of a radiator) and the remaining area of the plate surface is filled with filling resin 2 having an adhesive property and ≤100ppm linear expansion coefficient up to substantially the same height as the height of the projections 1. An adhering projection part 3 having substantially the same height as the height of the projections 1 and an upper surface consisting of adhesive resin is formed on a part or all of the periphery of the area. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供即使在改变温度的同时也能够提高热传导效率的同时能够抑制散热效果的劣化的散热结构。解决方案：包括导热材料的多个突起1形成在金属板4（或散热器的受热面）的板表面的一部分的区域中，并且板的剩余面积表面填充有具有粘合性的填充树脂2和与突起1的高度高达大致相同的高度的≤100ppm的线膨胀系数。具有与突起1的高度基本相同的高度的粘附突出部3和在该区域的一部分或全部周边上形成由粘合树脂构成的上表面。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2013031851A Epoxy resin porous membrane 审中-公开
标题翻译：环氧树脂多孔膜
公开(公告)号：JP2013031851A
公开(公告)日：2013-02-14
申请号：JP2012247731
申请日：2012-11-09
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KAWAGUCHI YOSHIHIDE , KO ATSUSHI , HARADA NORIAKI , HAYASHI OSAMU , MIZUIKE ATSUKO , ISHII KATSUMI
IPC分类号： B01D71/46 , B01D69/00 , B01D69/10 , C08J9/28
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin porous membrane, along with a method of manufacturing the same, capable of improving a separation performance while maintaining the amount of permeate.SOLUTION: The epoxy resin porous membrane is formed in a sheet-like shape used as a separation membrane, and has an air hole communicating with a three-dimensional network structure, wherein a pore diameter of the hole increases gradually in the thickness direction from a surface of the membrane to the other surface of the membrane.
摘要翻译：待解决的问题：为了提供环氧树脂多孔膜及其制造方法，能够在保持渗透量的同时提高分离性能。解决方案：环氧树脂多孔膜形成为用作分离膜的片状形状，并且具有与三维网状结构连通的空气孔，其中孔的孔径在厚度上逐渐增加方向从膜的表面到膜的另一个表面。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013004210A Separator for nonaqueous electrolyte power storage device, nonaqueous electrolyte power storage device and manufacturing method therefor 有权
标题翻译：非电解电力储存装置的分离器，非水电解电力储存装置及其制造方法
公开(公告)号：JP2013004210A
公开(公告)日：2013-01-07
申请号：JP2011131553
申请日：2011-06-13
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NOMI SHUNSUKE , KO ATSUSHI , HARADA NORIAKI , KAWAGUCHI YOSHIHIDE
IPC分类号： H01M2/16
CPC分类号： H01M2/16 , C08J9/286 , C08J2201/0464 , C08J2363/00 , H01G11/52 , H01M2/145 , H01M2/1653 , H01M10/052 , Y02E60/13 , Y10T29/49108
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of the separator for a nonaqueous electrolyte power storage device, capable of avoiding use of a solvent having large impact on the environment and controlling the parameters, e.g. porosity or bore diameter, relatively easily.SOLUTION: The manufacturing method of the separator for a nonaqueous electrolyte power storage device having a thickness in the range of 10 to 50 μm includes the steps of: preparing an epoxy resin composition containing epoxy resin, hardener and porogen; molding a hardened epoxy resin composition in sheet-like shape or hardening a sheet-like molding of an epoxy resin composition in order to obtain an epoxy resin sheet; and removing porogen from the epoxy resin sheet by using a halogen-free solvent.
摘要翻译：解决的问题：提供一种非水电解质蓄电装置用隔膜的制造方法，其能够避免使用对环境具有较大影响的溶剂和控制参数，例如，孔隙度或孔径，相对容易。解决方案：厚度在10〜50μm范围内的非水电解质蓄电装置用隔膜的制造方法包括以下步骤：制备含有环氧树脂，硬化剂和致孔剂的环氧树脂组合物; 将硬化的环氧树脂组合物成型为片状或硬化环氧树脂组合物的片状成型以获得环氧树脂片; 并通过使用无卤素溶剂从环氧树脂片中除去致孔剂。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012121943A Method for producing porous epoxy resin sheet 审中-公开
标题翻译：生产多孔环氧树脂片的方法
公开(公告)号：JP2012121943A
公开(公告)日：2012-06-28
申请号：JP2010271625
申请日：2010-12-06
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HARADA NORIAKI , KAWAGUCHI YOSHIHIDE , KO ATSUSHI , MIZUIKE ATSUKO , HAYASHI OSAMU , ISHII KATSUMI , HARADA CHIAKI
IPC分类号： C08J9/26 , B01D69/10 , B01D71/46 , C08G59/20
CPC分类号： B01D67/003 , B01D71/46 , B01D2323/18 , C08J9/286 , C08J2201/026 , C08J2201/0464 , C08J2363/02 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide a porous epoxy resin sheet having a large surface area and a uniform in-plane pore size distribution relating to the porous epoxy resin sheet produced by cutting a cured epoxy resin body to a predetermined thickness.SOLUTION: The method for producing a porous epoxy resin sheet by forming a cylindrical or columnar cured resin body from a resin mixture containing an epoxy resin, a curing agent, and porogen, cutting the surface of the cured resin body at a predetermined thickness to make an epoxy resin sheet, and then removing the porogen to render the sheet porous, is characterized in that when the cured resin body is formed from the resin mixture, curing is performed in a state where the viscosity of the mixture is at least 1,000 mPa s.
摘要翻译：解决方案：提供一种多孔环氧树脂片，其具有与通过将固化的环氧树脂体切割成预定厚度而制备的多孔环氧树脂片具有大的表面积和均匀的面内孔径分布。解决方案：通过从含有环氧树脂，固化剂和致孔剂的树脂混合物形成圆柱形或柱状固化树脂体，制备多孔环氧树脂片的方法，以预定的方式切割固化树脂体的表面厚度以制造环氧树脂片，然后除去致孔剂以使片材多孔，其特征在于，当树脂混合物形成固化树脂体时，在混合物的粘度至少为 1000 mPa s。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2009141066A Manufacturing method of optical semiconductor device 审中-公开
标题翻译：光学半导体器件的制造方法
公开(公告)号：JP2009141066A
公开(公告)日：2009-06-25
申请号：JP2007314930
申请日：2007-12-05
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KIMURA RYUICHI , AKAZAWA MITSUHARU , HARADA NORIAKI , HARA KAZUTAKA
IPC分类号： C09K11/64 , H01L33/48 , H01L33/50 , H01L33/56
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical semiconductor device wherein a color shade is easily adjusted using a chrominance adjusting sheet, and a chrominance adjusting sheet used for the manufacturing method, relating to a device for emitting white light using a blue LED element. SOLUTION: An optical semiconductor element chrominance adjusting sheet including at least one layer of a resin sheet A containing a fluorescent body is stacked on a substrate where an optical semiconductor element is mounted and covered with a sealing resin layer B for bonding. COPYRIGHT: (C)2009,JPO&INPIT

10. 发明专利

JP2008144052A Epoxy resin composition for optical member molding use 审中-公开
标题翻译：环氧树脂组合物用于光会员模塑使用
公开(公告)号：JP2008144052A
公开(公告)日：2008-06-26
申请号：JP2006333272
申请日：2006-12-11
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： AKAZAWA MITSUHARU , HARADA NORIAKI , UCHIYAMA HISAE
IPC分类号： C08G59/58 , G02B1/04
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition for optical member molding use, capable of obtaining an optical member such as a microlens sheet with no brightness unevenness development by its deformation or the like under a high-temperature/high-humidity ambience.
SOLUTION: The epoxy resin composition for optical member molding use comprises the following components (A) to (C): (A) An epoxy resin mainly comprising (a1) a bisphenol A-type epoxy resin 3,500 or greater in epoxy equivalent and (a2) at least one of a dicyclopentadiene-type epoxy resin and a biphenyl-type epoxy resin, wherein the content of the component (a1) is set at 30-50 wt.% of the whole epoxy resin composition. (B) An acid anhydride-based curing agent consisting mainly of an alicyclic acid anhydride. (C) A curing promoter consisting mainly of an imidazole-based compound.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题为了提供一种用于光学部件成型用途的环氧树脂组合物，能够通过在高温高压下的变形等获得不具有亮度不均匀性的微透镜片等光学部件，湿度环境光学部件成型用环氧树脂组合物包含以下成分（A）〜（C）：（A）主要包含（a1）环氧当量为3,500以上的双酚A型环氧树脂的环氧树脂和（a2）二环戊二烯型环氧树脂和联苯型环氧树脂中的至少一种，其中组分（a1）的含量设定为整个环氧树脂组合物的30-50重量％。（B）主要由脂环酸酐组成的酸酐系固化剂。（C）主要由咪唑类化合物组成的固化促进剂。版权所有（C）2008，JPO＆INPIT

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