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    • 22. 发明授权
    • Solid-state imaging apparatus, camera, and method of manufacturing solid-state imaging apparatus
    • 固态成像装置,照相机和制造固态成像装置的方法
    • US08593554B2
    • 2013-11-26
    • US12585604
    • 2009-09-18
    • Shinji MiyazawaTakeshi Takeda
    • Shinji MiyazawaTakeshi Takeda
    • H04N5/335
    • H01L27/14818H01L27/14623H01L27/14689H01L27/14843
    • A solid-state imaging apparatus includes a plurality of photoelectric conversion units configured to generate signal charge from light received at light-receiving surfaces thereof, the plurality of photoelectric conversion units being provided in the image-sensing area of a substrate; a charge reading unit configured to read signal charge generated by the photoelectric conversion units, a charge readout channel area thereof being provided in the image-sensing area of the substrate; a transfer register unit configured to transfer signal charge read from the plurality of photoelectric conversion units by the charge reading unit, a charge transfer channel area thereof being provided in the image-sensing area of the substrate; and a light-shielding unit that is provided in the image-sensing area of the substrate and that has an opening through which light is transmitted formed in an area corresponding to a light-receiving surface of a respective photoelectric conversion unit.
    • 固态成像装置包括多个光电转换单元,被配置为从其在光接收表面处接收的光产生信号电荷,所述多个光电转换单元设置在基板的图像感测区域中; 电荷读取单元,被配置为读取由所述光电转换单元生成的信号电荷,其电荷读出通道区域设置在所述基板的图像感测区域中; 转移寄存器单元,被配置为通过所述电荷读取单元传送从所述多个光电转换单元读取的信号电荷,其电荷转移通道区域设置在所述基板的图像感测区域中; 以及遮光单元,其设置在所述基板的图像感测区域中,并且在与各个光电转换单元的光接收表面对应的区域中形成有透光的开口。
    • 26. 发明授权
    • Infrared sensor
    • 红外传感器
    • US07626167B2
    • 2009-12-01
    • US11937218
    • 2007-11-08
    • Koji HayashiTakeshi Takeda
    • Koji HayashiTakeshi Takeda
    • G01J5/02
    • G01J1/04G01J1/0271G01J1/0407G01J2001/0276
    • A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.
    • 小型红外线传感器具有宽的红外光接收面积(视角),高电磁屏蔽特性和优异的电磁波电阻特性。 在红外传感器中,支撑部分设置在包装件中的大致矩形开口的四个角处。 所述支撑部支撑设置成覆盖所述开口的光学过滤器,所述光学过滤器位于比限定所述开口的内周壁的上端低的位置处。 当由于将滤光器的面对支撑部分的表面侧的一部分插入到开口中而由支撑部分支撑滤光器时,滤光器固定在封装上。 光学滤波器和封装被接合并固定,并通过导电粘合剂彼此电连接。
    • 27. 发明申请
    • Method of manufacturing insert-molded article and apparatus therefor
    • 嵌入成型品的制造方法及其装置
    • US20070138697A1
    • 2007-06-21
    • US11704359
    • 2007-02-09
    • Takeshi TakedaMakoto KitamuraNihei Kaishita
    • Takeshi TakedaMakoto KitamuraNihei Kaishita
    • B29C45/14
    • B29C45/14221B29C45/14655
    • Provides is a method of manufacturing an insert-molded article enabling to perform resin molding and tie bar cutting in one step and so as not to expose the cut planes of the tie bars to the external surface of the resin. A lead frame 1 provided with easily breakable notches 3a at positions closer to the metal component than the interfaces of fie bars 3 to be resin molded is prepared and positioned by means of pilot pins 11 provided to a lower mold 10. A metal component 4 is sandwiched between support protrusions 13 and component fixing pins 24 by lowering an upper mold 20 with the lead frame being positioned. Tie bar cutting punches 23 provided to the upper mold 20 are pressed against the tie bars, the tie bars 3 are separated from the metal component 4 by breaking the notches 3a, and the surroundings of the metal component 4 are filled with resin while the molds are closed. By this, the cut surfaces between the metal component 4 and the tie bars 3 are buried in the molded resin 7.
    • 提供一种制造插入成型制品的方法,其能够在一个步骤中进行树脂模制和拉杆切割,并且不将连杆的切割面暴露于树脂的外表面。 通过设置在下模具10上的引导销11准备并定位引线架1,该引线框架1在比待树脂成型的金属棒3的界面更靠近金属部件的位置处设置容易断裂的切口3a。 金属部件4通过在引线框架定位的同时降低上模20而夹在支撑突起13和部件固定销24之间。 设置在上模具20上的连杆切割冲头23被压靠在拉杆上,通过断开切口3a将连接杆3与金属部件4分离,金属部件4的周围用树脂填充,而 模具是封闭的。 由此,将金属部件4和连接条3之间的切割面埋设在模制树脂7中。
    • 28. 发明申请
    • Telephone transmitter/receiver
    • 电话发射机/接收机
    • US20060285679A1
    • 2006-12-21
    • US10551907
    • 2004-04-05
    • Mikio FukudaTakeshi Takeda
    • Mikio FukudaTakeshi Takeda
    • H04M1/00
    • H04M1/03H04R9/10
    • There is provided a telephone transmitter/receiver which can be easily applied to an existing telephone device for performing bone conduction communication at a low cost and which can be used with the same sense as a conventional telephone device. The telephone transmitter/receiver is characterized by comprising: a casing having a speech sending opening and a speech receiving opening; a microphone arranged in the speech sending opening; a bone conduction loudspeaker arranged in the speech receiving opening; an amplifier arranged in the casing and connected to the bone conduction loudspeaker; a connection cord having a telephone connector which can be inserted into the jack of a telephone main body and connected to both the microphone and the bone conduction loudspeaker; and, a power supply connection cord connecting the amplifier to an AC adapter.
    • 提供了一种电话发送器/接收器,其可以容易地应用于现有的电话设备,以便以低成本进行骨导通信,并且可以以与常规电话设备相同的感觉来使用。 电话发射机/接收机的特征在于包括:具有语音发送开口和语音接收开口的外壳; 布置在语音发送开口中的麦克风; 布置在所述语音接收开口中的骨传导扬声器; 布置在壳体中并连接到骨传导扬声器的放大器; 具有电话连接器的连接线,该电话连接器可插入到电话主体的插座中并连接到麦克风和骨传导扬声器; 以及将放大器连接到AC适配器的电源连接线。
    • 30. 发明授权
    • Electronic component mounting apparatus operable to mount electronic components onto a mount object
    • 电子部件安装装置,其可操作以将电子部件安装到安装对象上
    • US06701611B1
    • 2004-03-09
    • US09959146
    • 2001-10-18
    • Keizo IzumidaTakeshi TakedaKazuyuki Nakano
    • Keizo IzumidaTakeshi TakedaKazuyuki Nakano
    • H05K330
    • H05K13/08Y10T29/49124Y10T29/4913Y10T29/49133Y10T29/49137Y10T29/49139Y10T29/53178Y10T29/53191Y10T29/53261
    • The present invention provides an electronic component mounting apparatus which can reduce a consumption power amount in comparison with the background art, and a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to each of component feed drive parts for driving component feed devices, a component transfer drive device for driving a component transfer device, and a circuit board positioning drive device for driving a circuit board positioning device. The control device detects an individual occurrence of halt condition of each of constitution parts of an electronic component mounting apparatus and shuts off the drive power source to the drive device in the halt condition. Thus, a wasteful power consumption is eliminated and the production is continued with a necessary minimum power.
    • 本发明提供一种与背景技术相比能够降低消耗功率量的电子部件安装装置以及由电子部件安装装置执行的电源控制方法。 驱动电源和控制电源根据从控制装置到用于驱动部件供给装置的各个部件供给驱动部的命令分开连接和切断,用于驱动部件传送装置的部件传送驱动装置, 以及用于驱动电路板定位装置的电路板定位驱动装置。 控制装置检测电子部件安装装置的各个构成部件的个别停止状态,并且在停止状态下将驱动电源切断到驱动装置。 因此,消除浪费的功率消耗并且以必要的最小功率继续生产。