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1. 发明申请

US20080073739A1 ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT USING THE PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE 有权
标题翻译：电子元件封装，使用封装的电子元件以及制造电子元件封装的方法
公开(公告)号：US20080073739A1
公开(公告)日：2008-03-27
申请号：US11942203
申请日：2007-11-19
申请人： Makoto Kitamura , Nihei Kaishita , Takeshi Takeda
发明人： Makoto Kitamura , Nihei Kaishita , Takeshi Takeda
IPC分类号： H01L31/0203 , H01L21/00
CPC分类号： H05K5/0095 , H01L23/055 , H01L23/49861 , H01L23/552 , H01L2924/0002 , H01L2924/16195 , H01L2924/00
摘要： An electronic component package that provides a high shielding performance and that can prevent failures such as short-circuiting with a component contained therein. A package includes a shield case formed of a metal plate and shaped to have a bottom portion, the bottom portion having a through hole; a resin case molded on inner and outer surfaces of the shield case and shaped to have a bottom portion; and a hot terminal that is insert-molded in the resin case such that the hot terminal is inserted into the shield case through the through hole without contact. One end of the hot terminal is exposed at an inner surface of the resin case, and the other end of the hot terminal is exposed at an outer surface of the resin case. An element contained in the package is surrounded by the shield case so that good shielding performance is obtained.
摘要翻译：一种提供高屏蔽性能并且可以防止诸如其中包含的部件短路的故障的电子部件封装。包装盒包括由金属板形成并形成为具有底部的屏蔽壳体，底部具有通孔; 树脂壳体，其在所述屏蔽壳体的内表面和外表面上模制并成形为具有底部; 以及热端子，其被插入模制在树脂壳体中，使得热端子通过通孔而不接触地插入到屏蔽壳体中。热端子的一端露出在树脂外壳的内表面，而热端子的另一端在树脂外壳的外表面露出。封装体所包含的元件由屏蔽壳体包围，从而获得良好的屏蔽性能。

2. 发明授权

US07713783B2 Electronic component package, electronic component using the package, and method for manufacturing electronic component package 有权
标题翻译：电子部件封装，使用该封装的电子部件以及电子部件封装的制造方法
公开(公告)号：US07713783B2
公开(公告)日：2010-05-11
申请号：US11942203
申请日：2007-11-19
申请人： Makoto Kitamura , Nihei Kaishita , Takeshi Takeda
发明人： Makoto Kitamura , Nihei Kaishita , Takeshi Takeda
IPC分类号： H01L21/00
CPC分类号： H05K5/0095 , H01L23/055 , H01L23/49861 , H01L23/552 , H01L2924/0002 , H01L2924/16195 , H01L2924/00
摘要： An electronic component package that provides a high shielding performance and that can prevent failures such as short-circuiting with a component contained therein. A package includes a shield case formed of a metal plate and shaped to have a bottom portion, the bottom portion having a through hole; a resin case molded on inner and outer surfaces of the shield case and shaped to have a bottom portion; and a hot terminal that is insert-molded in the resin case such that the hot terminal is inserted into the shield case through the through hole without contact. One end of the hot terminal is exposed at an inner surface of the resin case, and the other end of the hot terminal is exposed at an outer surface of the resin case. An element contained in the package is surrounded by the shield case so that good shielding performance is obtained.
摘要翻译：一种提供高屏蔽性能并且可以防止诸如其中包含的部件短路的故障的电子部件封装。包装盒包括由金属板形成并形成为具有底部的屏蔽壳体，底部具有通孔; 树脂壳体，其在所述屏蔽壳体的内表面和外表面上模制并成形为具有底部; 以及热端子，其被插入模制在树脂壳体中，使得热端子通过通孔而不接触地插入到屏蔽壳体中。热端子的一端露出在树脂外壳的内表面，而热端子的另一端在树脂外壳的外表面露出。封装体所包含的元件由屏蔽壳体包围，从而获得良好的屏蔽性能。

3. 发明申请

US20070138697A1 Method of manufacturing insert-molded article and apparatus therefor 有权
标题翻译：嵌入成型品的制造方法及其装置
公开(公告)号：US20070138697A1
公开(公告)日：2007-06-21
申请号：US11704359
申请日：2007-02-09
申请人： Takeshi Takeda , Makoto Kitamura , Nihei Kaishita
发明人： Takeshi Takeda , Makoto Kitamura , Nihei Kaishita
IPC分类号： B29C45/14
CPC分类号： B29C45/14221 , B29C45/14655
摘要： Provides is a method of manufacturing an insert-molded article enabling to perform resin molding and tie bar cutting in one step and so as not to expose the cut planes of the tie bars to the external surface of the resin. A lead frame 1 provided with easily breakable notches 3a at positions closer to the metal component than the interfaces of fie bars 3 to be resin molded is prepared and positioned by means of pilot pins 11 provided to a lower mold 10. A metal component 4 is sandwiched between support protrusions 13 and component fixing pins 24 by lowering an upper mold 20 with the lead frame being positioned. Tie bar cutting punches 23 provided to the upper mold 20 are pressed against the tie bars, the tie bars 3 are separated from the metal component 4 by breaking the notches 3a, and the surroundings of the metal component 4 are filled with resin while the molds are closed. By this, the cut surfaces between the metal component 4 and the tie bars 3 are buried in the molded resin 7.
摘要翻译：提供一种制造插入成型制品的方法，其能够在一个步骤中进行树脂模制和拉杆切割，并且不将连杆的切割面暴露于树脂的外表面。通过设置在下模具10上的引导销11准备并定位引线架1，该引线框架1在比待树脂成型的金属棒3的界面更靠近金属部件的位置处设置容易断裂的切口3a。金属部件4通过在引线框架定位的同时降低上模20而夹在支撑突起13和部件固定销24之间。设置在上模具20上的连杆切割冲头23被压靠在拉杆上，通过断开切口3a将连接杆3与金属部件4分离，金属部件4的周围用树脂填充，而模具是封闭的。由此，将金属部件4和连接条3之间的切割面埋设在模制树脂7中。

4. 发明授权

US08057723B2 Method of manufacturing insert-molded article and apparatus therefor 有权
标题翻译：嵌入成型品的制造方法及其装置
公开(公告)号：US08057723B2
公开(公告)日：2011-11-15
申请号：US11704359
申请日：2007-02-09
申请人： Takeshi Takeda , Makoto Kitamura , Nihei Kaishita
发明人： Takeshi Takeda , Makoto Kitamura , Nihei Kaishita
IPC分类号： B29C45/14
CPC分类号： B29C45/14221 , B29C45/14655
摘要： Provides is a method of manufacturing an insert-molded article enabling to perform resin molding and tie bar cutting in one step and so as not to expose the cut planes of the tie bars to the external surface of the resin. A lead frame 1 provided with easily breakable notches 3a at positions closer to the metal component than the interfaces of tie bars 3 to be resin molded is prepared and positioned by means of pilot pins 11 provided to a lower mold 10. A metal component 4 is sandwiched between support protrusions 13 and component fixing pins 24 by lowering an upper mold 20 with the lead frame being positioned. Tie bar cutting punches 23 provided to the upper mold 20 are pressed against the tie bars, the tie bars 3 are separated from the metal component 4 by breaking the notches 3a, and the surroundings of the metal component 4 are filled with resin while the molds are closed. By this, the cut surfaces between the metal component 4 and the tie bars 3 are buried in the molded resin 7.
摘要翻译：提供一种制造插入成型制品的方法，其能够在一个步骤中进行树脂模制和拉杆切割，并且不将连杆的切割面暴露于树脂的外表面。通过设置在下模具10上的引导销11准备并定位引线框架1，该引线框架1在比待连接条3的树脂模制接口更靠近金属部件的位置处设置容易断裂的切口3a。金属部件4 通过在引线框架定位的同时降低上模20而夹在支撑突起13和部件固定销24之间。设置在上模具20上的连杆切割冲头23被压靠在拉杆上，通过断开切口3a将连接杆3与金属部件4分离，金属部件4的周围用树脂填充，而模具关闭。由此，将金属部件4和连接条3之间的切割面埋设在模制树脂7中。

5. 发明授权

US07059847B2 Resin molding machine 有权
标题翻译：树脂成型机
公开(公告)号：US07059847B2
公开(公告)日：2006-06-13
申请号：US10485754
申请日：2003-07-15
申请人： Takeshi Takeda , Shigeki Takahashi , Kunihito Seta , Nihei Kaishita
发明人： Takeshi Takeda , Shigeki Takahashi , Kunihito Seta , Nihei Kaishita
IPC分类号： B29C45/32
CPC分类号： B29C45/1759 , B29C45/14655
摘要： To provide a resin molding machine that can reduce cost by eliminating the need for a residual-material remover, and can reduce cycle time and the amount of residual material, the resin molding machine includes a stationary cavity plate that has a gate communicating with a cavity, a sprue bushing in which a sprue is formed for feeding a molding material through the gate into the cavity, a runner plate disposed between the stationary cavity plate 13 and the sprue bushing, a cylinder unit (runner-plate driving mechanism) for rectilinearly reciprocating the runner plate between ejecting positions and via a molding position, the ejecting positions being separated from the molding position A and provided for ejecting the residual material, and an ejecting channel (residual-material ejecting mechanism) for ejecting the residual material at the ejecting positions.
摘要翻译：为了提供能够通过不需要残留材料去除剂来降低成本的树脂成型机，并且可以减少周期时间和剩余材料的量，树脂成型机包括具有与腔连通的门的固定腔板浇口套管，其中形成有用于将成型材料通过浇口进入空腔的浇道;设置在固定腔板13和浇口衬套之间的流道板，用于直线往复运动的缸单元（流道板驱动机构）排出位置之间的流道板和模制位置，排出位置与模制位置A分离并被设置用于喷射剩余材料，以及用于将残留材料排出在排出位置的排出通道（残留材料排出机构）。

6. 发明授权

US06257394B1 Part-conveying apparatus 有权
标题翻译：部件输送设备
公开(公告)号：US06257394B1
公开(公告)日：2001-07-10
申请号：US09343701
申请日：1999-06-30
申请人： Shigeki Takahashi , Nihei Kaishita , Akira Nemoto
发明人： Shigeki Takahashi , Nihei Kaishita , Akira Nemoto
IPC分类号： B65G4704
CPC分类号： B65G27/12 , B65G47/1407 , B65G47/1428
摘要： A part-conveying apparatus allows parts to align and slide down a sloped chute without stacking therein. The part-conveying apparatus has a chute sloped to align and slide down parts, and a first mobile blade for slidably supporting the parts in a bottom section of the chute in the direction of the chute 9. The lower end section of the chute is connected to a horizontal guide path, and a second conveying blade movable forward and backward is provided in a bottom section of the guide path. The second conveying blade reciprocates in a manner so as to move backward faster than to move forward, thereby conveying forward the parts placed thereon. A projection in the lower end of the first mobile blade engages with a groove of the second mobile blade so as to cause fine movements of the first conveying blade in the direction of the chute in synchronous with back and forth movements of the second conveying blade 26. This allows the parts to side down.
摘要翻译：部件输送装置允许部件在没有堆叠的情况下对准和滑动倾斜的滑槽。部件输送装置具有倾斜的倾斜部，用于对准和滑下部分;以及第一可动叶片，用于沿滑槽9的方向可滑动地支撑滑槽的底部中的部分。滑槽的下端部分连接并且在引导路径的底部设置有可前后移动的第二输送叶片。第二输送叶片以向前移动的方式往复运动，从而向前运送放置在其上的部件。第一活动叶片的下端部的突出部与第二活动叶片的槽接合，从而与第二输送叶片26的前后运动同时地使第一输送叶片在滑槽的方向上进行精细的运动这允许零件朝向侧面。

7. 发明授权

US06241461B1 Apparatus for transporting parts 有权
标题翻译：运输零件的装置
公开(公告)号：US06241461B1
公开(公告)日：2001-06-05
申请号：US09307730
申请日：1999-05-10
申请人： Shigeki Takahashi , Nihei Kaishita , Akira Nemoto
发明人： Shigeki Takahashi , Nihei Kaishita , Akira Nemoto
IPC分类号： B65G2504
CPC分类号： H05K13/028 , B65G25/06 , B65G27/12 , B65G47/1407
摘要： A part transporting apparatus comprises: a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards. Provided to this arrangement are: a second stopper which operates so as to open and close in the width direction of the guiding groove, and hold the second part from the front of the row of parts; and a movable first stopper which stops the first part at the tip of the guiding groove; wherein the first stopper is moved forwards synchronously with the transporting member immediately prior to completion of the forward movement of the transporting member, thereby separating the first part in the row from the second part. The first stopper retreats following the retreat of the transporting member. Such an arrangement provides for an apparatus for transporting parts, wherein the first part and second part can be separated in a sure manner even in the event that the parts are non-magnetic material, wherein ease of extracting of the first part is facilitated, and wherein parts can be supplied in a sure manner even in the event that an extracting failure occurs.
摘要翻译：一种部件传送装置包括：引导槽，用于排列一排中的部件并引导部件; 传送构件，其设置在引导槽的基部并通过其沿着槽向前和向后沿向前方向传送部件; 以及用于沿前后方向往复驱动传送部件的驱动装置; 其中传送构件缓慢前进并且迅速地缩回，以便将部件向前运送。提供这样的结构是：第二止动件，其沿着导向槽的宽度方向开闭，并将第二部分从该列的前部保持; 以及可移动的第一止动件，其将所述第一部分停止在所述引导槽的末端; 其中，所述第一止动件在所述输送构件的向前移动完成之前立即与所述输送构件同步向前移动，从而将所述行中的所述第一部分与所述第二部分分离。第一个塞子在运送构件撤退后撤退。这种布置提供了用于运输部件的装置，其中即使在部件是非磁性材料的情况下，第一部分和第二部分也可以以可靠的方式分离，其中易于提取第一部分的方便，以及即使在提取失败的情况下也可以以可靠的方式供给部件。

8. 发明授权

US09123996B2 Wireless IC device 有权
标题翻译：无线IC设备
公开(公告)号：US09123996B2
公开(公告)日：2015-09-01
申请号：US13088480
申请日：2011-04-18
申请人： Yuya Dokai , Nihei Kaishita , Hiroshi Nonogaki , Ryohei Goto , Takahiro Yamaguchi , Kazuyuki Ikeda
发明人： Yuya Dokai , Nihei Kaishita , Hiroshi Nonogaki , Ryohei Goto , Takahiro Yamaguchi , Kazuyuki Ikeda
IPC分类号： H01Q1/38 , H01Q1/22 , H01Q7/00
CPC分类号： H01Q1/38 , H01Q1/2225 , H01Q7/00
摘要： A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.
摘要翻译：无线IC器件包括基本上为长方体的电介体，金属图案，其通过膜设置在电介质体的表面上并用作散热器，以及耦合到金属图案的馈电部分的无线IC元件。电介质体具有包括折叠的柔性介电层的叠层结构。在电介质层折叠之后彼此面对的电介质层的表面是非接合表面。

9. 发明授权

US06375406B1 Apparatus for transporting parts 有权
标题翻译：运输零件的装置
公开(公告)号：US06375406B1
公开(公告)日：2002-04-23
申请号：US09307773
申请日：1999-05-10
申请人： Shigeki Takahashi , Nihei Kaishita , Akira Nemoto
发明人： Shigeki Takahashi , Nihei Kaishita , Akira Nemoto
IPC分类号： B65G5900
CPC分类号： B65G25/06 , B65G27/12 , B65G47/1407 , H05K13/028
摘要： A part transporting apparatus comprises: a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards. Provided to this arrangement are: a stopper which operates so as to open and close in the width direction of the guiding groove, and hold the second part from the front of the row of parts being transported on the upper plane of the transporting member; and a synchronizing means for opening and closing the stopper synchronously with the reciprocal forward and backward movement of the transporting member; wherein, once the stopper holds the second part, the transporting member further moves forward, thereby separating the first part in the row from the second part. Such an arrangement provides for an apparatus for transporting parts, wherein the first part and second part can be separated in a sure manner even in the event that the parts are non-magnetic material, and wherein ease of extracting of the first part is facilitated.
摘要翻译：一种部件传送装置包括：引导槽，用于排列一排中的部件并引导部件; 传送构件，其设置在引导槽的基部并通过其沿着槽向前和向后沿向前方向传送部件; 以及用于沿前后方向往复驱动传送部件的驱动装置; 其中传送构件缓慢前进并且迅速地缩回，以便将部件向前运送。提供这样一种装置：一个在引导槽的宽度方向上打开和关闭的止动器，并且从传送部件的上平面上被传送的部分行的前部保持第二部分; 以及同步装置，用于与传送构件的往复向前和向后运动同步地打开和关闭挡块; 其中，一旦止动器保持第二部分，传送部件进一步向前移动，从而将行中的第一部分与第二部分分离。这种布置提供了用于输送部件的装置，其中即使在部件是非磁性材料的情况下，第一部分和第二部分也可以以可靠的方式分离，并且其中容易提取第一部分。

10. 发明授权

US6161676A Component feeder 有权
标题翻译：组件馈线
公开(公告)号：US6161676A
公开(公告)日：2000-12-19
申请号：US345960
申请日：1999-07-01
申请人： Shigeki Takahashi , Nihei Kaishita , Akira Nemoto
发明人： Shigeki Takahashi , Nihei Kaishita , Akira Nemoto
IPC分类号： B65G47/14 , H05K13/02 , B65G47/24
CPC分类号： H05K13/028
摘要： A component feeder is provided in which damage to chip components is minimized, being capable of efficiently discharging chip components aligned in a line. A bulk case is attached on the top portion of an outer storage housing capable of being supplied by a large number of chip components. Chip components are supplied from the outer storage housing to an inner housing of a component-storage housing via a supplying path. A predetermined number of the chip components in the inner housing is fed at a time to the outer housing via a communicating path in accordance with rotation of a rotary drum so as to be dropped into an aligning groove and aligned by a lug member of the rotary drum. The number of components in the outer housing is reduced, resulting in high efficiency of aligning and reduced damage to components. The chip components slide down on the aligning groove to be discharged to a discharge path, via the gate, aligned in a line.
摘要翻译：提供了一种组件馈电器，其中对芯片部件的损坏最小化，能够有效地排放一行中排列的芯片部件。大容量壳体附着在能够由大量芯片部件供应的外部存储壳体的顶部上。芯片部件经由供给路径从外部存储壳体供给到部件储存壳体的内部壳体。内壳体中的预定数量的芯片部件通过旋转滚筒的旋转经由连通路径一次馈送到外壳体，以便落入对准槽中并且由旋转体的凸耳构件对齐鼓。外壳中的部件的数量减少，导致对准的高效率和对部件的损坏减少。芯片部件在对准槽上向下滑动，通过门排列到排出路径，排成一行。

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