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21. 发明专利

JPS5168449A Yosetsukannetsushorisochiniokeru biidohiitaanaraisochi 失效
公开(公告)号：JPS5168449A
公开(公告)日：1976-06-14
申请号：JP14296574
申请日：1974-12-11
申请人： Nippon Steel Corp
发明人： TANIMOTO MITSUO , YAMAMOTO TOSHIO , OKAYA HIDEYUKI
IPC分类号： B23K31/00 , B23K37/00 , C21D9/50

22. 发明专利

JPS5166251A Yosetsukokanno kaisakibukanetsuseijosochi 失效
标题翻译： YOSETSUKOKANNO KAISAKIBUKANETSUSEIJOSOCHI
公开(公告)号：JPS5166251A
公开(公告)日：1976-06-08
申请号：JP14023974
申请日：1974-12-05
申请人： Nippon Steel Corp
发明人： TANIMOTO MITSUO , SAKIMOTO TSUTOMU , YAMAMOTO TOSHIO
IPC分类号： B23K9/235 , B23K37/00

23. 发明专利

JPH1074769A BUMP FORMING METHOD AND DEVICE 失效
公开(公告)号：JPH1074769A
公开(公告)日：1998-03-17
申请号：JP24883596
申请日：1996-08-30
申请人： NIPPON STEEL CORP
发明人： YAMAMOTO TOSHIO , TATSUMI KOHEI
IPC分类号： H05K3/34 , B23K3/06 , H01L21/321 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a bump forming method and a device in which bumps are effectively enhanced in production efficiency and ensured of proper bonding. SOLUTION: A conductive fine ball supported as arranged on an arrangement board 10 is transferred onto the electrode of a semiconductor chip for the formation of a bump on the electrode. The semiconductor chips are arranged in rows on a tray 12 where the semiconductor chips are mounted so as to be separately dismounted, the arrangement board 10 is provided with suction holes corresponding to the electrodes of the semiconductor chips mounted on the tray 12 and supports fine balls arranged in rows through the intermediary of the suction holes, and a bonding head 16 gets one of the semiconductor chips from the tray 12. A bump is successively, efficiently, and properly formed on each of the semiconductor chips mounted on the tray 12.

24. 发明专利

JPH1074768A FINE BALL ARRANGING BOARD AND BUMP FORMING METHOD 失效
公开(公告)号：JPH1074768A
公开(公告)日：1998-03-17
申请号：JP24883496
申请日：1996-08-30
申请人： NIPPON STEEL CORP
发明人： YAMAMOTO TOSHIO , SHIMOKAWA KENJI
IPC分类号： H01L21/60 , H01L21/321 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a fine ball arranging board and a bump forming method which are capable of realizing preperly bonded bumps and ensuring the bumps of high reliability. SOLUTION: A large number of suction holes 11 which hold conductive fine balls 1 by suction are provided to a fine ball arranging board 10. A tapered part 12 is provided to the hole's opening-side surface of the board 10 at the periphery 10a of the board 10. The tapered part 12 is provided to the board 10 outside the outermost suction hole 11 close to the board periphery 10a. When the fine conductive balls 1 supported as arranged on the arranging board 10 are transferred onto a target bonding part 4 for the formation of bumps, the target bonding part 4 is divided into regions, and the fine balls 1 supported as arranged are bonded to each region. As the tapered part 12 is provided, the formed bumps are protected against damage, thus high productivity can be obtained.

25. 发明专利

JPH04299545A METHOD FOR CONNECTING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04299545A
公开(公告)日：1992-10-22
申请号：JP8746191
申请日：1991-03-27
申请人： NIPPON STEEL CORP
发明人： YAMAMOTO TOSHIO , EMOTO YOSHIAKI , IMADA MASAFUMI
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a method for connecting semiconductor devices for easily connecting grand plate to a semiconductor device mounted on a film, such as TAB tape, etc., with high accuracy. CONSTITUTION:After an IC chip 10 is placed on a stage 26 with its rear surface upside, the chip 10 is fixed to the stage 26 by sucking air through an opening 30 and conductive paste 34 is applied to the surface of a grand plate 16 facing the chip 10. The plate 16 is carried to a position above the chip 10, aligned to the chip 10, and lowered to a prescribed position by means of a vacuum suction nozzle 32. Then the grand plate 16 is connected to the rear surface of the IC chip 10 through the conductive paste 34.

26. 发明专利

JPH0487347A BONDING APPARATUS 失效
公开(公告)号：JPH0487347A
公开(公告)日：1992-03-19
申请号：JP20283190
申请日：1990-07-30
申请人： NIPPON STEEL CORP
发明人： YAMAMOTO TOSHIO , IMADA MASAFUMI , ONO TAKAHIDE , MARUYAMA TADAKATSU
IPC分类号： H01L21/60
摘要： PURPOSE:To efficiently execute an operation to adjust the parallelism by a method wherein a holding part and a mounting stand are formed in such a way that the pressurization face of a pressure means and the face on which an object to be pressed is mounted of the mounting stand become parallel, the rear surface of the holding part is brought into contact with the peripheral part on the surface of the mounting stand and the body to be pressed is pressed. CONSTITUTION:Since springs 26 are installed at the lower part of a mounting stand 22, the springs 26 are deformed elastically by a force by which the rear surface 14a of a pressurization head 14 presses the surface of the mounting stand 22. Even when the pressurization head 14 is tilted with reference to the horizontality, the peripheral part 22b on the surface of the mounting stand 22 automatically follows the rear surface 14a of the pressurization head 14 so as to come into contact with the rear surface. At this stage, the parallelism between the pressurization face 12a of a bonding tool 12 and the mounting face 22a of the mounting stand 22 is maintained. The parallelism between the pressurization face 12a and the mounting face 22a is ensured in this manner. After that, the bonding tool 12 is lowered. Thereby since the pressurization face 12a is lowered by keeping the parallelism with the mounting face 22a of the mounting stand 22, a uniform load is applied on discrete electrodes of an IC chip 32 and on bumps of a lead.

27. 发明专利

JPH0487345A BONDING APPARATUS 失效
公开(公告)号：JPH0487345A
公开(公告)日：1992-03-19
申请号：JP20282990
申请日：1990-07-30
申请人： NIPPON STEEL CORP
发明人： SUZUKI YASUHIRO , KURIBAYASHI HISAO , YAMAMOTO TOSHIO , ONO TAKAHIDE , MARUYAMA TADAKATSU
IPC分类号： H01L21/60
摘要： PURPOSE:To enhance operating efficiency, to surely execute a bonding operation and to increase yield by a method wherein an elastic member which maintains the parallelism between the pressurization face of a pressure means and the bonding face of an object to be pressed is laid between the pressure means and a holding means. CONSTITUTION:When an IC chip is inclined or the parallelism between the mounting face of a mounting stand and the pressurization face of a bonding tool is displaced, the pressurization face 2a first comes into contact with only one part of the IC chip 22 when a pressurization head 4 is lowered and a bonding operation is executed. The pressurization face 2a of the bonding tool 2 comes into contact with one part of the IC chip 22. When the pressurization head 4 is lowered further, a spring 12 is deformed elastically by the counteraction of a force by which the bonding tool 2 presses the IC chip 22. Thereby, the pressurization face 2a of the bonding tool 2 changes its angle in such a way that it becomes parallel with the bonding face 22a of the IC chip 22. When the pressurization head 4 continues its lowering operation further, a load is exerted on the IC chip 22 in a state that the angle of the pressurization face 2a remains unchanged.

28. 发明专利

JPH03266442A STRUCTURE FOR SEMICONDUCTOR CHIP MOUNTING USE 失效
公开(公告)号：JPH03266442A
公开(公告)日：1991-11-27
申请号：JP6528990
申请日：1990-03-15
申请人： NIPPON STEEL CORP
发明人： OHIGATA NAOHARU , YAMAMOTO TOSHIO , KAMIYA MITSUMASA , IMADA MASAFUMI
IPC分类号： H01L21/60 , H01L21/56 , H01L23/28 , H01L23/495
摘要： PURPOSE:To prevent harmful oozing-out of resin into the gaps between conductive leads by a method wherein the gaps between the leads are respectively made to bend into a labyrinthine form by projecting parts formed integrally with the lead on at least one side of the leads adjacent to one another of a large number of conductive leads. CONSTITUTION:Projecting parts 16 and 17 to intrude into gaps 38 between both outer lead parts 9 of outer lead parts 9 adjacent to each other in the state of almost a right angle to the gaps 38 are formed on the individual outer lead parts 9. The projecting parts 17 on the inside are spaced apart a boundary P and the parts between these projecting parts 17 and the boundary P are used as resin reservoir parts 18. When lead patterns 3 are formed en bloc, the projecting parts 16 and 17 are simultaneously formed integrally with the individual outer lead parts 9. Accordingly, the gaps 38 between the outer lead parts 9 are formed into bent parts 15 made to bend into a labyrinthine form by the projecting parts 16 and 17. Thereby, flowing-out resin 39 are stopped from oozing out lengthily in the directions of the points of the individual outer lead parts 9 in the gaps 38 between the outer lead parts 9.

29. 发明专利

JPH02294046A MOUNTING OF TAPE CARRIER TYPE IC PACKAGE AND TAPE CARRIER TYPE IC PACKAGE 失效
公开(公告)号：JPH02294046A
公开(公告)日：1990-12-05
申请号：JP11457989
申请日：1989-05-08
申请人： NIPPON STEEL CORP
发明人： SAITO TAMIO , OHIGATA NAOHARU , YAMAMOTO TOSHIO , ONO JIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To securely connect each outer lead to a partner conductor part without causing any positional displacement between each outer lead and each conductor part of a substrate by performing connection with a state where mutual positional relationships among a plurality of the outer leads are fixed through coupling means. CONSTITUTION:A plurality of outer leads 5 disposed in the same direction are fixed in their mutual positional relationships through coupling means, so that the mutual positional relationships among the respective outer leads 5 are prevented from being changed in a mounting process of a package 1 onto a substrate 30 and further disorders of intervals and arrangements of the respective outer leads 5 are prevented from being produced. In such a state where disorders of intervals and arrangements among the respective outer leads 5 are prevented, a plurality of the outer leads 5 of the substrate 30 to conductor parts 31 are connected. Hereby, positional displacements between the respective outer leads 5 and the respective conductor parts of the substrate 30 caused by the disorders of the intervals and arrangements of the respective outer leads 5 are prevented and hence the respective outer leads 5 are securely connected to the corresponding conductor parts 31.

30. 发明专利

JPS6310006A EDGING METHOD FOR STRIP 失效
公开(公告)号：JPS6310006A
公开(公告)日：1988-01-16
申请号：JP15446586
申请日：1986-07-01
申请人： ISHIKAWAJIMA HARIMA HEAVY IND , NIPPON STEEL CORP
发明人： TAZOE NOBUHIRO , NAGAKURA MAKOTO , YAMAMOTO TOSHIO , MATOBA SATORU , IGARASHI YASUO
IPC分类号： B21B1/26 , B21B37/22
摘要： PURPOSE:To improve the width accuracy by pressing the top surface of a strip in the vicinity of the gap between edge rolls by a downward pressing roll and performing a edging with a winding angle of the strip being kept at the time of edging for the strip. CONSTITUTION:Edger rolls 4 and 5 are pressed against both width ends of a strip 3 by an edger 6 installed between rolling stands 1, 2 performing finish rolling. A looper angle is adjusted by both a downward pressing roll 7 installed in the roll gap between edger rolls 4, 5 to press the top surface of the strip 3 and looper roll 9 installed to push up the strip 3 by a turning of a looper arm 8. In that method, the width accuracy is improved.

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