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1. 发明专利

DE2552401A1 未知
公开(公告)号：DE2552401A1
公开(公告)日：1976-08-12
申请号：DE2552401
申请日：1975-11-22
申请人： NIPPON STEEL CORP
发明人： GONDO HISASHI , NAKASUGI HAJIME , TANIMOTO TERUO , KIMURA TSURUGI , YAMAMOTO TOSHIO , SAKIMOTO TSUTOMU , OKATANI HIDEYUKI
IPC分类号： C21D9/08 , C21D9/50

2. 发明专利

FR2292772A1 未知
公开(公告)号：FR2292772A1
公开(公告)日：1976-06-25
申请号：FR7536207
申请日：1975-11-26
申请人： NIPPON STEEL CORP
发明人： GONDO HISASHI , NAKASUGI HAJIME , TANIMOTO TERUO , KIMURA TSURUGI , YAMAMOTO TOSHIO , SAKIMOTO TSUTOMU , OKATANI HIDEYUKI
IPC分类号： C21D9/08 , C21D9/50 , C21D1/34

3. 发明专利

CA1042324A METHOD OF HEAT-TREATMENT OF WELDED PIPE AND APPARATUS THEREFOR 未知
公开(公告)号：CA1042324A
公开(公告)日：1978-11-14
申请号：CA240408
申请日：1975-11-25
申请人： NIPPON STEEL CORP
发明人： GONDO HISASHI , NAKASUGI HAJIME , TANIMOTO TERUO , KIMURA TSURUGI , YAMAMOTO TOSHIO , SAKIMOTO TSUTOMU , OKATANI HIDEYUKI
IPC分类号： C21D9/08 , C21D9/50
摘要： In the continuous heat treatment of welded pipe having a reinforcement of weld head as the pipe is travelling in the direction of its axial line, rapid induction heating is applied to bring the entire pipe to a desired temperature. A local heating of the bead is applied immediately after such induction heating, so as to make the temperature difference between the base metal of the pipe and the lead smaller than the limit of allowance, and the heated pipe is subsequently cooled. Loca heating of the bead may be done by means of a high-frequency induction heating coil, a burner, a plasma arc, or a laser.

4. 发明专利

JPH04373137A RESIN REELING METHOD OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04373137A
公开(公告)日：1992-12-25
申请号：JP17761491
申请日：1991-06-21
申请人： NIPPON STEEL CORP
发明人： KAMIYAMA TADASHI , YAMAMOTO TOSHIO
IPC分类号： H01L21/56 , H01L23/50
摘要： PURPOSE:To obtain a resin peeling method of a semiconductor device wherein a residual resin part can be easily removed without exerting adverse influence upon a lead when the residual resin part is peeled. CONSTITUTION:A film carrier 2 is sandwiched and fixed by fixing jigs 12a and 12b. A residual resin part 8 is cut out by pressing down, with a piston 26, a coupling part of rein which seals a semiconductor resin and the residual resin part 8. The residual resin part 8 is peeled from the filmy carrier 2 by sandwiching the residual resin part 8 between stainless plates 28 and pivotally turning them.

5. 发明专利

JPH04353745A INSPECTION OF BONDING STRENGTH OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04353745A
公开(公告)日：1992-12-08
申请号：JP15552291
申请日：1991-05-30
申请人： NIPPON STEEL CORP
发明人： YAMAMOTO TOSHIO , EMOTO YOSHIAKI , SAITO YOSHIMASA
IPC分类号： G01N19/04 , H01L21/66
摘要： PURPOSE:To efficiently and certainly inspect the mechanical bonding inferiority of the lead of a film carrier and the electrode of an IC chip. CONSTITUTION:After the inner lead 36a of a film carrier and the electrode 38 of an IC chip 32 are bonded through a bump 42, the IC chip 32 is placed on a receiving stand 12. Air is sucked from a vacuum hole 14 to fix the IC chip 32 to the receiving stand 12. Air with the wind pressure corresponding to desired bonding strength is sent out of a nozzle 16 to be blown against the inner lead 36.

6. 发明专利

JPH0487346A BONDING APPARATUS 失效
公开(公告)号：JPH0487346A
公开(公告)日：1992-03-19
申请号：JP20283090
申请日：1990-07-30
申请人： NIPPON STEEL CORP
发明人： SUZUKI YASUHIRO , KURIBAYASHI HISAO , YAMAMOTO TOSHIO , ONO TAKAHIDE , MARUYAMA TADAKATSU
IPC分类号： H01L21/60
摘要： PURPOSE:To enhance an operating efficiency, to surely execute a bonding operation and to increase yield by a method wherein a mounting stand is supported via an elastic member which maintains the parallelism between the pressurization face of a pressure means and the bonding face of an object to be pressed. CONSTITUTION:When a pressurization head 4 is first lowered, the pressurization face 2a of a bonding tool 2 comes into contact with one part of an IC chip 22. When the pressurization head 4 is lowered further, a ring-shaped tube 18 corresponding to a part with which the bonding tool 2 has first come into contact is pressed and a part opposite to it is expanded. Since the inside of the ring-shaped tube 18 is filled with a noncompressive liquid, the volume of the tube as a whole is not changed. The height (h), from the bottom face of a support stand 16, of the center of gravity of the IC chip 22 is not changed. A cradle is turned by making use of the center of gravity of the IC chip 22 as the center. As a result, the cradle 14 changes its angle in such a way that the bonding face of the IC chip 22 follows the pressurization face 2a of the bonding tool 2. Thereby, the dislocation of the parallelism between the electrode 23 on the IC chip 22 and the lead 26 on a TAB tape 24 is compensated.

7. 发明专利

JPS6310011A STRIP EDGER 失效
公开(公告)号：JPS6310011A
公开(公告)日：1988-01-16
申请号：JP15446886
申请日：1986-07-01
申请人： ISHIKAWAJIMA HARIMA HEAVY IND , NIPPON STEEL CORP
发明人： TAZOE NOBUHIRO , YAMAMOTO TOSHIO , MATOBA SATORU , IGARASHI YASUO
IPC分类号： B21B1/26 , B21B13/06
摘要： PURPOSE:To improve the width accuracy by pressing the top surface of a strip in the vicinity of the gap between edge rolls by a downward pressing roll and installing a strip push up roll to keep a winding angle of the strip large. CONSTITUTION:An adjustment driving device 10 increases a looper angle to raise a looper roll 9 to push up a strip 3 on the upstream side of a downward pressing roll 7. A lifting device 11 raises a strip push up roll 12 to keep a winding angle alpha of the strip 3 toward the roll 7 large. The width accuracy is improved by a device with that composition.

8. 发明专利

JPS58122189A AUTOMATIC CONTROLLING METHOD OF FORGE WELDING TEMPERATURE OF FORGE-WELDED STEEL PIPE 失效
公开(公告)号：JPS58122189A
公开(公告)日：1983-07-20
申请号：JP224982
申请日：1982-01-12
申请人： NIPPON STEEL CORP
发明人： FUKUDA TOYOTOSHI , IWANAGA YOSHIO , YAMAMOTO TOSHIO , KOUNO TOMOHIDE
IPC分类号： B23K13/02 , B23K13/08
摘要： PURPOSE:To manufacture a product which is satisfactory in a quality of a butt welding part, by measuring a temperature of a pipe-like skelp edge part before forge welding, and adjusting an output of a heating coil so that a temperature of both edge parts becomes within a target range. CONSTITUTION:A control device 11 inputs and operates a signal from a forge welding thermometer 7 and a signal from a skelp thermometer 9, and sends a control signal to a thyristor voltage regulator 14. A voltage level is controlled by the thyristor voltage regulator 14, a high frequency current is generated by a high frequency oscillator 13, thereby a current flowing to a high frequency induction heating coil 6 is controlled. Also, a control signal is sent to a left and right adjusting device 15 for adjusting the left and right position of the high frequency induction heating coil 6, and the left and right position of the high frequency induction heating coil 6 forming one body structure with a transformer 12 is controlled.

9. 发明专利

JPS5170167A Denbokokanyosetsubuno shiimugyatsupukeijosokuteisochi 失效
公开(公告)号：JPS5170167A
公开(公告)日：1976-06-17
申请号：JP14469574
申请日：1974-12-16
申请人： Nippon Steel Corp
发明人： TANIMOTO MITSUO , OOKUBO NAOTAKE , YAMAMOTO TOSHIO , OKAYA HIDEYUKI
IPC分类号： G01B15/04 , B21C37/08 , G01B15/00 , G01N27/00

10. 发明专利

JPH1154517A METHOD AND DEVICE FOR ARRANGEMENT OF MICROSCOPIC BALLS 失效
公开(公告)号：JPH1154517A
公开(公告)日：1999-02-26
申请号：JP22621297
申请日：1997-08-22
申请人： NIPPON STEEL CORP
发明人： HASHINO HIDEJI , SHIMOKAWA KENJI , TATSUMI KOHEI , YAMAMOTO TOSHIO
IPC分类号： B23P21/00 , B25J15/06 , H01L21/321 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To prevent a trouble wherein microscopic balls are vacuum-sucked in dumpling form on the center part of an arrangement substrate when the microscopic balls are re-vacuum-sucked to the arrangement substrate, and to shorten the time required for re-vacuum-suction when the vacuum-suction failure is caused. SOLUTION: A plurality of ball vacuum-suction holes 3a to 3d which are formed on an arrangement substrate 1 are divided into a plurality of area 11 to 14, and a plurality of pressure reducing/pressure adding systems 2a to 2d are provided corresponding to the areas 11 to 14. A pressure reducing/adding operation is conducted independently for the ball attracting holes 3a to 3d of the area 11 to 14, the vacuum-suction failure of balls is prevented as much as possible, and the re-vacuum-suction processing can be made for microscopic ball 4 on the pressure reducing/adding systems 2a to 2d only where the balls are incorrectly vacuum-sucked.

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