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21. 发明授权

US4110364A Curable resin compositions of cyanate esters 失效
标题翻译：氰酸酯的可固化树脂组合物
公开(公告)号：US4110364A
公开(公告)日：1978-08-29
申请号：US559650
申请日：1975-03-18
申请人： Morio Gaku , Kazuhiro Suzuki , Kazuyuki Nakamichi
发明人： Morio Gaku , Kazuhiro Suzuki , Kazuyuki Nakamichi
IPC分类号： C08F2/50 , C08G73/12 , C08G73/00
CPC分类号： C08G73/121
摘要： A curable resin composition comprising(a) a cyanate ester component selected from the group consisting of polyfunctional aromatic cyanate ester monomers having at least 2 cyanate groups bonded to their aromatic ring, prepolymers of the cyanate esters and prepolymers of the cyanate ester monomers and amines, and(b) a bismaleimide component selected from the group consisting of bismaleimides, bismaleimide prepolymers and prepolymers of the bismaleimides and amines;The weight ratio of the component (a) to (b) being 1:99 to 99:1.
摘要翻译：一种可固化树脂组合物，其包含（A）选自由多官能芳族羧酸酯单体组成的组中的氰基酯组分，所述单体具有至少两个与其芳族环结合的氰基团，氰基酯和氰基酯单体和氨基酸的预聚物，和（B）由BISMALEIMIDES，BISMALEIMIDES和BISMALEIMIDES和AMINES的制备物组成的组所选择的二氯甲烷组分; 组分（A）至（B）的重量比为1:99至99：1。

22. 发明授权

US07140103B2 Process for the production of high-density printed wiring board 有权
标题翻译：生产高密度印刷线路板的工艺
公开(公告)号：US07140103B2
公开(公告)日：2006-11-28
申请号：US10170614
申请日：2002-06-14
申请人： Morio Gaku , Nobuyuk Ikeguchi , Katsuji Komatsu , Yasuo Tanaka , Keiichi Iwata , Ken-ichi Shimizu
发明人： Morio Gaku , Nobuyuk Ikeguchi , Katsuji Komatsu , Yasuo Tanaka , Keiichi Iwata , Ken-ichi Shimizu
IPC分类号： H01K3/10
CPC分类号： H05K3/025 , H05K3/108 , H05K3/427 , H05K2201/0347 , H05K2203/0723 , Y10T29/49155 , Y10T29/49165
摘要： Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 μm thickness, forming an electrolytic copper plating layer of 0.5 to 3 μm thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 μm thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.
摘要翻译：一种制造高密度印刷电路板的方法，包括：提供一种具有孔和最外铜箔厚度为5μm或更小的超薄铜箔包覆板，通过无电镀铜将表面镀覆以形成0.1层使用无电镀铜层作为电极，形成0.5〜3μm厚的电解镀铜层，在铜镀层的一部分上形成电镀抗蚀剂层，形成6〜30μm的图案镀铜层通过电解电镀，去除电镀抗蚀剂层，并蚀刻整个表面以除去薄的电解铜层，化学镀铜层和超薄铜箔层至少在铜表面上形成的电镀抗蚀剂层的厚度其中未形成图案铜镀层。

23. 发明授权

US4937132A Laminating material for printed circuit board of low dielectric constant 失效
标题翻译：低介电常数印刷电路板层压材料
公开(公告)号：US4937132A
公开(公告)日：1990-06-26
申请号：US288370
申请日：1988-12-22
申请人： Morio Gaku , Hidenori Kinbara
发明人： Morio Gaku , Hidenori Kinbara
IPC分类号： H05K1/02 , H05K1/03
CPC分类号： H05K1/0366 , H05K1/024 , H05K2201/0145 , H05K2201/015 , H05K2201/0278 , H05K2201/029 , H05K2203/095 , Y10S428/901 , Y10T428/24917 , Y10T428/249921 , Y10T428/249922 , Y10T428/31504 , Y10T428/31678 , Y10T428/31725 , Y10T428/31935 , Y10T442/3065 , Y10T442/3528
摘要： A printed circuit board material composed of a reinforcing base material and a cured or uncured resin is disclosed, in which the base material is a fabric woven from hybrid yarns each of which is prepared from (I-1) at least one multifilament yarn made of glass fiber having a dielectric constant at 1 MHz of not higher than 5.5 or (I-2) at least one multifilament yarn made of heat resistant engineering plastic fiber having a dielectric constant at 1 MHz of not higher than 5.5 and (II) at least one yarn made of fluoroplastic long fiber and the thermosetting resin is a thermosetting resin whose dielectric constant after curing is not higher than 3.7. The material is excellent in dielectric properties and characteristics required for use in printed circuit board, such as heat resistance in soldering, flexural strength and peel strength of copper foil. The material shows substantial constancy of dielectric constant even with change of resin content and is therefore particularly suitable for use in a multilayer printed circuit board.

24. 发明授权

US4917758A Method for preparing thin copper foil-clad substrate for circuit boards 失效
标题翻译：电路板用薄铜箔基板的制备方法
公开(公告)号：US4917758A
公开(公告)日：1990-04-17
申请号：US354954
申请日：1989-05-19
申请人： Koichi Ishizuka , Morio Gaku , Kenzi Ishii , Hidenori Kinbara , Masakazu Motegi
发明人： Koichi Ishizuka , Morio Gaku , Kenzi Ishii , Hidenori Kinbara , Masakazu Motegi
IPC分类号： C23F1/18 , H05K3/06
CPC分类号： C23F1/18 , H05K3/06 , H05K2203/0353
摘要： A method for preparing a thin copper foil-clad substrate for the manufacture therefrom of circuit boards, which comprises subjecting a copper foil-clad circuit board substrate comprising an electrically insulating support having provided on one or both sides thereof a copper foil having an average thickness of 12 .mu.m or more to etching with an etching solution for copper, the etching being performed such that the whole surface of the copper foil is etched at a predetermined etching rate selected from the range of from 0.01 to 0.3 .mu.m/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80% of its original thickness, and the variation of the thickness of the copper foil remaining after the etching is within .+-.2.0 .mu.m on the basis of a desired thickness.

25. 发明授权

US4429112A Process of delaying cure of curable resin composition containing cyanate ester compound with benzene sulfonic acid compound 失效
标题翻译：含有氰酸酯化合物的固化性树脂组合物与苯磺酸化合物的固化延迟的方法
公开(公告)号：US4429112A
公开(公告)日：1984-01-31
申请号：US383975
申请日：1982-06-01
申请人： Morio Gaku , Syunichi Nagai , Hidenori Kimpara , Satoshi Ayano
发明人： Morio Gaku , Syunichi Nagai , Hidenori Kimpara , Satoshi Ayano
IPC分类号： C08G59/40 , C08G85/00
CPC分类号： C08G85/004 , C08G59/4014
摘要： A method for delaying curing rate of a curable resin composition comprising a polyfunctional cyanate ester compound or mixture of a polyfunctional cyanate ester compound and a polyfunctional maleimide compound, characterized in that a specific benzene sulfonic acid is added to said composition is disclosed.
摘要翻译：一种延迟固化性树脂组合物的固化速率的方法，其包括多官能氰酸酯化合物或多官能氰酸酯化合物和多官能马来酰亚胺化合物的混合物，其特征在于向所述组合物中加入特定的苯磺酸。

26. 发明授权

US4396679A Plastic articles suitable for electroless plating 失效
标题翻译：塑料制品适用于化学镀
公开(公告)号：US4396679A
公开(公告)日：1983-08-02
申请号：US274502
申请日：1981-06-16
申请人： Morio Gaku , Yukiya Masuda , Akira Katata , Kanzi Ishikawa , Nobuyuki Ikeguchi
发明人： Morio Gaku , Yukiya Masuda , Akira Katata , Kanzi Ishikawa , Nobuyuki Ikeguchi
IPC分类号： B32B25/08 , B32B27/00 , B32B33/00 , C08J7/04 , C08K5/315 , C23C18/20 , H05K3/18 , H05K3/38 , B32B27/36 , B32B27/38
CPC分类号： H05K3/387 , C08J7/047 , C08K5/315 , C23C18/20 , C23C18/206 , C23C18/208 , C23C18/24 , C23C18/28 , C08J2421/00 , H05K2201/0133 , H05K3/181 , Y10T428/31507 , Y10T428/31511 , Y10T428/31554 , Y10T428/31562 , Y10T428/31565 , Y10T428/31569 , Y10T428/31573 , Y10T428/31587 , Y10T428/31598 , Y10T428/31605 , Y10T428/31667 , Y10T428/31721 , Y10T428/31728 , Y10T428/31732 , Y10T428/31797 , Y10T428/31833 , Y10T428/31855 , Y10T428/31862 , Y10T428/3187 , Y10T428/31913 , Y10T428/31917 , Y10T428/31928
摘要： A plastic article in which a semi-cured or cured product of a curable resin composition comprising a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of said cyanate esters, coprepolymers of said cyanate esters and an amine and mixtures thereof, (b) at least one diene-type rubber and optionally (c) at least one compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimides or coprepolymers of the maleimides and an amine is formed on a plastic substrate is disclosed.
摘要翻译：一种塑料制品，其中固化树脂组合物的半固化或固化产物包含（a）至少一种氰化物化合物的混合物和/或预反应产物，所述氰化物选自多官能氰酸酯，所述氰酸酯的预聚物酯类，所述氰酸酯的共聚物和胺及其混合物，（b）至少一种二烯型橡胶和任选的（c）至少一种选自多官能马来酰亚胺，马来酰亚胺或共聚物的预聚物的化合物公开了在塑料基板上形成马来酰亚胺和胺。

27. 发明授权

US4393195A Curable cyanate ester/acrylic epoxy ester composition 失效
标题翻译：可溶性氰酸酯/丙烯酸环氧酯组合物
公开(公告)号：US4393195A
公开(公告)日：1983-07-12
申请号：US175510
申请日：1980-08-05
申请人： Morio Gaku , Nobuyuki Ikeguchi , Satoshi Ayano
发明人： Morio Gaku , Nobuyuki Ikeguchi , Satoshi Ayano
IPC分类号： C08G73/00 , C08F220/32 , C08G59/40 , C08G73/06 , C08G73/12 , C09D163/00 , C09D179/08 , C08G83/00
CPC分类号： C08G73/12 , C08F220/32 , C08G59/4014
摘要： A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) polyfunctional cyanate ester, prepolymer of the cyanate ester, or coprepolymer of the cyanate ester and an amine, and (b) acrylic epoxy esters, methacrylic epoxy esters, prepolymers of acrylic epoxy esters, prepolymers methacrylic epoxy esters, coprepolymers of acrylic epoxy esters and methacrylic epoxy esters and mixtures thereof, and a curable resin composition comprising a mixture or a preliminary reaction product of above component (a), above component (b) and (c) a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine are disclosed. Cured resin having excellent impact-resistance, adhesive power, heat-resistance and chemical resistance can be prepared from the compositions.
摘要翻译：一种可固化树脂组合物，其包含（a）多官能氰酸酯，氰酸酯或氰酸酯与胺的共聚物的预聚物的混合物和/或预反应产物，和（b）丙烯酸环氧酯，甲基丙烯酸环氧酯，丙烯酸环氧酯的预聚物，丙烯酸环氧酯的预聚物，甲基丙烯酸环氧酯，丙烯酸环氧酯和甲基丙烯酸环氧酯的共聚物及其混合物，以及包含上述组分（a），组分（b）和组分（b）上的混合物或预反应产物（c）多官能马来酰亚胺，马来酰亚胺或马来酰亚胺和胺的共聚物的预聚物。可以从组合物制备具有优异抗冲击性，粘合力，耐热性和耐化学性的固化树脂。

28. 发明授权

US06350952B1 Semiconductor package including heat diffusion portion 失效
标题翻译：包括热扩散部分的半导体封装
公开(公告)号：US06350952B1
公开(公告)日：2002-02-26
申请号：US09402400
申请日：1999-10-05
申请人： Morio Gaku , Nobuyuki Ikeguchi , Toshihiko Kobayashi
发明人： Morio Gaku , Nobuyuki Ikeguchi , Toshihiko Kobayashi
IPC分类号： H01L2328
CPC分类号： H01L23/49816 , H01L21/4857 , H01L23/3121 , H01L23/3128 , H01L23/3677 , H01L23/49822 , H01L23/49827 , H01L23/49861 , H01L24/48 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/1433 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： Disclosed is a semiconductor plastic package having a structure in which a metal sheet having a size nearly equivalent to a printed wiring board is disposed nearly in the central portion in the thickness direction of the printed wiring board. The metal sheet and a signal propagation conductive circuit on a front surface of the printed wiring board are insulated from each other with a thermosetting resin composition. The conductive circuit on the printed wiring board surface is connected to a conductive circuit formed on an opposite surface of the printed wiring board, or to a conductive circuit pad formed for being connected with solder balls with a conductive through hole. A semiconductor chip, wire and bonding pad are encapsulated with a resin. The semiconductor plastic package has at least one blind via hole made in the opposite surface so as to be directly connected to the metal sheet. The blind via hole has an inner wall rendered thermally conductive. The printed wiring board is provided, on the semiconductor-chip-mounting side, with an elevated metal portion, a plurality of metal protrusions each having the form of a frustum of a pyramid or a cone, or at least one via hole having an inner wall rendered thermally conductive. A process for the production of a printed wiring board used for the above plastic package is also disclosed.
摘要翻译：公开了一种半导体塑料封装，其结构是将印刷电路板的尺寸几乎相等的金属板设置在印刷电路板的厚度方向上的中央部分。印刷电路板的表面上的金属片和信号传导导电电路用热固性树脂组合物彼此绝缘。印刷电路板表面上的导电电路连接到形成在印刷线路板的相对表面上的导电电路，或连接到形成为与具有导电通孔的焊球相连的导电电路板。半导体芯片，导线和焊盘用树脂封装。半导体塑料封装具有在相对表面上形成的至少一个盲通孔，以便直接连接到金属片。盲孔通孔具有导热的内壁。印刷电路板在半导体芯片安装侧设置有升高的金属部分，多个金属突起，每个金属突起均具有棱锥体或锥体的截头体形状，或至少一个通孔，其具有内部壁呈导热性。还公开了用于制造用于上述塑料封装的印刷电路板的方法。

29. 发明授权

US06229096B1 Nonwoven reinforcement for printed wiring base board and process for producing the same 有权
标题翻译：印刷布线基板用无纺布加固件及其制造方法
公开(公告)号：US06229096B1
公开(公告)日：2001-05-08
申请号：US09166578
申请日：1998-10-06
申请人： Morio Gaku , Mitsuru Nozaki , Kenji Saimen , Tamemaru Esaki
发明人： Morio Gaku , Mitsuru Nozaki , Kenji Saimen , Tamemaru Esaki
IPC分类号： H05K109
CPC分类号： D21H13/24 , D21H17/53 , D21H25/06 , H05K1/0366 , H05K2201/0141 , H05K2201/0145 , H05K2201/0166 , H05K2201/0278 , H05K2201/0293 , Y10T428/24322 , Y10T442/2475
摘要： There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement contains a wet system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290° C. or higher (component A) and a thermotropic cystalline polyester binder which has a melting point of 290° C. or higher and is in the form of a film having holes including at least 5 holes/mm2 each with an area of opening of 400 to 1000 &mgr;m2 (component B), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring (base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.
摘要翻译：公开了一种用于印刷布线基板的无纺布加强件，其中非织造材料增强件包含由熔点为290℃或更高的（A组分）的热致变性结晶聚酯纤维构成的湿系非织造织物和具有熔点为290℃以上，并且为具有包含至少5个孔/ mm 2的孔的膜的形式，每个孔的开口面积为400〜1000mum2（B成分），成分A被固定在组分B; 一种生产上述无纺布增强件的方法; 由上述无纺布加强件制成的印刷布线基板; 以及由上述印刷布线基板制造的印刷电路板。非织造布加强件和印刷布线（基底）板在诸如均匀性，尺寸稳定性，耐热性和电特性如介电常数和介电损耗角正切性等各种性能方面都是优异的。

30. 发明授权

US5076864A Process for producing multilayer printed wiring board 失效
标题翻译：生产多层印刷线路板的工艺
公开(公告)号：US5076864A
公开(公告)日：1991-12-31
申请号：US403519
申请日：1989-09-06
申请人： Yasuo Tanaka , Naohito Yoshimura , Koichi Nakano , Touru Nohtomi , Morio Gaku
发明人： Yasuo Tanaka , Naohito Yoshimura , Koichi Nakano , Touru Nohtomi , Morio Gaku
IPC分类号： C23C22/63 , H05K3/38 , H05K3/46
CPC分类号： H05K3/385 , C23C22/63 , H05K2203/0315 , H05K2203/1157 , H05K3/4611
摘要： A process for producing a multilayer printed wiring board, characterized in that copper surface of internal layer(s) is chemically oxidized, thereby forming a brown or black, oxidized copper surface on the internal layer board; and said oxidized copper surface of said internal layer board is treated with an acidic aqueous solution of a reducing agent containing at least one material selected from the group consisting of zinc formaldehyde sulfoxylate and sodium hypophosphite.

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