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    • 21. 发明授权
    • Sensing circuit, memory device and data detecting method
    • 感应电路,存储器和数据检测方法
    • US09437257B2
    • 2016-09-06
    • US13765513
    • 2013-02-12
    • Tien-Chun YangYue-Der ChihChan-Hong ChernTao Wen Chung
    • Tien-Chun YangYue-Der ChihChan-Hong ChernTao Wen Chung
    • G11C11/34G11C7/00G11C7/02G11C7/06G11C7/14G11C13/00
    • G11C7/062G11C7/14G11C13/004G11C2207/063
    • A sensing circuit includes a sensing resistor, a reference resistor and a comparator. The comparator has a first input coupled to the sensing resistor, a second input coupled to the reference resistor, and an output. The first input is configured to be coupled to a data bit line associated with a memory cell to receive a sensing input voltage caused by a cell current of the memory cell flowing through the sensing resistor. The second input is configured to be coupled to a reference bit line associated with a reference cell to receive a sensing reference voltage caused by a reference current of the reference cell flowing through the reference resistor. The comparator is configured to generate, at the output, an output signal indicating a logic state of data stored in the memory cell based on a comparison between the sensing input voltage and the sensing reference voltage.
    • 感测电路包括感测电阻器,参考电阻器和比较器。 比较器具有耦合到感测电阻器的第一输入端,耦合到参考电阻器的第二输入端和输出端。 第一输入被配置为耦合到与存储器单元相关联的数据位线,以接收由流过感测电阻器的存储单元的单元电流引起的感测输入电压。 第二输入被配置为耦合到与参考单元相关联的参考位线,以接收由参考电池流过参考电阻器的参考电流引起的感测参考电压。 比较器被配置为基于感测输入电压和感测参考电压之间的比较,在输出处产生指示存储在存储器单元中的数据的逻辑状态的输出信号。
    • 25. 发明申请
    • High-Voltage BJT Formed Using CMOS HV Processes
    • 使用CMOS HV工艺形成高压BJT
    • US20100301453A1
    • 2010-12-02
    • US12750503
    • 2010-03-30
    • Tao Wen ChungPo-Yao KeWei-Yang LinShine Chung
    • Tao Wen ChungPo-Yao KeWei-Yang LinShine Chung
    • H01L27/082
    • H01L27/0823H01L29/0692H01L29/0821H01L29/7322H01L29/735
    • An integrated circuit device includes a semiconductor substrate having a top surface; at least one insulation region extending from the top surface into the semiconductor substrate; a plurality of base contacts of a first conductivity type electrically interconnected to each other; and a plurality of emitters and a plurality of collectors of a second conductivity type opposite the first conductivity type. Each of the plurality of emitters, the plurality of collectors, and the plurality of base contacts is laterally spaced apart from each other by the at least one insulation region. The integrated circuit device further includes a buried layer of the second conductivity type in the semiconductor substrate, wherein the buried layer has an upper surface adjoining bottom surfaces of the plurality of collectors.
    • 集成电路器件包括具有顶表面的半导体衬底; 至少一个绝缘区域,从所述顶表面延伸到所述半导体衬底中; 多个彼此电互连的第一导电类型的基座触头; 以及与第一导电类型相反的第二导电类型的多个发射极和多个集电极。 多个发射器,多个集光器和多个基座触点中的每一个通过至少一个绝缘区域彼此横向间隔开。 集成电路装置还包括在半导体衬底中的第二导电类型的掩埋层,其中掩埋层具有邻接多个集电极的底表面的上表面。