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    • 25. 发明申请
    • Helical resonator type plasma processing apparatus
    • 螺旋谐振器型等离子体处理装置
    • US20050093460A1
    • 2005-05-05
    • US10978391
    • 2004-11-02
    • Dae-il KimDong-joon MaGook-yoon KimSung-kyu Choi
    • Dae-il KimDong-joon MaGook-yoon KimSung-kyu Choi
    • H05H1/46H01J7/24H01J37/32H01L21/00H01L21/205H01L21/3065H05H1/00
    • H01J37/32697H01J37/321H01J37/3211
    • Provided is helical resonator plasma processing apparatus. The plasma processing apparatus comprises a process chamber having a substrate holder for supporting a substrate, a dielectric tube disposed on the process chamber to communicate with the process chamber, a helix coil wounded around the dielectric tube, and an RF power source to supply RF power to the helix coil. The dielectric tube has a double tube shape and comprises an inner tube and an outer tube, and a plasma source gas inlet port to supply plasma source gas into a space between the inner tube and the outer tube is disposed in the outer tube. A control electrode to control plasma potential is disposed in the dielectric tube. This plasma processing apparatus provides a uniform plasma density distribution along a radial direction of a wafer, and easy control of the plasma potential in the process chamber.
    • 提供螺旋谐振器等离子体处理装置。 等离子体处理装置包括具有用于支撑基板的基板保持器的处理室,设置在处理室上以与处理室连通的介电管,缠绕在介质管周围的螺旋线圈,以及RF电源,以提供RF功率 到螺旋线圈。 电介质管具有双管形状并且包括内管和外管,并且在外管中设置有用于将等离子体源气体供应到内管和外管之间的空间中的等离子体源气体入口。 用于控制等离子体电位的控制电极设置在电介质管中。 这种等离子体处理装置沿着晶片的径向方向提供均匀的等离子体密度分布,并且容易控制处理室中的等离子体电位。
    • 26. 发明授权
    • Inductively coupled antenna and plasma processing apparatus using the same
    • 电感耦合天线和使用其的等离子体处理装置
    • US07740738B2
    • 2010-06-22
    • US10748277
    • 2003-12-31
    • Tae-wan KimYuri Nikolaevich TolmachevDong-joon Ma
    • Tae-wan KimYuri Nikolaevich TolmachevDong-joon Ma
    • C23C16/00H01L21/306
    • H01J37/321
    • An inductively coupled antenna for installation on a reaction chamber of an inductively coupled plasma (ICP) processing apparatus and for connection to a radio frequency (RF) power source to induce an electric field for ionizing a reactant gas injected into the reaction chamber and for generating plasma includes a coil having a plurality of turns including an outermost turn and a plurality of inner turns, wherein a current flowing through the outermost turn is larger than a current flowing through the plurality of inner turns. The outermost turn and the inner turns are connected to the RF power supply in parallel and the inner turns are connected to each other in series. The inductively coupled antenna further includes a conductive metal tube that has a cooling path and a conductive metal strip that is electrically and thermally connected to a lower portion of the metal tube.
    • 一种电感耦合天线,用于安装在电感耦合等离子体(ICP)处理装置的反应室上,并用于连接到射频(RF)电源,以诱发用于电离注入反应室的反应气体的电场并产生 等离子体包括具有多个匝的线圈,其包括最外匝和多匝,其中流过最外匝的电流大于流过多个内匝的电流。 最外圈和内圈与RF电源并联连接,内圈相互串联连接。 电感耦合天线还包括导电金属管,该导电金属管具有电连接和热连接到金属管的下部的导电金属带。
    • 27. 发明授权
    • Ionized physical vapor deposition apparatus using helical self-resonant coil
    • 电离物理气相沉积装置采用螺旋自谐振线圈
    • US07404879B2
    • 2008-07-29
    • US10932076
    • 2004-09-02
    • Yuri Nikolaevich TolmachevDong-joon MaSergiy Yakovlevich NavalaDae-il Kim
    • Yuri Nikolaevich TolmachevDong-joon MaSergiy Yakovlevich NavalaDae-il Kim
    • C23C14/04C23C14/34C23C14/36C23C14/42
    • H01J37/321C23C14/358H01J37/3408
    • Provided is an ionized physical vapor deposition (IPVD) apparatus having a helical self-resonant coil. The IPVD apparatus comprises a process chamber having a substrate holder that supports a substrate to be processed, a deposition material source that supplies a material to be deposited on the substrate into the process chamber, facing the substrate holder, a gas injection unit to inject a process gas into the process chamber, a bias power source that applies a bias potential to the substrate holder, a helical self-resonant coil that produces plasma for ionization of the deposition material in the process chamber, one end of the helical self-resonant coil being grounded and the other end being electrically open, and an RF generator to supply an RF power to the helical self-resonant coil. The use of a helical self-resonant coil enables the IPVD apparatus to ignite and operate at very low chamber pressure such as approximately 0.1 mtorr, and to produce high density plasma with high efficiency compared to a conventional IPVD apparatus. Accordingly, a high efficiency of ionization of deposition material is achieved.
    • 提供了一种具有螺旋自谐振线圈的电离物理气相沉积(IPVD)装置。 IPVD装置包括具有支撑待处理基板的基板保持器的处理室,将要沉积在基板上的材料供给到面向基板保持器的处理室中的沉积材料源,注入单元 将处理气体进入处理室,向衬底保持器施加偏置电位的偏压电源,产生用于离子化处理室中的沉积材料的等离子体的螺旋自谐振线圈,螺旋自谐振线圈的一端 接地并且另一端电气打开,以及RF发生器,用于向螺旋自谐振线圈提供RF功率。 螺旋自谐振线圈的使用使得IPVD装置能够在非常低的室压力(例如约0.1mtorr)下点燃和操作,并且与传统的IPVD装置相比,可以高效率地产生高密度等离子体。 因此,实现了沉积材料的高效离子化。
    • 28. 发明授权
    • High-density plasma processing apparatus
    • 高密度等离子体处理装置
    • US07210424B2
    • 2007-05-01
    • US10843430
    • 2004-05-12
    • Yuri Nikolaevich TolmachevSergiy Yakovlevich NavalaDong-joon MaDae-il Kim
    • Yuri Nikolaevich TolmachevSergiy Yakovlevich NavalaDong-joon MaDae-il Kim
    • C23C16/00C23F1/00H01L21/306
    • H01J37/32211H01J37/321
    • A high-density plasma processing apparatus includes a processing chamber, having a susceptor for supporting an object to be processed positioned therein and a dielectric window positioned on the processing chamber to form an upper surface of the processing chamber. A reaction gas injection device injects a reaction gas into an interior of the processing chamber. An inductively coupled plasma (ICP) antenna, which is installed on a center of the dielectric window, transfers radio frequency (RF) power from an RF power supply to the interior of the processing chamber. A waveguide guides a microwave generated by a microwave generator. A circular radiative tube, which is installed on the dielectric window around the ICP antenna and is connected to the waveguide, radiates a microwave toward the interior of the processing chamber via a plurality of slots formed through a bottom wall of the radiative tube.
    • 高密度等离子体处理设备包括处理室,其具有用于支撑待处理物体的基座,以及位于处理室上的介电窗口,以形成处理室的上表面。 反应气体注入装置将反应气体注入到处理室的内部。 安装在电介质窗口的中心的电感耦合等离子体(ICP)天线将射频(RF)功率从RF电源传送到处理室的内部。 波导引导微波发生器产生的微波。 安装在ICP天线周围的电介质窗口并连接到波导的圆形辐射管通过经由辐射管的底壁形成的多个狭槽向处理室的内部辐射微波。
    • 29. 发明授权
    • SONOS type memory device
    • SONOS型存储设备
    • US07053448B2
    • 2006-05-30
    • US11070090
    • 2005-03-03
    • Sang-hun JeonChung-woo KimDong-joon MaSung-kyu Choi
    • Sang-hun JeonChung-woo KimDong-joon MaSung-kyu Choi
    • H01L29/792
    • H01L21/02164H01L21/0217H01L21/02178H01L21/02181H01L21/022H01L21/28282H01L21/31616H01L21/31645H01L28/56H01L29/513H01L29/792
    • A SONOS type memory includes a semiconductor substrate, first and second impurity regions in the semiconductor substrate doped with impurity ions of a predetermined conductivity, separated a predetermined distance from each other, a channel region between the first and second impurity regions, and a data storage type stack on the semiconductor substrate between the first and second impurity regions. The data storage type stack includes a tunneling oxide layer, a memory node layer for storing data, a blocking oxide layer, and an electrode layer, which are sequentially formed. A dielectric constant of the memory node layer is higher than dielectric constants of the tunneling and the blocking oxide layers, and a band offset of the memory node layer is lower than band offsets of the tunneling and the blocking oxide layers. The tunneling oxide layer and the blocking oxide layer are high dielectric insulating layers.
    • SONOS型存储器包括半导体衬底,半导体衬底中掺杂有预定电导率的杂质离子的第一和第二杂质区,彼此隔开预定距离,第一和第二杂质区之间的沟道区,以及数据存储 在第一和第二杂质区之间的半导体衬底上。 数据存储型堆叠包括依次形成的隧道氧化物层,用于存储数据的存储节点层,阻挡氧化物层和电极层。 存储节点层的介电常数高于隧道和阻塞氧化物层的介电常数,并且存储器节点层的带偏移低于隧道和阻塞氧化物层的带偏移。 隧道氧化物层和阻挡氧化物层是高介电绝缘层。