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    • 23. 发明授权
    • Integrated dynamic memory cell having a small area of extent, and a method for its production
    • 具有小范围的集成动态存储单元及其制造方法
    • US06534820B2
    • 2003-03-18
    • US09745565
    • 2000-12-21
    • Franz HofmannWolfgang KrautschneiderTill Schlösser
    • Franz HofmannWolfgang KrautschneiderTill Schlösser
    • H01L29788
    • H01L27/10844H01L27/108H01L27/10876
    • An integrated dynamic memory cell having a small area of extent on a semiconductor substrate is described. The memory cell has a selection MOSFET with a gate connection area that is connected to a word line, a source connection doping area which is connected to a bit line, and a drain connection doping area. A memory MOSFET has a gate connection area which is connected via a thin dielectric layer to a connection doping region which connects a source connection doping area of the memory MOSFET to the drain connection doping area of the selection MOSFET. The memory MOSFET further has a drain connection doping area that is connected to a supply voltage. The selection and memory MOSFETs are disposed on opposite sidewalls of a trench, which is etched in the substrate, and the connection doping region forms a bottom of the trench.
    • 描述在半导体衬底上具有小面积范围的集成动态存储单元。 存储单元具有选择MOSFET,其具有连接到字线的栅极连接区域,连接到位线的源极连接掺杂区域和漏极连接掺杂区域。 存储器MOSFET具有通过薄介电层连接到将存储器MOSFET的源极连接掺杂区域连接到选择MOSFET的漏极连接掺杂区域的连接掺杂区域的栅极连接区域。 存储器MOSFET还具有连接到电源电压的漏极连接掺杂区域。 选择和存储器MOSFET被布置在沟槽的相对的侧壁上,沟槽被蚀刻在衬底中,并且连接掺杂区域形成沟槽的底部。
    • 24. 发明授权
    • Memory cell configuration and production process therefor
    • 内存单元配置及其生产过程
    • US06274453B1
    • 2001-08-14
    • US09405916
    • 1999-09-24
    • Till SchlösserFranz HofmannWolfgang Krautschneider
    • Till SchlösserFranz HofmannWolfgang Krautschneider
    • H01L2120
    • H01L27/10876H01L27/10805H01L27/10808
    • A memory cell configuration with many ferroelectric or dynamic memory cells provided in a semiconductor substrate. Alternating trenches and lands extend parallel in a longitudinal direction of a main face of the semiconductor substrate. A channel stop layer is buried in the lands and divides the semiconductor substrate into a lower region that includes the trench bottoms and an upper region that includes the land ridges. First planar selection transistors with intervening trench channel stop regions are disposed along the trench bottoms. Second planar selection transistors with intervening land channel stop regions are disposed along the land ridges. The first and second selection transistors have respective source, gate, channel and drain regions, which are offset longitudinally from one another such that source and drain regions of the first and second selection transistors alternate in the transverse direction in the main face of the semiconductor substrate. Isolated word lines are provided which extend in the transverse direction along the main face for triggering the first and second selection transistors in the respective gate regions. Isolated bit lines are provided which extend in an oblique direction along the main face for connecting the first and second selection transistors in the respective source regions. And preferably ferroelectric capacitors are each connected to the drain regions of applicable selection transistors via capacitor contacts.
    • 具有设置在半导体衬底中的许多铁电或动态存储单元的存储单元配置。 交替沟槽和焊盘在半导体衬底的主面的纵向方向上平行延伸。 沟道阻挡层埋在焊盘中,并将半导体衬底分成包括沟槽底部的下部区域和包括焊盘脊的上部区域。 具有中间沟槽沟道阻挡区域的第一平面选择晶体管沿沟槽底部设置。 具有中间的槽脊通道停止区域的第二平面选择晶体管沿着脊脊布置。 第一和第二选择晶体管具有各自的源极,栅极,沟道和漏极区域,它们彼此纵向偏移,使得第一和第二选择晶体管的源极和漏极区域在半导体衬底的主面中在横向方向上交替 。 提供隔离的字线,其沿着主面沿横向方向延伸,用于触发各个栅极区域中的第一和第二选择晶体管。 提供了沿着主面沿倾斜方向延伸的隔离位线,用于连接各个源极区域中的第一和第二选择晶体管。 并且优选地,铁电电容器通过电容器触点连接到适用的选择晶体管的漏极区域。
    • 25. 发明授权
    • Memory cell configuration and corresponding fabrication method
    • 存储单元配置及相应的制造方法
    • US06258658B1
    • 2001-07-10
    • US09250362
    • 1999-02-12
    • Thomas BöhmVolker WeinrichManfred HainArmin KohlhaseYoichi OtaniAndreas RuschTill Schlösser
    • Thomas BöhmVolker WeinrichManfred HainArmin KohlhaseYoichi OtaniAndreas RuschTill Schlösser
    • H01L218242
    • H01L27/10823H01L27/10808
    • The memory cell configuration has a multiplicity of preferably ferroelectric memory cells in a semiconductor substrate. Mutually parallel bit line trenches run in the longitudinal direction in the main surface of the semiconductor substrate. Bit lines are disposed in the bottoms of the trenches. Source/drain regions are formed in the crowns of the trenches. Channel regions are provided in the walls of the trenches. The channel region on a wall in each case is configured such that a drivable selection transistor of the relevant memory cell is formed there, while the channel region on the other wall is configured such that the transistor located there is closed. Insulated word lines for driving the selection transistors run in the transverse direction along the main surface of the semiconductor substrate through the bit line trenches. Insulation trenches for insulating the source/drain regions in the longitudinal direction of neighboring memory cells run in the transverse direction in the main surface of the semiconductor substrate. A respective, preferably ferroelectric, capacitor is connected to the source/drain region of the respective memory cell and is arranged above the word lines.
    • 存储单元配置在半导体衬底中具有多个优选铁电存储单元。 相互并行的位线沟槽在半导体衬底的主表面中沿纵向延伸。 位线设置在沟槽的底部。 源极/漏极区域形成在沟槽的冠部中。 通道区域设置在沟槽的壁中。 在每种情况下,壁上的沟道区域被构造成使得相关存储单元的可驱动选择晶体管形成在其中,而另一壁上的沟道区域被配置为使得位于那里的晶体管闭合。 用于驱动选择晶体管的绝缘字线通过位线沟槽沿着半导体衬底的主表面在横向方向上延伸。 用于绝缘沟槽,用于使相邻存储单元的纵向上的源极/漏极区域绝缘,在半导体衬底的主表面中沿横向延伸。 相应的优选铁电电容器连接到相应存储单元的源极/漏极区域并且被布置在字线之上。
    • 27. 发明授权
    • Storage cell field and method of producing the same
    • 储存池场及其生产方法
    • US06873000B2
    • 2005-03-29
    • US10266188
    • 2002-10-07
    • Matthias GoldbachTill Schlösser
    • Matthias GoldbachTill Schlösser
    • H01L21/8242H01L27/02H01L27/108
    • H01L27/10864H01L27/0218H01L27/10861H01L27/10867
    • A storage cell field has a plurality of storage cells formed in a substrate of a first doping type, said storage cells comprising a trench capacitor arranged in said substrate and a selection transistor associated with said trench capacitor and provided with a transistor body which is arranged in said substrate. An implantation having an increased dopant concentration of the first doping type is provided in said substrate. This implantation prevents space-charge zones, which are located at the trench capacitors and which are caused in predetermined storage states of said trench capacitors, from constricting a substrate region, which is available for applying a predetermined potential to the transistor bodies, in such a way that said predetermined potential cannot be applied.
    • 存储单元场具有形成在第一掺杂类型的衬底中的多个存储单元,所述存储单元包括布置在所述衬底中的沟槽电容器和与所述沟槽电容器相关联的选择晶体管,所述晶体管本体被布置在 所述基板。 在所述衬底中提供具有增加的第一掺杂类型的掺杂剂浓度的注入。 这种注入防止位于沟槽电容器处并且在所述沟槽电容器的预定存储状态下引起的空间电荷区域将这种可用于向晶体管体施加预定电位的衬底区域收缩 不能应用所述预定电位的方式。