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21. 发明申请

US20070053264A1 Method for controlling recording power of optical disc apparatus 有权
标题翻译：控制光盘装置记录功率的方法
公开(公告)号：US20070053264A1
公开(公告)日：2007-03-08
申请号：US11476832
申请日：2006-06-29
申请人： Jin Yu
发明人： Jin Yu
IPC分类号： G11B7/12
CPC分类号： G11B7/1267 , G11B7/00736 , G11B20/1217 , G11B2020/1288 , G11B2220/2541
摘要： A method for controlling the recording power of an optical disc apparatus. The method can search for an optimum recording power using a starting power stored in a recordable high density optical disc based on a manufacturer thereof, and perform recording operations with the optimum recording power while the start power is properly varied through an Optimum Power Control (OPC) procedure. The method comprises the operations of: obtaining an initial start power for performing the OPC procedure of a recordable optical disc; performing the OPC procedure, and judging whether the initial start power is within a range of allowable levels for determining the optimum recording power of the optical disc; re-performing the OPC procedure by varying the initial start power when the initial start power deviates from the range of allowable levels; and storing the new start power when within the range of allowable levels for improved subsequent OPC procedures.
摘要翻译：一种用于控制光盘装置的记录功率的方法。该方法可以使用基于其制造商存储在可记录高密度光盘中的启动功率来搜索最佳记录功率，并且通过最佳功率控制（OPC）适当地改变启动功率，并以最佳记录功率执行记录操作）程序。该方法包括以下操作：获得用于执行可记录光盘的OPC过程的初始启动功率; 执行OPC程序，并且判断初始开始功率是否在用于确定光盘的最佳记录功率的允许水平的范围内; 当初始启动功率偏离允许电平的范围时，通过改变初始启动功率来重新执行OPC程序; 并且在用于改进的后续OPC过程的允许水平的范围内时存储新的启动功率。

22. 发明授权

US08656270B2 Change-oriented spreadsheet application 失效
标题翻译：面向变化的电子表格应用程序
公开(公告)号：US08656270B2
公开(公告)日：2014-02-18
申请号：US11839709
申请日：2007-08-16
申请人： SuYing Rui , FengLi Wang , Jin Yu , Li Yu
发明人： SuYing Rui , FengLi Wang , Jin Yu , Li Yu
IPC分类号： G06F17/40 , G06F17/16
CPC分类号： G06F17/246
摘要： The invention discloses a data organization method for a change oriented spreadsheet application. In one embodiment, the valid updates to cells and the update times are stored with the cell positions as the primary index, and the valid updates to the same cell are arranged in the order of time. In another embodiment, the valid updates to cells are stored with the update time points of the valid updates of the cells as the primary index, and all the valid updates at the same valid update time point are arranged into an update table, the update table having the same cell structure as the spreadsheet file. In yet another embodiment, data structures organized in both manners are maintained at the same time.
摘要翻译：本发明公开了一种面向变化的电子表格应用的数据组织方法。在一个实施例中，以小区位置为主要索引来存储对小区的有效更新和更新时间，并且按照时间顺序排列对相同小区的有效更新。在另一个实施例中，以小区的有效更新的更新时间点为单位存储对小区的有效更新，并且将相同有效更新时间点的所有有效更新排列在更新表中，更新表具有与电子表格文件相同的单元格结构。在另一个实施例中，同时保持以两种方式组织的数据结构。

23. 发明申请

US20110248834A1 METHOD AND SYSTEM FOR LOW COST, POWER EFFICIENT, WIRELESS TRANSPONDER DEVICES WITH ENHANCED FUNCTIONALITY 失效
公开(公告)号：US20110248834A1
公开(公告)日：2011-10-13
申请号：US12757094
申请日：2010-04-09
申请人： Robert WARNER , James Wang , Jack Winters , Ashok Waddodagi , Jin Yu , Yuzheng Zhang
发明人： Robert WARNER , James Wang , Jack Winters , Ashok Waddodagi , Jin Yu , Yuzheng Zhang
IPC分类号： H02J13/00 , H04Q5/22 , G08C19/16
CPC分类号： H04Q9/00 , H04Q2209/47
摘要： This invention provides a method and system for inventorying wireless transponders, specifically referred to as RFID transceiver devices. The RFID transceiver devices are certifiable by a recognized standards body, such as EPCglobal, or are compatible with recognized standards but have higher functionality than typical passive RFIDs, and yet are implemented with techniques that lower cost and battery requirements. Backscatter techniques of standard passive RFIDs are used to keep cost and battery requirements low. To provide higher functionality, a microcontroller is used in the RFID, along with a battery, but the clock frequency of the microcontroller is adjusted, based on external input, to minimize battery requirements. In one embodiment, the microcontroller initially has a zero or near zero clock frequency. A comparator compares the received RF energy to a threshold, and when the threshold is exceeded, indicating the presence of a probe signal from an RFID reader, the microcontroller clock frequency is immediately increased, and further adjusted based on the received data. In an alternate embodiment, the clock frequency of the microcontroller is adjusted based on data from sensors, to keep the clock speed at the proper speed to adequately process the data while minimizing the power requirement of the microcontroller, and then create an input to modulate the backscattered signal to be transmitted by the RFID. The received data can also cause the microcontroller to request the sensors to generate sensing data at a faster rate, which in turn requires the microcontroller clock to increase to handle the increased sensor data. In an additional embodiment, multiple sensors are multiplexed to provide a single input stream to the microcontroller, reducing the microcontroller clock speed required, along with the overall cost of the microcontroller and sensors.

24. 发明授权

US07553678B2 Method for detecting semiconductor manufacturing conditions 有权
标题翻译：检测半导体制造条件的方法
公开(公告)号：US07553678B2
公开(公告)日：2009-06-30
申请号：US11308343
申请日：2006-03-17
申请人： Wen-Zhan Zhou , Jin Yu , Kai-Hung Alex See
发明人： Wen-Zhan Zhou , Jin Yu , Kai-Hung Alex See
IPC分类号： G01R31/26
CPC分类号： G03F7/70625 , G03F7/70508 , H01L22/26 , H01L22/34
摘要： A method for detecting semiconductor-manufacturing conditions includes providing a photomask with a plurality of pattern areas each having a plurality of test lines with different pitches, exposing a plurality of wafer with the photomask in different manufacturing conditions, measuring the critical dimensions of the plurality of pattern areas, generating a library of relationships between the pitches and the critical dimension of the pattern areas, exposing a test wafer in an unknown manufacturing condition, finding out a relationships between the pitches and the critical dimension of the pattern areas of the test wafer, searching for a most similar relationship in the library, and detecting a set of manufacturing parameters used to expose the test wafer.
摘要翻译：一种用于检测半导体制造条件的方法包括提供具有多个图案区域的光掩模，每个图案区域具有多个具有不同间距的测试线，在不同制造条件下用光掩模曝光多个晶片，测量多个产生间距和图案区域的关键尺寸之间的关系库，使未知制造条件下的测试晶片暴露出来，找出测试晶片的图案区域的间距与临界尺寸之间的关系，在库中搜索最相似的关系，并且检测用于暴露测试晶片的一组制造参数。

25. 发明申请

US20080250181A1 SERVER 有权
标题翻译：服务器
公开(公告)号：US20080250181A1
公开(公告)日：2008-10-09
申请号：US12130742
申请日：2008-05-30
申请人： Minqiu Li , Feng Hong , Chunming Sheng , Tinghong Wang , Xing Rao , Jin Yu , Shaolin Zhang , Hansi Wang , Dingliang Gan
发明人： Minqiu Li , Feng Hong , Chunming Sheng , Tinghong Wang , Xing Rao , Jin Yu , Shaolin Zhang , Hansi Wang , Dingliang Gan
IPC分类号： G06F13/00
CPC分类号： G06F1/184
摘要： The present invention relates to the field of communications, in particular, to a server for solving the problem related to the incompatibility between normal blades and multi-processing blades in a conventional server. The server according to an embodiment of the invention includes a backboard, on which backboard wiring and a first slot are disposed. At least two second slots are further disposed on the backboard. Both a first interface configured to be connected to a normal blade and a second interface configured to be connected to a multi-processing blade are disposed on each of the second slots, the first interface being connected to a corresponding Cluster Switch interface disposed on the first slot via the backboard wiring, and the second interface being interconnected directly via the backboard wiring or being connected to a corresponding Symmetrical Multi-Processing Switch interface disposed on the first slot via the backboard wiring.
摘要翻译：本发明涉及通信领域，特别涉及用于解决常规服务器中普通刀片与多处理刀片之间不兼容问题的服务器。根据本发明的实施例的服务器包括背板，背板布线和第一槽被布置在该背板上。在背板上进一步设置至少两个第二槽。配置为连接到正常刀片的第一接口和被配置为连接到多处理刀片的第二接口设置在每个第二槽上，第一接口连接到布置在第一槽上的相应集群交换接口并且所述第二接口通过所述背板布线直接互连或者经由所述背板布线连接到布置在所述第一槽上的相应的对称多处理开关接口。

26. 发明授权

US07387910B2 Method of bonding solder pads of flip-chip package 失效
标题翻译：焊接倒装芯片封装的方法
公开(公告)号：US07387910B2
公开(公告)日：2008-06-17
申请号：US11403538
申请日：2006-04-13
申请人： Woong-Sun Lee , Jin Yu
发明人： Woong-Sun Lee , Jin Yu
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/52 , H01L23/48 , H01L23/40
CPC分类号： H01L24/13 , H01L24/02 , H01L24/06 , H01L24/11 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/13099 , H01L2224/132 , H01L2224/13287 , H01L2224/1329 , H01L2224/136 , H01L2224/1403 , H01L2224/8121 , H01L2224/81815 , H01L2924/00 , H01L2924/0001 , H01L2924/01006 , H01L2924/01028 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3484 , H05K2201/0212 , H05K2201/094 , H05K2201/10234 , H05K2201/10674 , H05K2203/041 , H05K2203/043 , Y02P70/613 , H01L2924/00014
摘要： Disclosed herein is a method of bonding solder pads of a flip-chip package. This invention relates to a method of bonding solder pads having different sizes to each other, when a bonding operation is executed between a chip and a PCB, between chips, or between PCBs. On a side having a larger solder pad, a general solder ball is used. Conversely, on a side having a smaller solder pad, a solder ball having a core is used. The core serves to maintain a predetermined interval between the chip and the PCB or between the chips, after the bonding operation has been completed. The solder bonded parts are aligned with each other so as to perform a final bonding operation. In a conventional flip-chip package, solder pads provided on a bonded part must have the same or similar size. According to this invention, even if the size difference between the solder pads is large, bonding is possible, thus ensuring electrical and mechanical reliability.
摘要翻译：这里公开了一种焊接倒装芯片封装的焊盘的方法。本发明涉及当在芯片和PCB之间，芯片之间或PCB之间执行接合操作时，将彼此不同尺寸的焊盘焊接的方法。在具有较大焊盘的一侧，使用一般的焊球。相反，在具有较小焊盘的一侧使用具有芯的焊球。芯片用于在焊接操作完成之后保持芯片和PCB之间或芯片之间的预定间隔。焊接接合部彼此对准，以进行最终接合操作。在传统的倒装芯片封装中，设置在接合部件上的焊盘必须具有相同或相似的尺寸。根据本发明，即使焊盘之间的尺寸差大，也可以进行接合，从而确保电气和机械的可靠性。

27. 发明申请

US20070294586A1 Automated Extensible User Interface Testing 有权
标题翻译：自动可扩展用户界面测试
公开(公告)号：US20070294586A1
公开(公告)日：2007-12-20
申请号：US11421363
申请日：2006-05-31
申请人： Ganesh Sankarakumar Parvathy , Dipti A. Patil , Jin Yu
发明人： Ganesh Sankarakumar Parvathy , Dipti A. Patil , Jin Yu
IPC分类号： G06F11/00
CPC分类号： G06F11/3672 , G06F11/3419
摘要： Automated extensible user interface testing supports testing of a user interface of a program. Test data is accessed, the test data including multiple test steps. Each test step describes at least a part of a test to be performed on the user interface. For each of the multiple test steps, one or more application program interface (API) methods to invoke to carry out the part of the test is determined. This determination is based at least in part on the test data and on an identification from the API of methods supported by the API. Each of the one or more API methods is then invoked to carry out the part of the test. Verification can be performed to ensure, for example, that specified files were created, or registry values were changed, or user interface elements appear and exist.
摘要翻译：自动扩展用户界面测试支持测试程序的用户界面。测试数据被访问，测试数据包括多个测试步骤。每个测试步骤描述要在用户界面上执行的测试的至少一部分。对于多个测试步骤中的每一个，确定一个或多个应用程序接口（API）方法来调用以执行部分测试。该确定至少部分地基于测试数据和来自API支持的方法的API的标识。然后调用一个或多个API方法中的每一个来执行测试的一部分。可以执行验证以确保例如指定的文件被创建，或注册表值被改变，或者用户界面元素出现和存在。

28. 发明申请

US20070258722A1 OPTICAL RECEIVER 审中-公开
标题翻译：光接收机
公开(公告)号：US20070258722A1
公开(公告)日：2007-11-08
申请号：US11745986
申请日：2007-05-08
申请人： Jin Yu
发明人： Jin Yu
IPC分类号： H04B10/06
CPC分类号： H04B10/673
摘要： An optical receiver for enhanced optical power sensitivity for optical signal at 10 Gbps includes an optical package and a supporting electrical circuitry. The optical package includes a semiconductor optical amplifier to pre-amplify the incoming weak signal, a tunable optical filter to suppress the spontaneous noise of the amplifier and a PIN diode as an optical detector. A supporting electrical circuitry includes a control loop for the filter to track the peak of the optical signal. By optimizing the parameters of all the elements, the final sensitivity of the optical receiver can be increased significantly. The device may be realized in a single package.
摘要翻译：用于以10Gbps的光信号提高光功率灵敏度的光接收器包括光学封装和支持电路。光学封装包括用于对输入的弱信号进行预放大的半导体光放大器，用于抑制放大器的自发噪声的可调谐滤光器以及作为光检测器的PIN二极管。支持电路包括用于滤波器跟踪光信号的峰值的控制回路。通过优化所有元件的参数，可以显着提高光接收机的最终灵敏度。该装置可以在单个包装中实现。

29. 发明申请

US20070199826A1 Method for manufacturing metal/carbon nanotube nano-composite using electroplating 审中-公开
标题翻译：使用电镀制造金属/碳纳米管纳米复合材料的方法
公开(公告)号：US20070199826A1
公开(公告)日：2007-08-30
申请号：US11589305
申请日：2006-10-30
申请人： Yoon-Chul Son , Jung-Joon Yoo , Jin Yu
发明人： Yoon-Chul Son , Jung-Joon Yoo , Jin Yu
IPC分类号： C25D3/56
CPC分类号： C25D15/02
摘要： Disclosed herein is a method for manufacturing metal/carbon nanotube nano-composite using electroplating, more particularly, to a method for manufacturing metal/carbon nanotube nano-composite comprising: adding carbon nanotubes and cationic surfactants in metal plating solution including metal or metal salt and performing electroplating in the cathode.According to the present invention, the method for manufacturing metal/carbon nanotube nano-composite using electroplating comprises: immersing carbon nanotubes in acid solution and filtering the solution and carrying out heat treatment; adding the heat treated carbon nanotubes and cationic surfactants in metal plating solution including metal or metal salt and dispersing the carbon nanotubes; and providing a cathode and an anode in the metal plating solution including the carbon nanotubes and the cationic surfactant, to which current is applied and carrying out electroplating in order to obtain metal/carbon nanotube nano-composite(complex material).
摘要翻译：本文公开了一种使用电镀制造金属/碳纳米管纳米复合材料的方法，更具体地说，涉及一种金属/碳纳米管纳米复合材料的制造方法，其特征在于，包括：在包括金属或金属盐的金属电镀溶液中添加碳纳米管和阳离子表面活性剂，在阴极进行电镀。根据本发明，使用电镀制造金属/碳纳米管纳米复合物的方法包括：将碳纳米管浸入酸溶液中并过滤溶液并进行热处理; 将热处理的碳纳米管和阳离子表面活性剂加入包括金属或金属盐在内的金属电镀溶液中并分散碳纳米管; 并在包括碳纳米管和阳离子表面活性剂的金属电镀溶液中提供阴极和阳极，向其施加电流并进行电镀以获得金属/碳纳米管纳米复合材料（复合材料）。

30. 发明授权

US06902660B2 Method of manufacturing printed circuit board and multi-layered PCB 失效
标题翻译：制造印刷电路板和多层PCB的方法
公开(公告)号：US06902660B2
公开(公告)日：2005-06-07
申请号：US10231052
申请日：2002-08-30
申请人： Hyuek Jae Lee , Jin Yu
发明人： Hyuek Jae Lee , Jin Yu
IPC分类号： H05K3/00 , C25D5/02 , H05K3/20 , H05K3/38 , H05K3/42 , H05K3/46 , C25D1/00
CPC分类号： H05K3/4617 , C25D5/02 , H05K3/205 , H05K3/384 , H05K3/423 , H05K2201/0154 , H05K2203/0733
摘要： Disclosed is a fabrication method of a printed circuit board, consisting of plating a metal on a pattern-formed metallic substrate to form a conductive metal line; forming a polymer layer as a base substrate over the conductive metal line-formed metallic substrate and drying the formed polymer layer; forming a via hole in the polymer layer, followed by plugging the formed via hole by electroplating; and removing the metallic substrate. The method is advantageous in terms of maximum efficiency of use of the surface area of PCB, and fineness and high integration of circuits because of not requiring an additional etching process.
摘要翻译：公开了一种印刷电路板的制造方法，其包括在图案形成的金属基板上镀金属以形成导电金属线; 在导电金属线形金属基材上形成聚合物层作为基底，干燥所形成的聚合物层; 在聚合物层中形成通孔，然后通过电镀将形成的通孔堵塞; 并去除金属基底。该方法在PCB的表面积的最大使用效率以及电路的细度和高集成度方面是有利的，因为不需要另外的蚀刻工艺。

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