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    • 25. 发明申请
    • Image sensor comprising thin film transistor optical sensor having offset region and method of manufacturing the same
    • 图像传感器包括具有偏移区域的薄膜晶体管光学传感器及其制造方法
    • US20050029611A1
    • 2005-02-10
    • US10732320
    • 2003-12-09
    • Jin JangJi HurHyun Nam
    • Jin JangJi HurHyun Nam
    • H01L29/786H01L27/146H01L31/0376H01L31/10H01L31/0232
    • H01L31/0376H01L27/14643H01L27/14658H01L27/14692Y02E10/50
    • The present invention relates to an image sensor comprising an amorphous silicon thin-film transistor optical sensor which functions as an image sensor used for an X-ray photography device, a fingerprint recognition apparatus, a scanner, etc., and a method of manufacturing the image sensor. Since the thin-film transistor optical sensor according to the present invention has a high-resistance silicon region by disposing an offset region in a channel region, a dark leakage current of the optical sensor remains in a low level even under a high voltage. Therefore, it is possible to apply a high voltage to the thin-film transistor optical sensor according to the present invention so that the image senor can be sensitive to a weak light. In addition, since the storage capacitance in the image sensor is formed in a double structure, the image sensor has a high value of capacitance. Furthermore, since a lower common electrode is electrically connected to an upper common electrode, the image sensor has a stable structure.
    • 本发明涉及一种图像传感器,包括用作用于X射线摄影装置的图像传感器,指纹识别装置,扫描仪等的非晶硅薄膜晶体管光学传感器及其制造方法 图像传感器。 由于根据本发明的薄膜晶体管光学传感器通过在沟道区域中设置偏移区域而具有高电阻硅区域,所以即使在高电压下,光学传感器的暗漏电流也保持在低电平。 因此,可以对根据本发明的薄膜晶体管光学传感器施加高电压,使得图像传感器可以对弱光敏感。 此外,由于图像传感器中的存储电容形成为双重结构,所以图像传感器具有高的电容值。 此外,由于下部公共电极与上部公共电极电连接,所以图像传感器具有稳定的结构。
    • 27. 发明授权
    • Method of forming a polycrystalline silicon film
    • 形成多晶硅膜的方法
    • US06451637B1
    • 2002-09-17
    • US09493201
    • 2000-01-28
    • Jin JangSung-Hoon Kim
    • Jin JangSung-Hoon Kim
    • H01L2100
    • C30B1/023C30B29/06
    • The present invention related to a method of forming a polycrystalline silicon film which forms a polysilicon film by crystallizing silicon by means of carrying out plasma exposure and applying an electric field thereon. The present invention includes the steps of forming a metal plasma exposure layer on a substrate wherein the metal plasma exposure layer works as a catalyst for metal induced crystallization, and depositing amorphous silicon on the substrate on which the plasma exposure layer is formed while an electric field is applied thereon. The present invention enables to crystallize the whole film in such a short annealing time less than 10 minutes by forming a metal layer under a silicon layer by plasma particle exposure and, successively, by crystallizing silicon which is being formed under 520° C. And, the present invention reduces metal contamination in the crystallized silicon film as the amount of metal is easy to be controlled by plasma exposure time. Moreover, the present invention enables to form a polysilicon film several &mgr;m thick as it is easy to form polysilicon of which thickness does not matter.
    • 本发明涉及通过进行等离子体曝光和在其上施加电场而使硅结晶而形成多晶硅膜的多晶硅膜的形成方法。 本发明包括在基板上形成金属等离子体曝光层的步骤,其中金属等离子体曝光层用作金属诱导结晶的催化剂,并在其上形成等离子体曝光层的基板上沉积非晶硅,同时电场 施加在其上。 本发明能够通过在等离子体颗粒曝光下在硅层下形成金属层,并且通过在520℃下形成硅来结晶在短的退火时间,使其在短于10分钟的短时间内使整个膜结晶。 本发明通过等离子体曝光时间容易地控制金属的量来减少结晶硅膜中的金属污染。 此外,本发明能够形成几个厚度的多晶硅膜,因为容易形成厚度无关的多晶硅。
    • 29. 发明授权
    • Method of crystallizing an amorphous silicon layer
    • 使非晶硅层结晶的方法
    • US06312979B1
    • 2001-11-06
    • US09299571
    • 1999-04-27
    • Jin JangSoo Young YoonHyun Churl Kim
    • Jin JangSoo Young YoonHyun Churl Kim
    • H01L2100
    • H01L21/02672H01L21/02532H01L21/2022
    • The present invention relates to a method of crystallizing an amorphous silicon layer which is carried out by depositing a crystallization-inducing substance on an amorphous silicon layer on crystallizing the amorphous silicon layer by metal-induced crystallization whereby speed of crystallizing silicon is increased and metal contamination by MIC is reduced. The present invention includes the steps of depositing a crystallizing-induced layer of an induced substance for crystallizing silicon on an amorphous silicon layer wherein the crystallizing induced layer is formed to the thickness under 0.03 angstroms, and treating thermally the amorphous silicon layer on which the crystallizing-induced layer is deposited. In another aspect, the present invention includes the steps of forming a crystallizing-induced substance on an amorphous silicon layer wherein the crystallizing-induced substance has predetermined density on an unit area of the amorphous silicon layer, and treating thermally the amorphous silicon layer on which the crystallizing-induced substance is formed.
    • 本发明涉及一种结晶非晶硅层的方法,该方法是通过在非晶硅层上沉淀结晶诱导物质而进行的,该结晶诱导物质通过金属诱导结晶使非晶硅层结晶,结晶硅的速度增加,金属污染 通过MIC减少。 本发明包括以下步骤:在非晶硅层上沉积用于结晶硅的诱导物质的结晶诱导层,其中结晶诱导层形成为厚度为0.03埃,并且将非晶硅层热处理结晶 被沉积。 另一方面,本发明包括以下步骤:在非晶硅层上形成结晶诱发物质,其中结晶诱发物质在非晶硅层的单位面积上具有预定的密度,并对其上的非晶硅层进行热处理 形成结晶诱发物质。
    • 30. 发明授权
    • Thin film transistor and its fabrication
    • 薄膜晶体管及其制造
    • US6037611A
    • 2000-03-14
    • US980311
    • 1997-11-28
    • Jin JangKyung-Ha Lee
    • Jin JangKyung-Ha Lee
    • H01L27/12H01L21/336H01L29/786H01L29/04H01L29/76
    • H01L29/66757H01L29/78621
    • A method of fabricating a thin film transistor includes the steps of forming an active layer on an insulating substrate; forming an insulating layer and a first metal layer on the active layer; forming a photoresist pattern for forming a gate electrode on the metal layer; etching the metal layer and the insulating layer by using the photoresist pattern as a mask, and respectively forming a gate electrode and a gate insulating layer to expose a part of the active layer; forming an amorphous silicon layer on the resultant whole surface of the substrate; forming a second metal layer on the amorphous silicon layer; patterning the second metal layer and the amorphous silicon layer by a photolithographic process to form an offset layer and a source/drain electrode; and carrying out a lift-off process to remove the photoresist pattern, and exposing the surface on the gate electrode.
    • 制造薄膜晶体管的方法包括在绝缘基板上形成有源层的步骤; 在所述有源层上形成绝缘层和第一金属层; 形成用于在所述金属层上形成栅电极的光致抗蚀剂图案; 通过使用光致抗蚀剂图案作为掩模蚀刻金属层和绝缘层,并分别形成栅极电极和栅极绝缘层以暴露活性层的一部分; 在所得基板的整个表面上形成非晶硅层; 在所述非晶硅层上形成第二金属层; 通过光刻工艺图案化第二金属层和非晶硅层以形成偏移层和源极/漏极; 并进行剥离处理以除去光致抗蚀剂图案,并使栅电极上的表面露出。