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21. 发明授权

US4582556A Adhesion primers for encapsulating epoxies 失效
标题翻译：用于封装环氧树脂的粘合底漆
公开(公告)号：US4582556A
公开(公告)日：1986-04-15
申请号：US615605
申请日：1984-05-31
申请人： Sheldon H. Butt , Edward F. Smith, III , F. Dennis Gyurina
发明人： Sheldon H. Butt , Edward F. Smith, III , F. Dennis Gyurina
IPC分类号： H01L23/29 , H05K3/38 , C09J5/00
CPC分类号： H01L23/293 , H05K3/385 , H01L2924/0002 , Y10T29/49121 , Y10T428/31511
摘要： A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
摘要翻译：提供具有高粘合强度的铜塑料层压板。铜选自铜和铜合金，并且在其表面上具有均匀的玻璃状，基本上无孔的磷酸铜涂层。包含脱模剂的塑料封装材料粘合到铜上。

22. 发明授权

US4570337A Method of assembling a chip carrier 失效
标题翻译：组装芯片载体的方法
公开(公告)号：US4570337A
公开(公告)日：1986-02-18
申请号：US599390
申请日：1984-04-12
申请人： Sheldon H. Butt
发明人： Sheldon H. Butt
IPC分类号： H01L23/14 , H01L23/495 , H05K1/03 , H05K1/05 , H05K3/42 , H05K3/34
CPC分类号： H01L23/142 , H01L23/49537 , H05K1/053 , H01L2224/48227 , H01L2924/09701 , H01L2924/10253 , H05K1/0306 , H05K2201/0382 , H05K2203/068 , H05K3/42 , Y10S228/903 , Y10T29/49144 , Y10T428/12618
摘要： A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have an indentation formed therein for receiving the chip. A metallic circuit pattern for electrical connection to the chip is bonded to the oxide layer and insulated from the copper or copper base alloy by the refractory oxide layer. A seal is provided for enclosing the chip to the indentation. Another embodiment of the invention includes a circuit board structure comprising a circuit board device having a first coefficient of thermal expansion. A chip carrier is provided having a second coefficient thermal expansion of substantially the same value as the first coefficient of thermal expansion. The chip carrier has electrical leads soldered to the circuit board whereby thermal cycling of the circuit board structure does not substantially stress the bond between the solder, leads and circuit board.
摘要翻译：公开了芯片载体和组装芯片载体的工艺。用于安装芯片的载体包括在其表面上具有薄的难熔氧化物层的铜或铜基合金组分。表面和氧化物层在其中形成有用于接收芯片的凹陷。用于电连接到芯片的金属电路图案被结合到氧化物层并且通过难熔氧化物层与铜或铜基合金绝缘。提供用于将芯片封装到压痕的密封件。本发明的另一实施例包括一种包括具有第一热膨胀系数的电路板装置的电路板结构。提供了具有与第一热膨胀系数基本相同的值的第二系数热膨胀的芯片载体。芯片载体具有焊接到电路板的电引线，由此电路板结构的热循环基本上不会压迫焊料，引线和电路板之间的结合。

23. 发明授权

US4569692A Low thermal expansivity and high thermal conductivity substrate 失效
标题翻译：低热膨胀性和高导热性底物
公开(公告)号：US4569692A
公开(公告)日：1986-02-11
申请号：US539449
申请日：1983-10-06
申请人： Sheldon H. Butt
发明人： Sheldon H. Butt
IPC分类号： B22F1/00 , B32B15/01 , B32B15/16 , C04B26/02 , C22C32/00 , H01L23/15 , H01L23/373 , H05K1/03 , H05K1/05 , C22C29/12
CPC分类号： H05K1/05 , B22F1/0003 , B32B15/01 , B32B15/16 , C04B26/02 , C22C32/00 , H01L23/15 , H01L23/3733 , H01L23/3736 , H05K1/0306 , H05K1/0373 , H01L2924/0002 , H01L2924/09701 , H05K2201/0209 , H05K2201/0215 , H05K2201/068 , Y10S428/901 , Y10T428/12014 , Y10T428/12028 , Y10T428/12049 , Y10T428/12181 , Y10T428/125 , Y10T428/12514 , Y10T428/12528 , Y10T428/24942 , Y10T428/31678
摘要： A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.
摘要翻译：提供了一种适用于电子应用的基板的复合材料。复合材料包括具有约-20×10 -7至约50×10 -7 in / in /℃范围内的热膨胀系数的第一材料颗粒。具有在约100×10-7范围内的热膨胀系数的第二材料颗粒至约200×10 -7 in / in /℃与第一材料颗粒混合。粘合剂将第一和第二材料颗粒粘附在约1×10 -7至约50×10 -7 in / in /℃范围内的热膨胀系数的粘结复合材料中。

24. 发明授权

US4480262A Semiconductor casing 失效
标题翻译：半导体外壳
公开(公告)号：US4480262A
公开(公告)日：1984-10-30
申请号：US398497
申请日：1982-07-15
申请人： Sheldon H. Butt
发明人： Sheldon H. Butt
IPC分类号： H01L23/00 , H01L23/047 , H01L23/26 , H05K1/02 , H05K1/18 , H01L21/52 , H01L21/50 , H01L23/10 , H01L23/40
CPC分类号： H05K1/021 , H01L23/047 , H01L23/26 , H01L23/564 , H01L2224/48091 , H01L2224/73265 , H01L2924/01079 , H01L2924/3011 , H05K1/183 , H05K2201/10689
摘要： A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. An adhesive seals and bonds the metal base member and plastic housing member to the lead frame so as to enclose the electrical component.
摘要翻译：用于电气部件的壳体包括具有连接到其上的电气部件的金属引线框架。金属基底构件被结合到引线框架的一个表面。塑料外壳构件结合到引线框架的第二表面。粘合剂将金属基底构件和塑料壳体构件密封并接合到引线框架以封闭电气部件。

25. 发明授权

US3944504A Catalyst for the diminution of automobile exhaust gases 失效
标题翻译：催化剂用于减少汽车废气
公开(公告)号：US3944504A
公开(公告)日：1976-03-16
申请号：US542184
申请日：1975-01-20
申请人： James A. Ford , Sheldon H. Butt
发明人： James A. Ford , Sheldon H. Butt
IPC分类号： B01D53/86 , B01J23/89 , B01J35/02 , B01J21/04 , B01J23/40 , B01J23/74
CPC分类号： B01J35/02 , B01D53/86 , B01J23/892
摘要： A catalyst for the diminution of automobile pollution and a method for forming the catalyst are described. The catalyst comprises a metal alloy substrate having a specified composition, an oxide layer containing a large proportion of alumina on the surface of the alloy and a surface layer comprising from 60 to 100% platinum and from 0 to 40% palladium.
摘要翻译：描述了用于汽车污染减少的催化剂和形成催化剂的方法。催化剂包括具有特定组成的金属合金基材，在合金表面含有大量氧化铝的氧化物层和包含60-100％铂和0-40％钯的表面层。

26. 发明授权

US5024883A Electronic packaging of components incorporating a ceramic-glass-metal composite 失效
标题翻译：包含陶瓷 - 玻璃 - 金属复合材料的组件的电子封装
公开(公告)号：US5024883A
公开(公告)日：1991-06-18
申请号：US407511
申请日：1989-09-14
申请人： Narendra N. SinghDeo , Deepak Mahulikar , Sheldon H. Butt
发明人： Narendra N. SinghDeo , Deepak Mahulikar , Sheldon H. Butt
IPC分类号： A61F2/00 , A61F2/30 , A61F2/36 , C03C14/00 , H01L23/10 , H01L23/15 , H01L23/367 , H01L23/498 , H05K1/03
CPC分类号： H01L23/15 , A61F2/30965 , C03C14/004 , H01L23/10 , H01L23/3677 , H01L23/49805 , H01L23/49861 , A61F2/367 , A61F2002/3631 , A61F2002/368 , A61F2002/3682 , A61F2310/00203 , H01L2224/32188 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/3025 , H05K1/0306 , Y10S428/901 , Y10T428/25 , Y10T428/256
摘要： The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.
摘要翻译：本发明涉及形成用于容纳半导体器件的部件的部件和工艺。这些部件由独特的陶瓷 - 玻璃 - 金属复合材料制成，陶瓷颗粒，金属颗粒和玻璃基体，所述陶瓷和金属颗粒遍布整个分散。金属元件可以嵌入到材料中，以简化诸如半导体封装的器件的制造。

27. 发明授权

US5014159A Semiconductor package 失效
标题翻译：半导体封装
公开(公告)号：US5014159A
公开(公告)日：1991-05-07
申请号：US332912
申请日：1989-04-04
申请人： Sheldon H. Butt
发明人： Sheldon H. Butt
IPC分类号： H01L23/047 , H01L23/14 , H01L23/495 , H05K1/03 , H05K1/05 , H05K3/42
CPC分类号： H01L23/142 , H01L23/047 , H01L23/49537 , H05K1/053 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01014 , H01L2924/01025 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16152 , H05K1/0306 , H05K2201/0382 , H05K2203/068 , H05K3/42
摘要： A semiconductor package for mounting a chip is disclosed. The package includes a first metal or metal alloy component having a first thin refractory oxide layer on a first surface. The chip is bonded to the first component. A skirt extends from the first component for strengthening the first component and providing heat transfer from the semiconductor package. A second metal or metal alloy lead frame having second and third refractory oxide layers on opposite surfaces is electrically connected to the chip and is bonded to the first oxide layer. Also, the lead frame is insulated from the first component by the first and second refractory oxide layers. A second metal or metal alloy component has a fourth refractory oxide layer on one surface and is bonded to the third refractory oxide layer so that the chip is hermetically sealed between the first and second components. Other embodiments of the present invention include both leadless and leaded hermetic semiconductor packages and innovative relationships between the packages and printed circuit boards.
摘要翻译：公开了一种用于安装芯片的半导体封装。该包装包括在第一表面上具有第一薄耐火氧化物层的第一金属或金属合金成分。该芯片与第一部件结合。裙部从第一部件延伸，用于加强第一部件并提供从半导体封装件的热传递。在相对表面上具有第二和第三耐火氧化物层的第二金属或金属合金引线框架电连接到芯片并结合到第一氧化物层。此外，引线框架由第一和第二耐火氧化物层与第一部件绝缘。第二金属或金属合金组分在一个表面上具有第四难熔氧化物层，并且结合到第三难熔氧化物层，使得芯片气密地密封在第一和第二组分之间。本发明的其它实施例包括无引线和有铅密封半导体封装以及封装和印刷电路板之间的创新关系。

28. 发明授权

US4967260A Hermetic microminiature packages 失效
标题翻译：密封微型包装
公开(公告)号：US4967260A
公开(公告)日：1990-10-30
申请号：US188322
申请日：1988-05-04
申请人： Sheldon H. Butt
发明人： Sheldon H. Butt
IPC分类号： H01L23/057 , H01L23/06 , H01L23/495 , H01L23/58
CPC分类号： H01L22/32 , H01L23/057 , H01L23/06 , H01L23/49548 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/49175 , H01L2224/50 , H01L24/45 , H01L24/49 , H01L2924/00014 , H01L2924/01012 , H01L2924/01025 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/16195 , H01L2924/3025
摘要： A hermetic tape package and a process for forming the hermetic tape package are disclosed. The package is capable of high lead densities and occupies a minimum of space. A test frame is incorporated into the package to permit testing of an electronic device prior to sealing the package.
摘要翻译：公开了一种封闭胶带包装和用于形成密封胶带包装的方法。该封装能够具有高引线密度，占用最小的空间。将测试框架结合到包装中以允许在密封包装之前测试电子设备。

29. 发明授权

US4853491A Chip carrier 失效
公开(公告)号：US4853491A
公开(公告)日：1989-08-01
申请号：US781080
申请日：1985-09-27
申请人： Sheldon H. Butt
发明人： Sheldon H. Butt
IPC分类号： H01L23/13 , H01L23/14
CPC分类号： H01L23/13 , H01L23/142 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01025 , H01L2924/09701 , H01L2924/10253 , H01L2924/15153 , H01L2924/15165 , H01L2924/1532 , H01L2924/16195
摘要： A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have an indentation formed therein for receiving the chip. A metallic circuit pattern for electrical connection to the chip is bonded to the oxide layer and insulated from the copper or copper base alloy by the refractory oxide layer. A seal is provided for enclosing the chip to the indentation. Another embodiment of the invention includes a circuit board structure comprising a circuit board device having a first coefficient of thermal expansion. A chip carrier is provided having a second coefficient thermal expansion of substantially the same value as the first coefficient of thermal expansion. The chip carrier has electrical leads soldered to the circuit board whereby thermal cycling of the circuit board structure does not substantially stress the bond between the solder, leads and circuit board.

30. 发明授权

US4851615A Printed circuit board 失效
标题翻译：印刷电路板
公开(公告)号：US4851615A
公开(公告)日：1989-07-25
申请号：US596186
申请日：1984-04-02
申请人： Sheldon H. Butt
发明人： Sheldon H. Butt
IPC分类号： H05K1/03 , H05K1/05 , H05K3/42
CPC分类号： H05K1/053 , H05K1/0306 , H05K2201/0382 , H05K2203/068 , H05K3/42 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144
摘要： A composite comprises a first metal or alloy component having a thin refractory oxide layer on a first surface thereof. A second metal or alloy component has a second thin refractory oxide on the first surface thereof. Means are provided having a closely matched coefficient of thermal expansion to the first and second metal or alloy components for bonding the first and second thin refractory oxide layers and for electrically insulating the first component from the second component whereby thermal stress between the metal or alloy components and the bonding means is substantially eliminated.
摘要翻译：复合材料包括在其第一表面上具有薄的难熔氧化物层的第一金属或合金组分。第二金属或合金组分在其第一表面上具有第二薄耐火氧化物。提供具有与第一和第二金属或合金部件紧密匹配的热膨胀系数的装置，用于将第一和第二薄耐火氧化物层接合并将第一部件与第二部件电绝缘，由此金属或合金部件之间的热应力并且基本上消除了接合装置。

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