专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07232286B2 Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber 失效
公开(公告)号：US07232286B2
公开(公告)日：2007-06-19
申请号：US10404065
申请日：2003-04-02
申请人： Hiroyuki Shinozaki
发明人： Hiroyuki Shinozaki
IPC分类号： B65H1/00 , C23C16/00 , C23F1/00 , F01D11/00
CPC分类号： H01L21/67126 , F16J15/406 , Y10S414/135 , Y10S414/139 , Y10S414/141
摘要： The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage.

22. 发明申请

US20070128364A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD 审中-公开
公开(公告)号：US20070128364A1
公开(公告)日：2007-06-07
申请号：US11615640
申请日：2006-12-22
申请人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： B05D3/00 , B05C5/00 , C23C14/00
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.

23. 发明申请

US20070092651A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
公开(公告)号：US20070092651A1
公开(公告)日：2007-04-26
申请号：US11614224
申请日：2006-12-21
申请人： Hiroyuki Shinozaki , Yasushi Kojima , Shunichi Aiyoshizawa , Kiwamu Tsukamoto
发明人： Hiroyuki Shinozaki , Yasushi Kojima , Shunichi Aiyoshizawa , Kiwamu Tsukamoto
IPC分类号： B05D3/00 , C23C16/52 , C23C14/00
CPC分类号： G03F7/7075 , G03F7/70808 , G03F7/70991 , G03F9/7003 , G03F9/7011 , H01L21/67017 , H01L21/67225 , H01L21/67248 , H01L21/67748 , H01L21/68 , H01L21/681
摘要： A substrate treatment apparatus that treats a substrate under treatment has an interface section, a substrate loading/unloading section, a reduced pressure atmosphere conveyance chamber, and an exposure treatment chamber. The interface section has a conveyance mechanism that can freely load and unload the substrate under treatment from another device into the apparatus or vice versa. The substrate under treatment can be loaded and unloaded into and from the substrate loading/unloading section in one direction by the conveyance mechanism of the interface section. The reduced pressure atmosphere conveyance chamber is disposed adjacent to and perpendicular to the direction of the substrate loading/unloading section and has a conveyance mechanism that conveys the substrate under treatment under a reduced pressure atmosphere. The exposure treatment chamber is disposed adjacent to and in parallel with the direction of the reduced pressure atmosphere conveyance chamber and performs an exposure treatment for the substrate under treatment.

24. 发明授权

US06440320B1 Substrate processing method and apparatus 失效
标题翻译：基板加工方法及装置
公开(公告)号：US06440320B1
公开(公告)日：2002-08-27
申请号：US09684392
申请日：2000-10-10
申请人： Hiroyuki Shinozaki
发明人： Hiroyuki Shinozaki
IPC分类号： B44C122
CPC分类号： B05D1/005 , B05C11/06 , H01L21/31133 , H01L21/312 , H01L21/6715 , Y10S134/902
摘要： A substrate processing method and apparatus capable of uniformly supplying a processing liquid to a substrate surface in substrate processing such as development processing without exerting an influence on the physical properties of the processing liquid and without damaging the substrate. A rotating blade is disposed above the horizontally placed substrate so as to face the substrate. The processing liquid is supplied to the surface of the substrate, and the rotating blade is rotated while being kept out of contact with the processing liquid to induce a gas current. The gas current forms a mass of processing liquid having an internal circulating current on the substrate surface below the rotating blade.
摘要翻译：一种基板处理方法和装置，其能够在诸如显影处理的基板处理中将处理液均匀地供应到基板表面，而不会对处理液体的物理性质产生影响，而不会损坏基板。旋转叶片设置在水平放置的基板上方以面对基板。将处理液体供给到基板的表面，旋转叶片旋转，同时与处理液体保持脱离接触，引起气流。气流形成在旋转叶片下方的基板表面上具有内部循环电流的处理液体。

25. 发明授权

US5935337A Thin-film vapor deposition apparatus 失效
标题翻译：薄膜蒸镀装置
公开(公告)号：US5935337A
公开(公告)日：1999-08-10
申请号：US634847
申请日：1996-04-19
申请人： Noriyuki Takeuchi , Takeshi Murakami , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Masaru Nakaniwa , Naoki Matsuda
发明人： Noriyuki Takeuchi , Takeshi Murakami , Hiroyuki Shinozaki , Kiwamu Tsukamoto , Masaru Nakaniwa , Naoki Matsuda
IPC分类号： C23C16/44 , C23C16/455 , C23C16/52 , C23C16/00
CPC分类号： C23C16/4557 , C23C16/45565 , C23C16/52
摘要： A thin-film vapor deposition apparatus has a reaction casing defining a reaction chamber, a stage for supporting a substrate, the stage being disposed in the reaction chamber, and a shower head supported on the reaction casing in confronting relation to the stage for discharging a material gas toward the substrate on the stage for depositing a thin film on the substrate. A plurality of flow path systems are disposed in various regions of the shower head and the reaction casing for passage therethrough a heating medium to control the temperatures of the regions under the control of a temperature controller.
摘要翻译：薄膜蒸镀装置具有限定反应室的反应壳体，用于支撑基板的台，设置在反应室中的台以及与用于排出反应室的台相对的支撑在反应壳体上的喷头原料气体朝向在基板上沉积薄膜的载物台上的基板。多个流路系统设置在淋浴喷头和反应壳体的各个区域中，用于通过加热介质以控制温度控制器控制下的区域的温度。

26. 发明授权

US5757148A Method of and apparatus for stopping a motor having magnetic bearings 失效
标题翻译：用于停止具有磁性轴承的电动机的方法和装置
公开(公告)号：US5757148A
公开(公告)日：1998-05-26
申请号：US814232
申请日：1997-03-11
申请人： Hiroyuki Shinozaki , Hironobu Yamasaki , Kazunari Nasa
发明人： Hiroyuki Shinozaki , Hironobu Yamasaki , Kazunari Nasa
IPC分类号： F16C32/04 , H02J9/06 , H02P3/24 , H02P1/54
CPC分类号： H02J9/062 , F16C32/0442 , F16C32/0457
摘要： A motor having windings normally energizable by electric power from an AC power supply is stopped in case of an emergency such as a failure of the AC power supply. The motor has a rotor rotatably supported by magnetic bearings out of contact therewith. The windings of the motor are normally energized by a motor driver with the electric power from the AC power supply. When the AC power supply fails, a battery power supply supplies electric power to the windings of the motor to brake the rotor and also to the magnetic bearings to continuously operate the magnetic bearings. A switching controller which includes timers and logic circuit elements controls times to supply the electric power from the battery power supply to the windings of the motor and the magnetic bearings. The switching controller has timers for controlling the times.
摘要翻译：在诸如交流电源的故障的紧急情况下，停止具有通过来自交流电源的电力正常通电的绕组的电动机。电动机具有由与其不接触的磁性轴承可旋转地支撑的转子。电机的绕组通常由电机驱动器通过来自交流电源的电力供电。当交流电源发生故障时，电池电源向电动机的绕组提供电力，以制动转子和磁轴承，以连续运行磁性轴承。包括定时器和逻辑电路元件的开关控制器控制从电池电源向电动机和磁轴承的绕组提供电力的时间。开关控制器具有用于控制时间的定时器。

27. 发明授权

US5729736A Access analysis method and system in parallel data base system 失效
标题翻译：并行数据库系统中的访问分析方法和系统
公开(公告)号：US5729736A
公开(公告)日：1998-03-17
申请号：US660762
申请日：1996-06-10
申请人： Fumio Gomi , Kazutoshi Amano , Tomohiro Sakaue , Hiroyuki Shinozaki , Masahiko Hashimoto , Takafumi Nogami , Shigehiro Hatakeyama , Takenori Iwato
发明人： Fumio Gomi , Kazutoshi Amano , Tomohiro Sakaue , Hiroyuki Shinozaki , Masahiko Hashimoto , Takafumi Nogami , Shigehiro Hatakeyama , Takenori Iwato
IPC分类号： G06F15/16 , G06F9/06 , G06F9/44 , G06F12/00 , G06F15/177 , G06F17/30
CPC分类号： G06F17/30 , Y10S707/99932
摘要： A method and a system for analyzing the operation of a parallel data system are disclosed. The history information of the access executed by a specific processor that has received a request for access to a plurality of data bases connected to a plurality of processors, the ID of the specific processor and the accessed data amount are collected and stored in a memory. The history information is compared with the time assumed from a predetermined time specified for the access to a unit amount of data in data bases, deciding whether the former is reasonable or longer than the latter. The transfer history information for the processor that has transferred an access request to the specific processor executing the access is compared with a predetermined transfer time specified for a unit amount of data, deciding whether the transfer time between the two processors is longer than an assumed transfer time. It is thus possible to determine whether an abnormal condition of the parallel data base system is caused by an internal fault of the processors or due to a defect of the access request transfer path between processors.
摘要翻译：公开了一种用于分析并行数据系统的操作的方法和系统。已经接收到访问连接到多个处理器的多个数据库的请求的特定处理器执行的访问的历史信息，特定处理器的ID和访问的数据量被收集并存储在存储器中。将历史信息与从数据库中访问单位数量的预定时间假定的时间进行比较，判断前者是否合理或长于后者。将已经将访问请求传送到执行访问的特定处理器的处理器的传送历史信息与针对单位数据量指定的预定传送时间进行比较，确定两个处理器之间的传送时间是否长于假定传送时间。因此，可以确定并行数据库系统的异常状况是由处理器的内部故障还是由于处理器之间的访问请求传送路径的缺陷引起的。

28. 发明授权

US08807914B2 Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber 有权
标题翻译：用于操作其的密封装置和方法以及包括真空室的基板处理装置
公开(公告)号：US08807914B2
公开(公告)日：2014-08-19
申请号：US12285489
申请日：2008-10-07
申请人： Hiroyuki Shinozaki
发明人： Hiroyuki Shinozaki
IPC分类号： B65H1/00 , C23C16/00 , C23F1/00 , F01D11/00
CPC分类号： H01L21/67126 , F16J15/406 , Y10S414/135 , Y10S414/139 , Y10S414/141
摘要： The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage.
摘要翻译：本发明提供了一种密封装置，其包括允许第一空间和第二空间之间连通的密封通道，以及分别连接到第一空间和密封通道的抽空管线。用于供给干燥气体的气体供给管线连接到密封通道。

29. 发明申请

US20070111536A1 Substrate treatment apparatus and substrate treatment method 审中-公开
标题翻译：基板处理装置及基板处理方法
公开(公告)号：US20070111536A1
公开(公告)日：2007-05-17
申请号：US11599255
申请日：2006-11-15
申请人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
发明人： Hiroyuki Shinozaki , Norihiro Yamaguchi , Katsuhide Watanabe
IPC分类号： G03C5/00 , B05C13/00 , B05B5/025 , H01L21/31
CPC分类号： H01L21/6831 , H01L21/67259
摘要： A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
摘要翻译：公开了一种基板处理装置。基板处理装置具有静电卡盘机构，接地机构和电子束照射机构。静电吸盘机构静电吸附并保持处理的基板。接地机构自由地接触由静电卡盘机构吸引并保持的处理的处理面上形成的多个膜的规定膜。电子束照射机构利用电子束照射形成在基板的处理面侧的抗蚀剂膜。

30. 发明申请

US20070095791A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
公开(公告)号：US20070095791A1
公开(公告)日：2007-05-03
申请号：US11614367
申请日：2006-12-21
申请人： Hiroyuki Shinozaki , Yasushi Kojima , Shunichi Aiyoshizawa , Kiwamu Tsukamoto
发明人： Hiroyuki Shinozaki , Yasushi Kojima , Shunichi Aiyoshizawa , Kiwamu Tsukamoto
IPC分类号： C03C15/00 , C23F1/00 , C23C16/00 , H01L21/306 , B44C1/22 , C03C25/68
CPC分类号： G03F7/7075 , G03F7/70808 , G03F7/70991 , G03F9/7003 , G03F9/7011 , H01L21/67017 , H01L21/67225 , H01L21/67248 , H01L21/67748 , H01L21/68 , H01L21/681
摘要： A substrate treatment apparatus that treats a substrate under treatment has an interface section, a substrate loading/unloading section, a reduced pressure atmosphere conveyance chamber, and an exposure treatment chamber. The interface section has a conveyance mechanism that can freely load and unload the substrate under treatment from another device into the apparatus or vice versa. The substrate under treatment can be loaded and unloaded into and from the substrate loading/unloading section in one direction by the conveyance mechanism of the interface section. The reduced pressure atmosphere conveyance chamber is disposed adjacent to and perpendicular to the direction of the substrate loading/unloading section and has a conveyance mechanism that conveys the substrate under treatment under a reduced pressure atmosphere. The exposure treatment chamber is disposed adjacent to and in parallel with the direction of the reduced pressure atmosphere conveyance chamber and performs an exposure treatment for the substrate under treatment.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式