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22. 发明专利

GB2448051A Low resistivity joints for joining superconducting wires 未知
公开(公告)号：GB2448051A
公开(公告)日：2008-10-01
申请号：GB0805295
申请日：2008-03-20
申请人： GEN ELECTRIC
发明人： MARTE JUDSON SLOAN , HUANG XIANRUI , LASKARIS EVANGELOS TRIFON , KNUDSEN BRUCE ALAN , RABER THOMAS ROBERT , ZABALA ROBERT JOHN , BRAY JAMES WILLIAM , THOMPSON PAUL SHADFORTH , LOURDEIRO SERGIO PAULO MARTINS , JOHNSON CURTIS ALAN , DECARR SYLVIA MARIE
IPC分类号： H01R4/68
摘要： A low resistivity joint is made between two wires 116, 118, or 152, 154 having superconductive filaments 126, 156, at least one having magnesium diboride filaments. A joint material 168, also including magnesium diboride is used. The filaments may be exposed before joining, and may be welded together, heated and/or compressed. The wires can be used in medical imaging applications.

23. 发明专利

AT309878T 未知
公开(公告)号：AT309878T
公开(公告)日：2005-12-15
申请号：AT00919900
申请日：2000-03-29
申请人： GEN ELECTRIC
发明人： BENZ MARK GILBERT , CARTER WILLIAM THOMAS JR , KNUDSEN BRUCE ALAN , ZABALA ROBERT JOHN
IPC分类号： F01D5/28 , B22D21/00 , B22D23/00 , B22D23/10 , B22D25/02 , B22D27/04 , B22F3/115 , C22B9/18 , C22B9/193 , C23C4/12 , F02C7/00
摘要： A casting system and method for producing a metal casting is provided. The metal casting can comprise a fine-grain, homogeneous microstructure that is essentially oxide- and sulfide-free, segregation defect free, and essentially free of voids caused by air entrapped during solidification of the metal from a liquidus state to a solid state. The casting system can comprise an electroslag refining system; a nucleated casting system; and a cooling system that cools the metal casting so as to cool a liquidus portion of the metal casting. The metal casting is cooled in a manner sufficient to provide a microstructure that comprises a fine-grain, homogeneous microstructure that is essentially oxide- and sulfide-free, segregation defect free, and essentially free of voids caused by air entrapped during solidification from a liquidus state to a solid state.

24. 发明专利

DE69512710D1 未知
公开(公告)号：DE69512710D1
公开(公告)日：1999-11-18
申请号：DE69512710
申请日：1995-05-23
申请人： GEN ELECTRIC
发明人： BENZ MARK GILBERT , JOHNSON NEIL ANTHONY , MURRAY MELISSA LEA , ZABALA ROBERT JOHN , HIBBS LOUIS EMERSON , KNUDSEN BRUCE ALAN
IPC分类号： C22F1/00 , C22C1/00 , C22C27/02 , H01B12/06 , H01B13/00 , H01L39/24

25. 发明专利

DE69125431T2 未知
公开(公告)号：DE69125431T2
公开(公告)日：1997-10-23
申请号：DE69125431
申请日：1991-07-31
申请人： GEN ELECTRIC
发明人： BENZ MARK GILBERT , RUMANER LEE EVAN , KNUDSEN BRUCE ALAN , ZABALA ROBERT JOHN
IPC分类号： H01R43/00 , H01L39/02 , H01R43/02 , H01L39/14
摘要： Superconducting tapes having an inner laminate comprised of a parent-metal layer, a superconductive alloy layer on the parent-metal, a reactive-metal layer, and an outer laminate soldered thereon are joined in a superconducting joint by the method of this invention. The outer laminate is removed to form exposed sections, and the tapes are positioned so that the exposed sections are in contact. A melt zone within the exposed sections where the exposed sections are in contact is melted. The melt zone is at least large enough to provide sufficient parent-metal, superconductive alloy, and reactive-metal to form a melt that resolidifies as a continuous precipitate of the superconductive alloy. The melt resolidifies as a continuous precipitate of the superconductive alloy that is continuous with the superconductive alloy on the superconducting tape. Optionally, sections of the outer laminate material corresponding to the size of the exposed sections are bonded to the outermost surfaces of the joined exposed sections.

26. 发明专利

GB2259882A Apparatus and method for laser joining of superconducting tapes 未知
公开(公告)号：GB2259882A
公开(公告)日：1993-03-31
申请号：GB9220315
申请日：1992-09-25
申请人： GEN ELECTRIC
发明人： JONES MARSHALL GORDON , RUMANER LEE EVAN , BENZ MARK GILBERT , KNUDSEN BRUCE ALAN , ZABALA ROBERT JOHN
IPC分类号： B23K1/005 , H01L39/02
摘要： This invention relates to an apparatus and method for laser joining superconducting tapes 12, 14 by forming an overlap 16 hold between plates 15 (eg of glass) while traversing a heat source such as a laser beam 10 along such overlap to fuse the material in this region. The overlap may initially be soldered to retain the tapes such solder being of similar material to the tapes.

27. 发明专利

DE69926129T2 未知
公开(公告)号：DE69926129T2
公开(公告)日：2006-05-11
申请号：DE69926129
申请日：1999-10-18
申请人： GEN ELECTRIC
发明人： KNUDSEN BRUCE ALAN , CARTER WILLIAM THOMAS , ZABALA ROBERT JOHN , MILLER RUSSELL SCOTT , BENZ MARK GILBERT
IPC分类号： C22B9/00 , C22B9/18 , F27D11/08 , H05B7/102

28. 发明专利

DE60017077T2 未知
公开(公告)号：DE60017077T2
公开(公告)日：2005-12-29
申请号：DE60017077
申请日：2000-03-21
申请人： GEN ELECTRIC
发明人： CARTER WILLIAM THOMAS JR , BENZ MARK GILBERT , MULLER FELIX GUENTER , HUGO FRANZ W , ZABALA ROBERT JOHN , KNUDSEN BRUCE ALAN
IPC分类号： B22D23/10 , C22B9/18

29. 发明专利

DE69512710T2 未知
公开(公告)号：DE69512710T2
公开(公告)日：2000-06-08
申请号：DE69512710
申请日：1995-05-23
申请人： GEN ELECTRIC
发明人： BENZ MARK GILBERT , JOHNSON NEIL ANTHONY , MURRAY MELISSA LEA , ZABALA ROBERT JOHN , HIBBS LOUIS EMERSON , KNUDSEN BRUCE ALAN
IPC分类号： C22F1/00 , C22C1/00 , C22C27/02 , H01B12/06 , H01B13/00 , H01L39/24

30. 发明专利

DE69300994T2 未知
公开(公告)号：DE69300994T2
公开(公告)日：1996-08-14
申请号：DE69300994
申请日：1993-03-18
申请人： GEN ELECTRIC
发明人： ZABALA ROBERT JOHN , KNUDSEN BRUCE ALAN , BENZ MARK GILBERT
IPC分类号： B23K1/00 , B23K1/08 , B23K1/16 , B23K1/19 , B23K3/06 , B23K103/16 , B32B15/01 , C23C2/08 , C23C2/10 , H01B12/06 , H01B13/00 , H01L39/24 , B23K3/00
摘要： An apparatus for solder joining metal tapes to form laminated metal tapes comprises a channel means having a base, and sidewall means extending therefrom to a cover extending over the sidewall means. The sidewall means define converging channels having an entrance end for admitting the tapes spaced apart, and an exit end where facing tape surfaces can come into contact. The sidewall means separate the base and cover by a distance selected to align the tapes in the width dimension. The cover having a first section extending from the exit end, and a second section extending from the first section to the entrance end, the second section being formed with a cavity facing the channel that permits a solder flow therethrough that minimizes accumulation of particles in the channels. A solder duct means mounted on the channel means for directing molten solder into the channels to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes excess solder from tapes passing through the seal means.

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